JPH0446948A - Phenol resin molding material - Google Patents
Phenol resin molding materialInfo
- Publication number
- JPH0446948A JPH0446948A JP15608190A JP15608190A JPH0446948A JP H0446948 A JPH0446948 A JP H0446948A JP 15608190 A JP15608190 A JP 15608190A JP 15608190 A JP15608190 A JP 15608190A JP H0446948 A JPH0446948 A JP H0446948A
- Authority
- JP
- Japan
- Prior art keywords
- phenol resin
- molding material
- resin molding
- boiling water
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 17
- 239000012778 molding material Substances 0.000 title claims description 12
- 238000009835 boiling Methods 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000010521 absorption reaction Methods 0.000 claims abstract description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 9
- 229920001568 phenolic resin Polymers 0.000 claims description 9
- 239000000463 material Substances 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 abstract 1
- 239000000314 lubricant Substances 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 241001311547 Patina Species 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- -1 phenol compound Chemical class 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は自動車部品用、電気機械部品用、ＯＡ事務機部
品用、電子部品用、音響機器部品用、熱器具部品用等に
用いられるフェノール樹脂成形材料に関するものである
。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides phenol used for automobile parts, electromechanical parts, OA office machine parts, electronic parts, audio equipment parts, heating appliance parts, etc. This invention relates to resin molding materials.
従来、フェノール樹脂成形材料から得られるフェノール
樹脂成形品はその優れた電気絶縁性、耐熱性、機械強度
により広く用いられているが、トランス等のコイルボビ
ンに用いた場合に断線、緑青発生があり、信較性を更に
要求されていた。Conventionally, phenolic resin molded products obtained from phenolic resin molding materials have been widely used due to their excellent electrical insulation, heat resistance, and mechanical strength, but when used in coil bobbins such as transformers, wire breakage and patina occur. Further reliability was required.
従来の技術で述べたようにフェノール樹脂成形品をトラ
ンス等のコイルボビンに用いると断線、緑青発生がある
。この原因はフェノール樹脂成形品の電食性が比較的低
いことにある。本発明は従来の技術における上述の問題
点に鑑みてなされたもので、その目的とするところは電
食性のよし１成形品が得られるフェノール樹脂成形材料
を提供することにある。As described in the prior art section, when a phenolic resin molded product is used in a coil bobbin for a transformer or the like, wire breakage and patina occur. The reason for this is that the electrolytic corrosion resistance of phenolic resin molded products is relatively low. The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a phenolic resin molding material from which molded products with good electrolytic corrosion resistance can be obtained.
Ｌ問題点を解決するための手段〕
本発明は成形材料の成形品煮沸吸水率が０．６重量％（
以下単に％と記す）以下であることを特徴とするフェノ
ール樹脂成形材料のため、電食性を向上させることがで
き、断線、緑青発生を防止することができたもので、以
下本発明の詳細な説明する。Means for Solving the L Problem] The present invention provides a molded product having a boiling water absorption rate of 0.6% by weight (
This is a phenolic resin molding material characterized by having a chemical resistance of less than explain.
本発明では成形材料の成形品煮沸吸水率を０．６％以下
にすることが必要なため、材料中の吸水成分量を減少さ
せたり、均質混練により配合材表面に樹脂を均一被覆す
る手段等を採用することができる。フェノール樹脂とし
てはフェノール、クレゾール等のフェノール系化合物と
ホルムアルデヒド等のアルデヒド化合物とからなるノボ
ラック型及び又はレゾール型フェノール樹脂を用いるこ
とができ、更にフェノール樹脂はエポキシ変性、アミノ
変性等の変性フェノール樹脂であってもよい、充填剤又
は補強材としては木粉、布チップ、綿粉、ガラス繊維、
炭酸カルシウム、水酸化アルミニウム、クレー、タルク
、シリカ等のような有機、無機物の繊維、チップ、粉末
を用いることができる。必要に応じて添加される効果剤
、着色剤、離型剤、界面活性剤等については特に限定す
るものではなく、フェノール樹脂成形材料に用い得るも
のをそのまま用いることができる。これら配合材料を混
合、混線、粉砕し、必要に応じて造粒し成形材料とする
ものである。In the present invention, it is necessary to reduce the boiling water absorption rate of the molded material to 0.6% or less, so there are measures such as reducing the amount of water-absorbing components in the material and uniformly coating the surface of the compounded material with resin by homogeneous kneading. can be adopted. As the phenol resin, a novolac type and/or resol type phenol resin consisting of a phenol compound such as phenol or cresol and an aldehyde compound such as formaldehyde can be used. Furthermore, the phenol resin can be a modified phenol resin such as an epoxy-modified or amino-modified phenol resin. Fillers or reinforcing materials that may be present include wood flour, cloth chips, cotton flour, glass fiber,
Organic and inorganic fibers, chips, and powders such as calcium carbonate, aluminum hydroxide, clay, talc, silica, etc. can be used. There are no particular limitations on the effect agents, colorants, mold release agents, surfactants, etc. that may be added as needed, and those that can be used in phenolic resin molding materials can be used as they are. These compounded materials are mixed, mixed, pulverized, and, if necessary, granulated to form a molding material.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例及び比較例
第１表の配合表にもとづいて配合、混練、粉砕してフェ
ノール樹脂成形材料を得た。Examples and Comparative Examples Phenol resin molding materials were obtained by blending, kneading, and pulverizing based on the formulation table in Table 1.
注
＊１白石カルシウム株式会社製 白艷華ＤＤ＊２白石カ
ルシウム株式会社製 沈降製カルシウム実施例及び比較
例の成形材料を成形圧力２２５ｋｇ／ｃ＋Ｊ、金型温度
１６０℃で２分間圧縮成形して得た成形品の性能は第２
表のようである。Note *1 Shiraishi Calcium Co., Ltd. Shiraika DD *2 Shiroishi Calcium Co., Ltd. Precipitated Calcium Molding obtained by compression molding the molding materials of Examples and Comparative Examples at a molding pressure of 225 kg/c+J and a mold temperature of 160°C for 2 minutes. Product performance is second
It looks like a table.
第 ２ 表
＊ ＪＩＳ−Ｋ・６９１１に準拠
〔発明の効果〕
本発明は上述した如く構成されている。特許請求の範囲
に記載した構成を有するフェノール樹脂成形材料におい
てはその成形品の電食性が向上する効果がある。Table 2 * Based on JIS-K 6911 [Effects of the Invention] The present invention is constructed as described above. The phenolic resin molding material having the structure described in the claims has the effect of improving the electrolytic corrosion resistance of the molded product.
Claims (1)
であることを特徴とするフェノール樹脂成形材料。(1) A phenolic resin molding material characterized in that the boiling water absorption rate of the molding material is 0.6% by weight or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15608190A JPH0446948A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15608190A JPH0446948A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446948A true JPH0446948A (en) | 1992-02-17 |
Family
ID=15619884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15608190A Pending JPH0446948A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446948A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8847217B2 (en) | 2010-11-24 | 2014-09-30 | Panasonic Corporation | Organic EL panel, display device using same, and method for producing organic EL panel |
-
1990
- 1990-06-14 JP JP15608190A patent/JPH0446948A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8847217B2 (en) | 2010-11-24 | 2014-09-30 | Panasonic Corporation | Organic EL panel, display device using same, and method for producing organic EL panel |
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