JPH0448087A - Etching and developing method - Google Patents

Abstract

PURPOSE:To etch or develop the entire surface of a substrate by moving the substrate placed on a conveyor, oscillating a liq. chemical pipeline having a nozzle and an air pipeline having a nozzle and simultaneously injecting the chemical and air. CONSTITUTION:A liq. chemical pipeline 1 having plural nozzles 2 is arranged in plural columns in the traveling direction (to the (a) direction in the figure) of a conveyor 5 for a substrate 4. An air pipeline 6 having nozzles 7 is arranged in plural columns A-F in parallel with the chemical pipeline 1. The chemical pipeline 1 and the air pipeline 6 are oscillated, and the chemical and air are simultaneously injected on the substrate 4 respectively from the nozzles 2 and 7. Consequently, the entire surface of the substrate is uniformly etched or developed.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method of etching printed wiring boards, etc. by spraying a chemical solution, and a method of developing (development can be applied in the same manner as etching, but the explanation will be omitted below. It mainly deals with etching.

[Prior art] Generally, in the etching of printed wiring boards, etc., Japanese Patent Laid-Open No. 49-4
As seen in Publication No. 4944, when spraying a chemical solution,
They are trying to achieve uniform etching by swinging the nozzle piping. In other words, uniform etching is attempted by replacing old chemical solution that accumulates on the substrate (product) with new chemical solution due to the vibration of the nozzle piping. Figure 11(a)(b)
indicates the etching state, 1 is the nozzle piping, 2 is the nozzle, 3 is the reservoir of chemical solution, 4 is the substrate to be etched,
5 is a conveyor.

[Problems to be Solved by the Invention] However, as the size of the substrate 4 increases, the chemical liquid that hits the top surface of the substrate 4 will be transmitted along the surface of the substrate 4, as shown in FIG. 11(a). Since the chemical liquid falls from the edge of the substrate 4, aged chemical liquid tends to accumulate in the central part, and it is easy to replace the chemical liquid with new chemical liquid at the end part. Therefore, etching at the edges is rapid, but etching at the center is slow, resulting in non-uniform etching. Furthermore, on the lower surface of the substrate 4, as shown in FIG.
Since it falls, the aged chemical solution tends to accumulate at the edges, and etching at the edges is slow and etching at the center is rapid, resulting in uneven etching.

The present invention has been made in view of the above points, and an object of the present invention is to provide an etching and developing method that enables uniform etching and development over the entire surface of a substrate.

[Means for Solving the Problems] In order to achieve the above object, the etching and developing method of the present invention includes placing a substrate on a conveyor of an etching device or a developing device, and spraying a chemical solution such as an etching solution or a developer from a chemical solution nozzle. In a method of moving a substrate for etching or development, a chemical liquid pipe having a chemical liquid nozzle for spraying a chemical liquid and an air pipe having an air nozzle for spraying air are oscillated, and the chemical liquid and air are supplied from the chemical liquid nozzle and the air nozzle. It is characterized by injecting simultaneously.

In addition, on the upper surface side of the substrate, the distance between the air nozzle spray port and the substrate surface is shortened, and the air nozzle distribution density is increased as you approach the center from the end in the direction perpendicular to the driving direction of the conveyor. It is also preferable that the spray pressure of the air nozzle is increased or that an air nozzle with a large flow rate is used to spray the air strongly or in large quantities to the substrate.

The following is a list of means for making air hit the substrate strongly or in large quantities on the upper surface side of the substrate.

■ Shorten the distance between the air nozzle spray port and the substrate surface.

■Increase air nozzle distribution density.

■Increase the spray pressure of the air nozzle.

■Use an air nozzle with a large flow rate.

■Combine ■ and ■ above.

■Combine ■ and ■ above.

Combinations other than these may also be used.

