JPH0446947A - Phenol resin molding material - Google Patents
Phenol resin molding materialInfo
- Publication number
- JPH0446947A JPH0446947A JP15607890A JP15607890A JPH0446947A JP H0446947 A JPH0446947 A JP H0446947A JP 15607890 A JP15607890 A JP 15607890A JP 15607890 A JP15607890 A JP 15607890A JP H0446947 A JPH0446947 A JP H0446947A
- Authority
- JP
- Japan
- Prior art keywords
- resin molding
- molding material
- ion content
- phenol resin
- phenolic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 15
- 239000012778 molding material Substances 0.000 title claims description 12
- 239000000463 material Substances 0.000 claims abstract description 9
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims abstract description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 13
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 12
- -1 Chlorine ions Chemical class 0.000 claims description 3
- 239000000460 chlorine Substances 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- 150000002500 ions Chemical class 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 239000003456 ion exchange resin Substances 0.000 abstract description 2
- 229920003303 ion-exchange polymer Polymers 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000002516 radical scavenger Substances 0.000 abstract description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 abstract 1
- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
- 241001311547 Patina Species 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は自動車部品用、電気機械部品用、OA事務機部
品用、電子部品用、音響機器部品用、熱器具部品用等に
用いられるフェノール樹脂成形材料に関するものである
。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to phenol used for automobile parts, electromechanical parts, OA office machine parts, electronic parts, audio equipment parts, heating appliance parts, etc. This invention relates to resin molding materials.
従来、フェノール樹脂成形材料から得られるフェノール
樹脂成形品はその優れた電気絶縁性、耐熱性、機械強度
により広く用いられているが、トランス等のコイルボビ
ンに用いた場合に断線、緑青発生があり、信転性を更に
要求されていた。Conventionally, phenolic resin molded products obtained from phenolic resin molding materials have been widely used due to their excellent electrical insulation, heat resistance, and mechanical strength, but when used in coil bobbins such as transformers, wire breakage and patina occur. More credibility was required.
従来の技術で述べたようにフェノール樹脂成形品をトラ
ンス等のコイルボビンに用いると断線、緑青発生がある
。この原因はフェノール樹脂成形品の電食性が比較的低
いことにある。本発明は従来の技術における上述の問題
点に鑑みてなされたもので、その目的とするところは電
食性のよい成形品が得られるフェノール樹脂成形材料を
提供することにある。As described in the prior art section, when a phenolic resin molded product is used in a coil bobbin for a transformer or the like, wire breakage and patina occur. The reason for this is that the electrolytic corrosion resistance of phenolic resin molded products is relatively low. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a phenolic resin molding material that allows molded products with good electrolytic corrosion resistance to be obtained.
本発明は材料中の塩素イオンと硫酸イオンとが夫々60
ppm以下であることを特徴とするフェノール樹脂成形
材料のため、電食性を向上さセることかでき、断線、緑
青発生を防止することができたもので、以下本発明を説
明する。In the present invention, the chloride ions and sulfate ions in the material are each 60%
Since the phenolic resin molding material is characterized by having a content of ppm or less, it is possible to improve electrolytic corrosion resistance and prevent wire breakage and occurrence of patina, and the present invention will be described below.
本発明は材料中の塩素イオンと硫酸イオンとが夫々60
ppm以下であることを特徴とするフェノール樹脂成形
材料のため、電食性を向上させることができ、断線、緑
青発生を防止することができたもので、以下本発明の詳
細な説明する。In the present invention, the chloride ions and sulfate ions in the material are each 60%
Since the phenolic resin molding material is characterized by having a content of ppm or less, it can improve electrolytic corrosion and prevent wire breakage and occurrence of patina.The present invention will be described in detail below.
