JPH0444701U - - Google Patents
Info
- Publication number
- JPH0444701U JPH0444701U JP8718790U JP8718790U JPH0444701U JP H0444701 U JPH0444701 U JP H0444701U JP 8718790 U JP8718790 U JP 8718790U JP 8718790 U JP8718790 U JP 8718790U JP H0444701 U JPH0444701 U JP H0444701U
- Authority
- JP
- Japan
- Prior art keywords
- side wall
- integrated circuit
- frequency package
- microstrip lines
- microwave integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Description
第１図、第２図は、この考案の一実施例による
高周波パツケージの外観形状と同高周波パツケー
ジ同士の接続とを示す図、第３図、第４図は、こ
の考案の他の一実施例による高周波パツケージの
外観形状と同高周波パツケージ同士の接続とを示
す図、第５図、第６図は、従来の高周波パツケー
ジの外観形状と、同高周波パツケージ同士の接続
とを示す図である。
図において、１は金属ケース、２はセラミツク
基板、３はマイクロストリツプ線路、５は金リボ
ン、６はねじ穴、７は金属製カバー、８はねじ、
９は側壁である。なお、図中、同一符号は同一、
又は相当部分を示す。
1 and 2 are views showing the external shape of a high-frequency package and connections between the high-frequency packages according to one embodiment of this invention, and FIGS. 3 and 4 are views showing another embodiment of this invention. FIGS. 5 and 6 are diagrams showing the external shape of a conventional high-frequency package and the connections between the same high-frequency packages. In the figure, 1 is a metal case, 2 is a ceramic substrate, 3 is a microstrip line, 5 is a gold ribbon, 6 is a screw hole, 7 is a metal cover, 8 is a screw,
9 is a side wall. In addition, in the figure, the same reference numerals are the same,
or a corresponding portion.
Claims (1)
クロ波集積回路に接続された入出力端子がマイク
ロストリツプ線路で構成された高周波パツケージ
において、上記マイクロストリツプ線路をはさみ
込む様に両側から金属ケースの側壁を突出させ、
かつ、上記側壁部に金属製カバーを設けたことを
特徴とする高周波パツケージ。 In a high-frequency package that has a microwave integrated circuit built-in and whose input/output terminals connected to the microwave integrated circuit are microstrip lines, metal is connected from both sides so as to sandwich the microstrip lines. Make the side wall of the case protrude,
Further, a high frequency package characterized in that a metal cover is provided on the side wall portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8718790U JPH0444701U (en) | 1990-08-21 | 1990-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8718790U JPH0444701U (en) | 1990-08-21 | 1990-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444701U true JPH0444701U (en) | 1992-04-16 |
Family
ID=31819332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8718790U Pending JPH0444701U (en) | 1990-08-21 | 1990-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444701U (en) |
-
1990
- 1990-08-21 JP JP8718790U patent/JPH0444701U/ja active Pending
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