Furthermore, on the bottom side of the substrate, the closer you get from the edge in the direction perpendicular to the driving direction of the conveyor to the center, the longer the distance between the air nozzle spray port and the substrate surface, the lower the air nozzle distribution density, and the closer the air nozzle is to the center. It is also preferable to reduce the spray pressure of the nozzle or use an air nozzle with a small flow rate so that a weak or small amount of air hits the substrate.

The following is a list of means for making air weakly or in a small amount hit the substrate on the lower surface side of the substrate.

■' Increase the distance between the air nozzle spray port and the substrate surface.

■'Lower the air nozzle distribution density.

■'Reduce the spray pressure of the air nozzle.

■'Use an air nozzle with a small liquid flow rate.

■′Combine ■′ and ■′ above.

■′Combine ■′ and ■′ above.

[Operation: By swinging and spraying air together with the chemical solution, the air blows away the accumulation of the chemical solution, promotes exchange of the chemical solution, and enables uniform etching and development over the entire surface.

Furthermore, on the upper surface of the substrate, air is applied more strongly or in a larger amount to the center than at the edges to promote exchange of the chemical solution in the center, allowing uniform etching and development over the entire upper surface of the substrate.

Furthermore, on the lower surface of the substrate, air is applied more strongly or in a larger amount to the edges than to the center to promote exchange of the chemical solution at the edges, thereby promoting etching and development over the entire lower surface of the substrate.

[Example] Yu Inumi In this example, the conditions on the upper surface side of the substrate 4 are set as ■, and the conditions on the lower surface side of the substrate 4 are set as ■'. In other words, on the upper surface side of the substrate 4, the distance between the spray port of the air nozzle 7 and the surface of the substrate 4 is shortened as you approach the center from the edge.
On the lower surface side, the distance between the spray port of the air nozzle 7 and the surface of the substrate 4 is made longer as the distance from the end portion to the center portion approaches.

Chemical liquid piping 1 having a plurality of chemical liquid nozzles 2 shown in FIG.
is facing the conveyance direction of the conveyor 5 (direction of arrow A in Figure 1), and has multiple rows of chemical liquid piping 1 (six rows in this example).
They are lined up. The air pipes 6 having the air nozzles 7 are arranged in a plurality of rows (in the case of this embodiment, six rows indicated by symbols A to F) so as to be parallel to the chemical liquid pipe 1. The chemical liquid pipe 1 and the air pipe 6 are configured to inject chemical liquid and air from the chemical liquid nozzle 2 and the air nozzle 7 while swinging.

On the upper surface side of the substrate 4, the lengths of the air nozzles 7 of the air piping 6 indicated by symbols A and F are short as shown in FIG. 2(a).
The distance between the spray port of the air nozzle 7 and the surface of the substrate 4 is as long as 11 (for example, 150 mm). The lengths of the air nozzles 7 of the air piping 6 indicated by symbols B and E are intermediate lengths as shown in FIG. li(
For example, it has an intermediate length (120 mm). This air nozzle 7 is provided via a nozzle extension pipe 8a of intermediate length. The lengths of the air nozzles 7 of the air piping 6 at symbols C and D are long as shown in FIG. ) is shorter. This air nozzle 7 is provided via a long nozzle extension pipe 8b.

Also, on the lower surface side of the board 4, air piping 6 shown by symbols A and F is provided.
Now, as shown in FIG. 2(c), the air nozzle 7 and the substrate 4 are connected.
In the case of the air piping 6, which has a short distance to the surface of l, and is designated by the symbol BE, the distance between the air nozzle 7 and the surface layer of the substrate 4 is 12, which is an intermediate length, as shown in FIG. In the air piping 6 shown in D, the distance between the air nozzle 7 and the surface of the substrate 4 as shown in FIG. 2(a) is ! , and long.

Therefore, when the chemical liquid piping 1 and the air piping 6 are oscillated and the chemical liquid and air are injected from the chemical liquid nozzle 2 and the air nozzle 7, on the upper surface side of the substrate 4, the closer to the center from the edge, the more the air nozzle 7 injects the liquid. The air hits the board 4
On the bottom side, the closer you get from the center to the end, the more air nozzle 7
The air sprayed from the base plate 4 is strongly hit, and the areas where the chemical solution tends to accumulate, both on the top and bottom sides of the substrate 4, are strongly hit by the air, and the aged chemical solution is evenly replaced with new chemical solution, so that the chemical solution is evenly exchanged over the entire surface. Etching is performed.