本発明は材料中の塩素イオンと硫酸イオンとが夫々60
ppm以下にすることが必要なため、塩素イオンと硫酸
イオンの少ない配合材料を用いる必要があり、含有量の
多い配合材料についてはイオン交換樹脂、イオン補足剤
等で前処理してお(必要がある。フェノール樹脂として
はフェノール、クレゾール等のフェノール系化合物とホ
ルムアメデヒド等のアルデヒド化合物とからなるノボラ
ック型及び又はレゾール型フェノール樹脂を用いること
ができ、更にフェノール樹脂はエポキシ変性、アミノ変
性等の変性フェノール樹脂であってもよい、充填剤又は
補強材としては木粉、布チップ、綿粉、ガラス繊維、炭
酸カルシウム、水酸化アルミニウム、クレー、タルク、
シリカ等のような有機、無機物の繊維、チップ、粉末を
用いることができる。必要に応じて添加される硬化剤、
着色剤、離型剤、界面活性剤等については特に限定する
ものではなく、フェノール樹脂成形材料に用い得るもの
をそのまま用いることができる。これら配合材料を混合
、混練、粉砕し、必要に応じて造粒し成形材料とするも
のである。In the present invention, the chloride ions and sulfate ions in the material are each 60%
ppm or less, it is necessary to use compounded materials with low chlorine ions and sulfate ions, and compounded materials with high contents should be pretreated with ion exchange resins, ion scavengers, etc. As the phenolic resin, novolac type and/or resol type phenolic resins consisting of phenolic compounds such as phenol and cresol and aldehyde compounds such as formamide can be used. Fillers or reinforcing materials which may be modified phenolic resins include wood flour, cloth chips, cotton flour, glass fibers, calcium carbonate, aluminum hydroxide, clay, talc,
Organic or inorganic fibers, chips, or powders such as silica can be used. Curing agent added as needed,
There are no particular limitations on colorants, mold release agents, surfactants, etc., and those that can be used in phenolic resin molding materials can be used as they are. These compounded materials are mixed, kneaded, pulverized, and, if necessary, granulated to form a molding material.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例1及び2と比較例
第1表の配合表にもとづいて配合、混練、粉砕してフェ
ノール樹脂成形材料を得た。実施例についてはイオン補
足剤で処理して塩素イオン、硫酸イオン量を調整し2種
類とし、実施例1及び2を得た。A phenolic resin molding material was obtained by blending, kneading, and pulverizing based on the formulation table of Examples 1 and 2 and Comparative Example Table 1. In Examples, two types were obtained by treating with an ion scavenger to adjust the amounts of chloride ions and sulfate ions, and obtain Examples 1 and 2.
以下余白
実施例1及び2と比較例の成形材料を成形圧力225
kg/c+fl、金型温度160°Cで2分間圧縮成形
して得た成形品の性能は第2表のようである。Below, the molding materials of Examples 1 and 2 and Comparative Example were molded under a molding pressure of 225.
Table 2 shows the performance of the molded product obtained by compression molding at kg/c+fl for 2 minutes at a mold temperature of 160°C.
第
表
〔発明の効果〕
本発明は上述した如く構成されている。特許請求の範囲
に記載した構成を有するフェノール樹脂成形材料におい
てはその成形品の電食性が向上する効果がある。Table 1 [Effects of the Invention] The present invention is constructed as described above. The phenolic resin molding material having the structure described in the claims has the effect of improving the electrolytic corrosion resistance of the molded product.
Claims (1)
pm以下であることを特徴とするフェノール樹脂成形材
料。(1) Chlorine ions and sulfate ions in the material are each 60p
A phenolic resin molding material characterized by having a content of pm or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15607890A JPH0446947A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15607890A JPH0446947A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0446947A true JPH0446947A (en) | 1992-02-17 |
Family
ID=15619826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15607890A Pending JPH0446947A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0446947A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6794078B1 (en) | 1999-12-06 | 2004-09-21 | Hitachi Chemical Company, Ltd. | Fuel cell, fuel cell separator, and method of manufacture thereof |
-
1990
- 1990-06-14 JP JP15607890A patent/JPH0446947A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6794078B1 (en) | 1999-12-06 | 2004-09-21 | Hitachi Chemical Company, Ltd. | Fuel cell, fuel cell separator, and method of manufacture thereof |
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