JPH0447295U - - Google Patents
Info
- Publication number
- JPH0447295U JPH0447295U JP9045590U JP9045590U JPH0447295U JP H0447295 U JPH0447295 U JP H0447295U JP 9045590 U JP9045590 U JP 9045590U JP 9045590 U JP9045590 U JP 9045590U JP H0447295 U JPH0447295 U JP H0447295U
- Authority
- JP
- Japan
- Prior art keywords
- metal core
- coupling member
- coupling
- conductor
- core substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 11
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の外観図、第２図は
第１図の要部の断面拡大図、第３図は第１図及び
第２図の実施例の嵌合状態の説明図、第４図は金
属筐体のプリント基板収納説明図、第５図は第４
図に本考案を適用した場合の金属筐体の裏面構成
図、第６図は従来の放熱構造の一例を示す構成図
である。
１……金属コア基板、２……金属コア、３……
積層膜、４……第１結合部材、５……挾持部、６
……結合ピン、７……第２結合部材、８……バネ
嵌合部、９……結合片、１０……取り付け基板。
Fig. 1 is an external view of one embodiment of the present invention, Fig. 2 is an enlarged sectional view of the main part of Fig. 1, and Fig. 3 is an explanatory diagram of the fitted state of the embodiment of Figs. 1 and 2. , Figure 4 is an explanatory diagram of the printed circuit board storage in the metal casing, and Figure 5 is the illustration of the printed circuit board storage in the metal case.
FIG. 6 is a configuration diagram of the rear surface of a metal casing to which the present invention is applied, and FIG. 6 is a configuration diagram showing an example of a conventional heat dissipation structure. 1...Metal core substrate, 2...Metal core, 3...
Laminated film, 4... First coupling member, 5... Holding part, 6
... Connection pin, 7 ... Second connection member, 8 ... Spring fitting part, 9 ... Connection piece, 10 ... Mounting board.
Claims (1)
形成された金属コア基板と、 一端が該金属コア基板の端面を挾持するように
コ字形に形成されて金属コア基板の端面に固着さ
れ、他端にはガイドピンを兼ねた棒状の結合ピン
が形成された導体よりなる第１の結合部材と、 有底筒状に形成されて開口端の内部には前記第
１の結合部材の結合ピンが着脱可能に嵌め合うバ
ネ嵌合部が形成され、底部の裏面には結合片が形
成された導体よりなる第２の結合部材と、 該第２の結合部材が貫通固着される取り付け基
板、 とで構成されたことを特徴とする金属コア基板接
続構造。[Claims for Utility Model Registration] A metal core substrate in which an insulating film and a conductive pattern are laminated on the surface of a metal core, and a metal core substrate formed in a U-shape with one end sandwiching the end surface of the metal core substrate. a first coupling member made of a conductor, which is fixed to the end face of the conductor, and has a bar-shaped coupling pin that also serves as a guide pin formed at the other end; A spring fitting part is formed in which the coupling pin of the coupling member is removably fitted, and a second coupling member made of a conductor is formed with a coupling piece on the back surface of the bottom part, and the second coupling member is fixedly fixed through the second coupling member. A metal core board connection structure characterized by comprising: a mounting board for mounting; and a metal core board connection structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9045590U JP2506608Y2 (en) | 1990-08-29 | 1990-08-29 | Metal core board connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9045590U JP2506608Y2 (en) | 1990-08-29 | 1990-08-29 | Metal core board connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0447295U true JPH0447295U (en) | 1992-04-22 |
| JP2506608Y2 JP2506608Y2 (en) | 1996-08-14 |
Family
ID=31825225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9045590U Expired - Lifetime JP2506608Y2 (en) | 1990-08-29 | 1990-08-29 | Metal core board connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2506608Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6297227B1 (en) | 2016-06-03 | 2018-03-20 | オリンパス株式会社 | Board connection structure |
-
1990
- 1990-08-29 JP JP9045590U patent/JP2506608Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2506608Y2 (en) | 1996-08-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0447295U (en) | ||
| JPH02142599U (en) | ||
| JPS5972739U (en) | heat dissipation fin | |
| JPS63134591U (en) | ||
| JPS5935021Y2 (en) | Printed circuit board mounting equipment | |
| JPS5993198U (en) | shield case | |
| JPS6059582U (en) | Power supply structure | |
| JPS585320U (en) | inductance element | |
| JPH01174990U (en) | ||
| JPS5822765U (en) | printed wiring circuit | |
| JPS6130961U (en) | Battery storage structure of terminal equipment | |
| JPS63170964U (en) | ||
| JPH0466776U (en) | ||
| JPS5962682U (en) | Relay terminal | |
| JPS59152815U (en) | piezoelectric vibrator | |
| JPS6315094U (en) | ||
| JPS5877076U (en) | Printed board | |
| JPH0470760U (en) | ||
| JPS58129661U (en) | hybrid integrated circuit board | |
| JPH0480097U (en) | ||
| JPS6262486U (en) | ||
| JPS6078188U (en) | Display element circuit board | |
| JPS5937739U (en) | Mounting structure of hybrid integrated circuit | |
| JPS6418792U (en) | ||
| JPS60123973U (en) | Terminal structure of electrical equipment |