K Mitsuo 1 In this case, the condition on the upper surface side of the substrate 4 is ``■'', and the condition on the lower surface side of the substrate 4 is ``■''. In other words, on the upper surface side of the substrate 4, the distribution density of the air nozzles 7 increases as you approach the center from the edge, and on the lower surface side of the substrate 4, the distribution density of the air nozzles 7 increases as you approach the center from the edge. It is lower.

FIG. 3 shows the arrangement of the air nozzles 7 on the upper surface side of the substrate 4. As shown in FIG. The air nozzles 7 of the air piping 6 indicated by symbols A and F are arranged at a large pitch, the air nozzles 7 of the air piping 6 indicated by symbols B and E are arranged at an intermediate pitch, and the air piping 6 indicated by symbols C and D are arranged at a large pitch. The pitch at which the nozzles 7 are provided is small.

FIG. 4 shows the arrangement of the air nozzles 7 on the lower surface side of the substrate 4. As shown in FIG. The air nozzles 7 of the air piping 6 indicated by symbols A and F are arranged at a small pitch, the air piping 6 indicated by symbols B and H have an intermediate pitch of air nozzles 7, and the air piping 6 indicated by symbols C and D are arranged at a small pitch. The pitch of the nozzles 7 is large. Therefore, when the chemical liquid piping 1 and the air piping 6 are oscillated and the chemical liquid and air are injected from the chemical liquid nozzle 2 and the air nozzle 7, the pitch of the nozzles 7 is large. , the air jetted from the air nozzle 7 concentrates on the bottom surface of the substrate 4, and the closer it gets from the center to the edge, the more the air jets from the air nozzle 7 hits the bottom surface of the substrate 4. The aged chemical solution is uniformly replaced with a new chemical solution, and etching is performed uniformly over the entire surface.

K Seed 1 In this case, the condition on the upper surface side of the substrate 4 is ``■'', and the condition on the lower surface side of the substrate 4 is ``■''. That is, on the upper surface side of the substrate 4, the spray pressure of the air nozzle 7 is increased as you approach the center from the edge, and on the lower surface side of the substrate 4, the spray pressure of the air nozzle 7 increases as you approach the center from the edge. It is smaller.

On the upper surface side of the substrate 4, the spray pressure from the air nozzle 7 of the air pipe 6 shown by symbols C and D in FIG. 5 is high, for example, 8 kg/cm2. Code B.

The spray pressure from the air nozzle 7 of the air line 6 shown in E is intermediate, for example 4 K g/cm 2 . The spray pressure from the air nozzle 7 of the air pipe 6 indicated by symbols A and F is low, for example, 2K g, /cm2.
It is.

On the lower surface side of the substrate 4, the pressure of the air nozzle 7 of the air pipe 6 indicated by symbols A and F is high, for example, 6 kg/cm
It is 2. The pressure of the air nozzle 7 of the air pipe 6 indicated by symbols B and E is intermediate, for example, 4Kg / cm 2
It is. The pressure of the air nozzle 7 of the air pipe 6 shown by symbols C and D is low, for example, 2 K g/cm 2 .

Therefore, when the chemical liquid piping 1 and the air piping 6 are oscillated to inject the chemical liquid and air from the chemical liquid nozzle 2 and the air nozzle 7, on the upper surface side of the substrate 4, the closer to the center from the edge, the more the air nozzle 7 injects the liquid. The air hits the board 4
On the bottom side of the air nozzle 7
The air sprayed from the substrate 4 is strongly hit, and the aged chemical solution is uniformly replaced with a new chemical solution on both the upper and lower surfaces of the substrate 4, and etching is performed uniformly over the entire surface.

