JPH0447963Y2 - - Google Patents

Info

Publication number
JPH0447963Y2
JPH0447963Y2 JP1983124726U JP12472683U JPH0447963Y2 JP H0447963 Y2 JPH0447963 Y2 JP H0447963Y2 JP 1983124726 U JP1983124726 U JP 1983124726U JP 12472683 U JP12472683 U JP 12472683U JP H0447963 Y2 JPH0447963 Y2 JP H0447963Y2
Authority
JP
Japan
Prior art keywords
terminal
substrate
conductive substrate
semiconductor
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983124726U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6033441U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983124726U priority Critical patent/JPS6033441U/ja
Publication of JPS6033441U publication Critical patent/JPS6033441U/ja
Application granted granted Critical
Publication of JPH0447963Y2 publication Critical patent/JPH0447963Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires

Landscapes

  • Wire Bonding (AREA)
JP1983124726U 1983-08-11 1983-08-11 半導体装置 Granted JPS6033441U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983124726U JPS6033441U (ja) 1983-08-11 1983-08-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983124726U JPS6033441U (ja) 1983-08-11 1983-08-11 半導体装置

Publications (2)

Publication Number Publication Date
JPS6033441U JPS6033441U (ja) 1985-03-07
JPH0447963Y2 true JPH0447963Y2 (fr) 1992-11-12

Family

ID=30284217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983124726U Granted JPS6033441U (ja) 1983-08-11 1983-08-11 半導体装置

Country Status (1)

Country Link
JP (1) JPS6033441U (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308265A (ja) * 2000-04-21 2001-11-02 Toyota Industries Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111054A (en) * 1980-12-27 1982-07-10 Toshiba Corp Semiconductor device
JPS5893361A (ja) * 1981-11-30 1983-06-03 Mitsubishi Electric Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111054A (en) * 1980-12-27 1982-07-10 Toshiba Corp Semiconductor device
JPS5893361A (ja) * 1981-11-30 1983-06-03 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPS6033441U (ja) 1985-03-07

Similar Documents

Publication Publication Date Title
US5075759A (en) Surface mounting semiconductor device and method
JPS62108552A (ja) 電力用半導体モジユ−ル
JPH064595Y2 (ja) ハイブリッドｉｃ
JPH03169062A (ja) 半導体装置
US4314270A (en) Hybrid thick film integrated circuit heat dissipating and grounding assembly
US3728589A (en) Semiconductor assembly
JPH09321216A (ja) 電力用半導体装置
JPH0447963Y2 (fr)
JP3308713B2 (ja) 電子機器
JPH03132101A (ja) 表面実装型半導体デバイスおよび方法
EP0181975B1 (fr) Dispositif semi-conducteur comprenant un corps de support
JPH0617317Y2 (ja) 混成集積回路の接続構造
JPS6130286Y2 (fr)
JP2587722Y2 (ja) 半導体装置
JPH0342685Y2 (fr)
JPH0451476Y2 (fr)
JPH0222998Y2 (fr)
JPH0452998Y2 (fr)
JPH0451488Y2 (fr)
JPS6314467Y2 (fr)
JP2514430Y2 (ja) ハイブリッドｉｃ
JPS629740Y2 (fr)
JPH0260237U (fr)
JPS5861652A (ja) 半導体装置
JPH033339A (ja) 半導体装置