JPH0447739Y2 - - Google Patents
Info
- Publication number
- JPH0447739Y2 JPH0447739Y2 JP1986006698U JP669886U JPH0447739Y2 JP H0447739 Y2 JPH0447739 Y2 JP H0447739Y2 JP 1986006698 U JP1986006698 U JP 1986006698U JP 669886 U JP669886 U JP 669886U JP H0447739 Y2 JPH0447739 Y2 JP H0447739Y2
- Authority
- JP
- Japan
- Prior art keywords
- drive
- glass substrate
- liquid crystal
- crystal display
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 30
- 239000011521 glass Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 26
- 239000004973 liquid crystal related substance Substances 0.000 claims description 20
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986006698U JPH0447739Y2 (US07714131-20100511-C00038.png) | 1986-01-21 | 1986-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986006698U JPH0447739Y2 (US07714131-20100511-C00038.png) | 1986-01-21 | 1986-01-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62118266U JPS62118266U (US07714131-20100511-C00038.png) | 1987-07-27 |
| JPH0447739Y2 true JPH0447739Y2 (US07714131-20100511-C00038.png) | 1992-11-11 |
Family
ID=30789455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986006698U Expired JPH0447739Y2 (US07714131-20100511-C00038.png) | 1986-01-21 | 1986-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447739Y2 (US07714131-20100511-C00038.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2574369B2 (ja) * | 1988-03-07 | 1997-01-22 | 松下電器産業株式会社 | 半導体チップの実装体およびその実装方法 |
| JP2826049B2 (ja) * | 1992-11-18 | 1998-11-18 | 松下電子工業株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59189626U (ja) * | 1984-03-15 | 1984-12-15 | セイコーエプソン株式会社 | 腕時計用液晶表示装置 |
-
1986
- 1986-01-21 JP JP1986006698U patent/JPH0447739Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62118266U (US07714131-20100511-C00038.png) | 1987-07-27 |