K-tane IL This is the condition where the condition on the upper surface side of the substrate 4 is set to ``■'' and the condition on the lower surface side of the substrate 4 is set to ``■''. In other words, air nozzles 7 with larger flow rates are used on the upper surface side of the substrate 4 as they approach the center from the edges, and air nozzles 7 with smaller flow rates are used on the lower surface side of the substrate 4 as they approach the center from the edges. are using.

On the upper surface side of the substrate 4, the flow rate of the air nozzle 7 of the air pipe 6 shown by symbols C and D in FIG. 6 is large, for example, 101/m.
It is in. The flow rate of the air nozzle 7 of the air pipe 6 shown by symbols B and E is intermediate, for example, 61/min. The flow rate of the air nozzle 7 of the air pipe 6 indicated by symbols A and F is small, for example, 2//min.

On the lower surface side of the substrate 4, the air nozzles 7 of the air piping 6 indicated by symbols A and F have a large flow rate, for example, 81, y m i
It is n. The flow rate of the air nozzle 7 of the air pipe 6 indicated by symbols B and E is intermediate, for example, 51/min.

The flow rate of the air nozzle 7 of the air pipe 6 indicated by symbols C and D is small, for example, 21/min.

Therefore, when the chemical liquid piping 1 and the air piping 6 are oscillated and the chemical liquid and air are injected from the chemical liquid nozzle 2 and the air nozzle 7, on the upper surface side of the substrate 4, the closer the ends are to the center, the more the air nozzle 7 is injecting the liquid. A lot of air hits the board 4.
On the bottom side of the air nozzle 7
A large amount of air is sprayed, and the aged chemical solution is uniformly replaced with a new chemical solution on both the upper and lower surfaces of the substrate 4, and etching is performed uniformly over the entire surface.

5. In this case, the condition on the upper surface of the substrate 4 is ``■'', and the condition on the lower surface side of the substrate 4 is ``■''. In other words, on the upper surface side of the substrate 4, as the end approaches the center, the distance between the spray port of the air nozzle 7 and the surface of the substrate 4 is shortened, and the distribution density of the air nozzle 7 is increased. On the side, the distance between the spray port of the air nozzle 7 and the surface of the substrate 4 is increased and the distribution density of the air nozzle 7 is decreased as the distance from the end portion to the center portion approaches.

On the upper surface side of the substrate 4, as shown in FIG. 7(a), the pitch at which the air nozzles 7 are provided becomes smaller from the air piping 6 at the end to the air piping 6 at the center. Moreover, the distance between the spray port of the air nozzle 7 of the air piping 6 shown by symbols A and F and the substrate 4 is 1 as shown in FIG. 8(a).
1 and long, code B.

The distance between the spray port of the air nozzle 7 of the air piping 6 shown in E and the substrate 4 is a length between 12 and the air nozzle of the air piping 6 shown in C and D as shown in FIG. The distance between the spray port 7 and the substrate 4 is as short as 13, as shown in Fig. 8<c).
2 is 120 mm, and t) is 100 mm.

On the lower surface side of the substrate 4, as shown in FIG.
The pitch at which these are provided is getting larger.

Moreover, the air nozzles 7 of the air piping 6 shown by symbols C and D
The distance between the spray nozzle and the substrate 4 is 1. as shown in FIG. 8(a). The distance between the spray port of the air nozzle 7 of the air piping 6 and the substrate 4 shown by symbols B and H is 12 as shown in FIG. The distance between the spray port of the air nozzle 7 of the air pipe 6 and the substrate 4 is as shown in FIG. 8(c)! , and short.

Therefore, when the chemical liquid piping 1 and the air piping 6 are oscillated and the chemical liquid and air are injected from the chemical liquid nozzle 2 and the air nozzle 7, on the upper surface side of the substrate 4, the closer the ends are to the center, the more the air nozzle 7 is injecting the liquid. The chemical solution hits the substrate 4 more strongly and in a concentrated manner, and the closer it gets from the center to the edge on the bottom side of the substrate 4, the stronger and more concentrated the chemical solution sprayed from the air nozzle 7 hits, causing aging on both the top and bottom sides of the substrate 4. The used chemical solution is uniformly replaced with a new chemical solution, and etching is performed uniformly over the entire surface.

