JPH0446555U - - Google Patents
Info
- Publication number
- JPH0446555U JPH0446555U JP1990087703U JP8770390U JPH0446555U JP H0446555 U JPH0446555 U JP H0446555U JP 1990087703 U JP1990087703 U JP 1990087703U JP 8770390 U JP8770390 U JP 8770390U JP H0446555 U JPH0446555 U JP H0446555U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- semiconductor chip
- package
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990087703U JPH0446555U (enExample) | 1990-08-22 | 1990-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990087703U JPH0446555U (enExample) | 1990-08-22 | 1990-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446555U true JPH0446555U (enExample) | 1992-04-21 |
Family
ID=31820298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990087703U Pending JPH0446555U (enExample) | 1990-08-22 | 1990-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446555U (enExample) |
-
1990
- 1990-08-22 JP JP1990087703U patent/JPH0446555U/ja active Pending