JPH0446950A - Phenol resin molding material - Google Patents

Phenol resin molding material

Info

Publication number
JPH0446950A
JPH0446950A JP15608090A JP15608090A JPH0446950A JP H0446950 A JPH0446950 A JP H0446950A JP 15608090 A JP15608090 A JP 15608090A JP 15608090 A JP15608090 A JP 15608090A JP H0446950 A JPH0446950 A JP H0446950A
Authority
JP
Japan
Prior art keywords
resin molding
molding material
phenol resin
phenolic resin
heat resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15608090A
Other languages
Japanese (ja)
Inventor
Takanori Kushida
孝則 櫛田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15608090A priority Critical patent/JPH0446950A/en
Publication of JPH0446950A publication Critical patent/JPH0446950A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To improve strengths, heat resistance, and abrasion resistance by mixing a specific compd. into the title material. CONSTITUTION:A phenol resin is mixed with 20-70wt.% compd. of the formula 3MgO.2SiO2.2H2O, a filler or a reinforcement, and required amts. of a curing agent, a colorant, a mold lubricant, a surfactant, etc. The mixture is kneaded, pulverized, and granulated to give the title material.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は自動車部品用、電気機械部品用、OA事務機部
品用、電子部品用、音響機器部品用、熱器具部品用等に
用いられるフェノール樹脂成形材料に関するものである
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to phenol used for automobile parts, electromechanical parts, OA office machine parts, electronic parts, audio equipment parts, heating appliance parts, etc. This invention relates to resin molding materials.

〔従来の技術〕[Conventional technology]

従来、高強度、耐熱性、耐摩耗性のフェノール樹脂成形
品を得るにはアスベストをフェノール樹脂成形材料に含
有させていたが、アスベストはアスベスト規制のため使
用が困難になっている。この為、アスベスト代替材料と
してガラス繊維や無機粉末充填剤が用いられているが、
前者は耐熱性、強度は満足するが耐摩耗性が極端に低下
し、後者は耐摩耗性はよいが耐熱性、強度が低い欠点が
あった。
Conventionally, in order to obtain phenolic resin molded products with high strength, heat resistance, and abrasion resistance, asbestos was included in phenolic resin molding materials, but asbestos regulations have made it difficult to use asbestos. For this reason, glass fiber and inorganic powder fillers are used as substitute materials for asbestos.
The former has satisfactory heat resistance and strength, but has extremely low abrasion resistance, and the latter has good abrasion resistance, but has low heat resistance and strength.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来の技術で述べたようにアスベスト代替材料による高
強度、耐熱性、耐摩耗性フェノール樹脂成形品は一長一
短があった。本発明は従来の技術における上述の問題点
に鑑みてなされたもので、その目的とするところは高強
度、耐熱性、耐摩耗性のフェノール樹脂成形品が得られ
るフェノール樹脂成形材料を捉供することにある。
As mentioned in the section on conventional technology, high-strength, heat-resistant, and wear-resistant phenolic resin molded products made from asbestos substitute materials have advantages and disadvantages. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide a phenolic resin molding material from which phenolic resin molded products with high strength, heat resistance, and wear resistance can be obtained. It is in.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は一般式〔1〕で示される化合物を含有したこと
を特徴とするフェノール樹脂成形材料のため、上記目的
を達成することができたもので、以下本発明の詳細な説
明する。
The present invention is a phenolic resin molding material characterized in that it contains a compound represented by the general formula [1], thereby achieving the above object.The present invention will be described in detail below.

3MgO ・23 i 0z ・2Hz O式(1)本
発明に用いる3MgO・2SiO□ ・2H。
3MgO ・23 i 0z ・2Hz O formula (1) 3MgO ・2SiO□ ・2H used in the present invention.