In this case, the conditions for the upper surface of the substrate 4 are set as ■, and the conditions for the lower surface of the substrate 4 are set as ■'. In other words, on the upper surface side of the substrate 4, the distance between the spray port of the air nozzle 7 and the surface of the substrate 4 is shortened and the spray pressure of the air nozzle 7 is increased as you approach the center from the edge, and the lower surface of the substrate 4 On the sides, the distance between the spray port of the air nozzle 7 and the surface of the substrate 4 is increased and the spray pressure of the air nozzle 7 is decreased as the end portion approaches the center.

On the upper surface side of the substrate 4, the distance between the spray port of the air nozzle 7 of the air piping 6 shown by symbols A and F in FIG. 9 and the substrate 4 is as long as l as shown in FIG. B,H
The distance between the spray port of the air nozzle 7 of the air piping 6 shown in FIG. The distance between the mouth and the substrate 4 is as short as e3, as shown in FIG. 10(e). Specifically, 11 is 150mm,
1. is 120 mm, and 13 is 90 mm. Shigamo code A.

The spray pressure from the air nozzle 7 of the air piping 6 shown in F is small, specifically IKg/cm", and the spray pressure from the air nozzle 7 of the air piping 6 shown in symbols B and E is intermediate, specifically IKg/cm". Specifically, the spray pressure from the air nozzle 7 of the air piping 6 shown by symbols C and D is high, specifically 4 Kg/crn2.
cm2.

On the lower surface side of the substrate 4, the distance between the spray port of the air nozzle 7 of the air pipe 6 shown by symbols C and D in FIG. 9 and the substrate 4 is as long as l as shown in FIG. B,E
The distance between the spray port of the air nozzle 7 of the air piping 6 and the substrate 4 shown in FIG.

The distance between the spray port of the air nozzle 7 of the air piping 1 shown in F and the substrate 4 is as short as 1, as shown in FIG. 10(c). The spray pressure from 7 is small, specifically I K
g/cm2, and the spray pressure from the air nozzle 7 of the air piping 6 shown by symbols B and E is intermediate, specifically 2 kg/cm2, and the spray pressure from the air nozzle 7 of the air piping 6 shown by symbols A and F is intermediate. The spray pressure from air nozzle 7 is high;
Specifically, it is 3Kg/cm2.

Therefore, when the chemical liquid piping 1 and the air piping 6 are oscillated and the chemical liquid and air are injected from the chemical liquid nozzle 2 and the air nozzle 7, on the upper surface side of the substrate 4, the closer to the center from the edge, the more the air nozzle 7 injects the liquid. The air hits the board 4
On the bottom side, the closer you get from the center to the end, the more air nozzle 7
The air jetted from the substrate 4 is strongly hit, and the aged chemical solution is uniformly replaced with a new chemical solution on both the upper and lower surfaces of the substrate 4, and etching is performed uniformly over the entire surface.

[Effects of the Invention] As described above, the present invention is capable of simultaneously supplying a chemical liquid and air from a chemical liquid nozzle and an air nozzle while swinging a chemical liquid piping having a chemical liquid nozzle that injects a chemical liquid and an air piping having an air nozzle that injects air. Since it is sprayed, the chemical solution that accumulates on the surface of the substrate is blown away by air, promoting the exchange of aged chemical solution with new chemical solution, and promoting etching and development over the entire surface of the substrate, allowing for uniform etching and development. It is.

