JPH0444411B2 - - Google Patents
Info
- Publication number
- JPH0444411B2 JPH0444411B2 JP2242085A JP2242085A JPH0444411B2 JP H0444411 B2 JPH0444411 B2 JP H0444411B2 JP 2242085 A JP2242085 A JP 2242085A JP 2242085 A JP2242085 A JP 2242085A JP H0444411 B2 JPH0444411 B2 JP H0444411B2
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- solid electrolytic
- electrolytic capacitor
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 18
- 239000007787 solid Substances 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2242085A JPS61181119A (ja) | 1985-02-07 | 1985-02-07 | ヒユ−ズ付き固体電解コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2242085A JPS61181119A (ja) | 1985-02-07 | 1985-02-07 | ヒユ−ズ付き固体電解コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61181119A JPS61181119A (ja) | 1986-08-13 |
| JPH0444411B2 true JPH0444411B2 (ko) | 1992-07-21 |
Family
ID=12082181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2242085A Granted JPS61181119A (ja) | 1985-02-07 | 1985-02-07 | ヒユ−ズ付き固体電解コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61181119A (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298619U (ko) * | 1989-01-24 | 1990-08-06 | ||
| EP3179495B1 (en) * | 2015-12-09 | 2018-05-02 | ABB Schweiz AG | Power capacitor unit for high pressure applications |
-
1985
- 1985-02-07 JP JP2242085A patent/JPS61181119A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61181119A (ja) | 1986-08-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0232868B1 (en) | Fused solid electrolytic capacitor | |
| JP2006278875A (ja) | 固体電解コンデンサ | |
| US6785147B2 (en) | Circuit module | |
| JPH0444411B2 (ko) | ||
| JPH0351964Y2 (ko) | ||
| KR100980155B1 (ko) | 배선 기판, 배선 기판의 제조 방법 및 배선 기판을 이용한전자 부품 | |
| JPH0440855B2 (ko) | ||
| JPH0351965Y2 (ko) | ||
| CN209929256U (zh) | 具有高导热基板的大电流熔断器 | |
| JPS61110419A (ja) | ヒユ−ズ付き固体電解コンデンサ | |
| JPS61160923A (ja) | ヒユ−ズ付き固体電解コンデンサ | |
| JP2567661B2 (ja) | 混成集積回路 | |
| CN110211852B (zh) | 具有高导热基板的大电流熔断器及其制作方法 | |
| CN214848585U (zh) | 封装基板及封装结构 | |
| JP2003257798A (ja) | 樹脂パッケージ型電子部品及びその製造方法 | |
| JP2840293B2 (ja) | Ｔａｂ用テープ及びこれを用いた半導体装置 | |
| JP2756094B2 (ja) | バンプ電極およびバンプ電極を持った部品 | |
| JPH0436105Y2 (ko) | ||
| JPH0351966Y2 (ko) | ||
| JPH0438514Y2 (ko) | ||
| JPS62291113A (ja) | チツプ状固体電解コンデンサ | |
| JPH051065Y2 (ko) | ||
| JPH051066Y2 (ko) | ||
| JP2562589Y2 (ja) | ヒューズ付きチップ状固体電解コンデンサ | |
| JPH046197Y2 (ko) |