Oは一般にクリソタイルと称されるもので形状は好まし
くは葉片形及び板状であることが望ましい、添加量は特
に限定するものではないが好ましくは全量の2O〜70
重量%(以下単に%と記す)であることが望ましい。即
ち2O%未満では高強度、耐熱性が向上し難く、70%
をこえると外観が低下する傾向にあるからである。フェ
ノール樹脂としてはフェノール、クレゾール等のフェノ
ール系化合物とホルムアルデヒド等のアルデヒド化合物
とからなるノボラック型及びレゾール型フェノール樹脂
である。クリソタイル以外の充填剤又は補強材としては
必要に応じて木粉、布チップ、綿粉、ガラス繊維、炭酸
カルシウム、水酸化アルミニウム、クレー、タルク、シ
リカ等のような有機、無機物の繊維、チップ、粉末を用
いることができる。必要に応じて添加される硬化剤、着
色剤、離型剤、界面活性剤等については特に限定するも
のではなく、フェノール樹脂成形材料に用い得るものを
そのまま用いることができる。これら配合材料を混合、
混焼、粉砕し、必要に応じて造粒し成形材料とするもの
である。
O is generally referred to as chrysotile, and its shape is preferably leaf-shaped or plate-like.The amount added is not particularly limited, but is preferably 2O to 70% of the total amount.
It is preferable that the amount is expressed in weight% (hereinafter simply referred to as %). That is, if it is less than 20%, it is difficult to improve high strength and heat resistance, and 70%
This is because the appearance tends to deteriorate when the amount exceeds . The phenol resins include novolac type and resol type phenol resins, which are composed of phenol compounds such as phenol and cresol, and aldehyde compounds such as formaldehyde. As fillers or reinforcing materials other than chrysotile, organic or inorganic fibers and chips such as wood flour, cloth chips, cotton flour, glass fibers, calcium carbonate, aluminum hydroxide, clay, talc, silica, etc. may be used as necessary. Powders can be used. There are no particular limitations on the curing agent, coloring agent, mold release agent, surfactant, etc. that may be added as needed, and those that can be used in the phenolic resin molding material can be used as they are. Mix these compounded materials,
It is co-fired, pulverized and, if necessary, granulated to form a molding material.

以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.

実施例1及び2と比較例1乃至3 第1表の配合表にもとづいて配合、 してフェノール樹脂成形材料を得た。Examples 1 and 2 and Comparative Examples 1 to 3 Mixed based on the combination table in Table 1, A phenolic resin molding material was obtained.

混焼、粉砕 実施例1及び2と比較例1乃至3の成形材料を成形圧力
225 kg/C11l、金型温度160°Cで2分間
圧縮成形して得た成形品の性能は第2表のようである。
The performance of the molded products obtained by compression molding the molding materials of Examples 1 and 2 and Comparative Examples 1 to 3 at a molding pressure of 225 kg/C11l and a mold temperature of 160°C for 2 minutes is shown in Table 2. It is.

第 表 〔発明の効果〕 本発明は上述した如く構成されている。特許請求の範囲
に記載した構成を有するフェノール樹脂成形材料におい
てはその成形品の強度、耐熱性、耐摩耗性が向上する効
果がある。
Table 1 [Effects of the Invention] The present invention is constructed as described above. The phenolic resin molding material having the structure described in the claims has the effect of improving the strength, heat resistance, and abrasion resistance of the molded product.

Claims (1)

【特許請求の範囲】[Claims] (1)一般式〔1〕で示される化合物を含有したことを
特徴とするフェノール樹脂成形材料。 3MgO・2SiO_2・2H_2O式〔1〕
(1) A phenolic resin molding material characterized by containing a compound represented by the general formula [1]. 3MgO・2SiO_2・2H_2O formula [1]
JP15608090A 1990-06-14 1990-06-14 Phenol resin molding material Pending JPH0446950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15608090A JPH0446950A (en) 1990-06-14 1990-06-14 Phenol resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15608090A JPH0446950A (en) 1990-06-14 1990-06-14 Phenol resin molding material

Publications (1)

Publication Number Publication Date
JPH0446950A true JPH0446950A (en) 1992-02-17

Family

ID=15619864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15608090A Pending JPH0446950A (en) 1990-06-14 1990-06-14 Phenol resin molding material

Country Status (1)

Country Link
JP (1) JPH0446950A (en)

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