In addition, in the invention according to claim 2 of the present invention, on the upper surface side of the substrate, the distance between the spray port of the air nozzle and the substrate surface increases as the distance from the end in the direction perpendicular to the driving direction of the conveyor approaches the center. By shortening the air nozzle, increasing the air nozzle distribution density, increasing the air nozzle spray pressure, or using an air nozzle with a large flow rate, the air can be sprayed under conditions where the air hits the substrate strongly or in large quantities. The more air is applied to the areas on the upper surface of the substrate where the chemical solution tends to accumulate, the stronger or more air is applied to ensure uniform exchange of the chemical solution on the upper surface of the substrate, and the etching and development can be made uniform over the entire surface without unevenness on the upper surface of the substrate. be.

Furthermore, in the invention according to claim 3 of the present invention, on the lower surface side of the substrate, the distance between the spray port of the air nozzle and the substrate surface increases as the distance from the end in the direction perpendicular to the driving direction of the conveyor approaches the center. By making the air nozzle longer, lowering the air nozzle distribution density, lowering the spray pressure of the air nozzle, or using an air nozzle with a lower flow rate, the air is sprayed under conditions where weak or small amounts of air hit the substrate. The more air is applied to the lower surface of the substrate where the chemical solution tends to accumulate, the stronger or more air is applied to ensure uniform exchange of the chemical solution on the lower surface of the substrate, and the etching and development on the lower surface of the substrate is performed uniformly over the entire surface without variation. .

[Brief explanation of drawings]

FIG. 1 is a plan view explaining Embodiment 1 of the present invention, and FIG. 2 (
i) (bHe) is a front view illustrating the distance between the spray port of the air nozzle and the substrate as above, FIG. 5th plan view showing the nozzle arrangement on the lower surface side of the substrate in Example 2;
The figure is a plan view for explaining Example 3 of the same as above, FIG. 6 is a plan view for explaining Example 4 of same as above, and FIG. Figure, Figure 7 (
b) is a plan view showing the nozzle arrangement on the lower surface side of the substrate in Example 5 same as above, and FIGS. 8(a), (b), and (c) are Example 5 same as above.
FIG. 9 is a front view illustrating the distance between the spray port of the air nozzle and the substrate; FIG. 9 is a plan view illustrating the sixth embodiment of the same;
Figures 0 (a), (b), and (c) are front views illustrating the distance between the air nozzle spray port and the substrate in Example 6, and Figures 11 (a) and 11 (b) illustrate the problems of the conventional example. 1 is a cross-sectional view, 1 is a chemical liquid pipe, 2 is a chemical liquid nozzle, 4 is a substrate, and 6 is a cross-sectional view.
is an air pipe, and 7 is an air nozzle. Agent Patent Attorney Ishi 1) Head 7 2 Figure 5 Figure 6 Chemical liquid piping (a) Figure 3 Figure 4 Figure 7 Figure 8 (b) Figure 9 Figure 10 Figure 11 (b)

Claims (1)

[Scope of Claims] [1] A method of etching or developing by placing a substrate on a conveyor of an etching device or a developing device and moving the substrate while spraying a chemical solution of an etching solution or a developer from a chemical solution nozzle. An etching and developing method characterized in that a chemical solution and air are simultaneously injected from a chemical solution nozzle and an air nozzle while swinging a chemical solution piping having a chemical solution nozzle that injects chemical solution and an air pipe having an air nozzle that injects air. [2] On the upper surface side of the substrate, the distance between the air nozzle spray port and the substrate surface is shortened, and the air nozzle distribution density is increased as you approach the center from the edge in the direction perpendicular to the driving direction of the conveyor. The etching and developing method according to claim 1, characterized in that the air is sprayed under conditions such that the air hits the substrate strongly or in large quantities by increasing the spray pressure of the air nozzle or using an air nozzle with a large flow rate. . [3] On the bottom side of the substrate, the distance between the air nozzle spray port and the substrate surface is made longer and the air nozzle distribution density is made lower as the distance from the edge in the direction perpendicular to the driving direction of the conveyor approaches the center. 2. The etching and developing method according to claim 1, wherein the air is sprayed under conditions such that a weak or small amount of air hits the substrate by reducing the spray pressure of the air nozzle or using an air nozzle with a small flow rate.