JPH0443784Y2 - - Google Patents
Info
- Publication number
- JPH0443784Y2 JPH0443784Y2 JP1986135008U JP13500886U JPH0443784Y2 JP H0443784 Y2 JPH0443784 Y2 JP H0443784Y2 JP 1986135008 U JP1986135008 U JP 1986135008U JP 13500886 U JP13500886 U JP 13500886U JP H0443784 Y2 JPH0443784 Y2 JP H0443784Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- photodetecting element
- package
- light
- photodetector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Description
【考案の詳細な説明】
［産業上の利用分野］
本考案は、赤外線センサ等の光検出素子の回路
基板への取付構造に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a structure for mounting a photodetecting element such as an infrared sensor to a circuit board.
［従来の技術］
従来から赤外線検出装置等の光検出装置におい
ては、検出すべき光を効果的に集光するため、装
置内部に集光ミラーやレンズ等よりなる集光系を
設け、集光系によつて集光された光を光検出素子
によつて受光し、光を検出するものがある。[Prior Art] Conventionally, in light detection devices such as infrared detection devices, in order to effectively focus the light to be detected, a light focusing system consisting of a focusing mirror, a lens, etc. is provided inside the device, and the light focusing system is installed inside the device. Some devices detect light by receiving the light collected by the system using a photodetecting element.
また上述のような構成のものにおいては、集光
系によつて集光された光を光検出素子に効果的に
受光させるためには、光検出素子を所定の角度で
傾斜させて光検出素子の受光面を集光系の焦点に
一致させる必要がある。そのため、従来は集光系
を形成する集光ミラーやレンズ等の曲率や設置位
置等に合せて光検出素子が取付けてある回路基板
自体を所定の角度で傾斜させた状態に設置し、光
検出素子の受光面を集光系の焦点に一致させてい
た。 Furthermore, in the configuration as described above, in order for the photodetecting element to effectively receive the light focused by the condensing system, the photodetecting element must be tilted at a predetermined angle. It is necessary to align the light-receiving surface of the light-receiving surface with the focal point of the condensing system. For this reason, conventionally, the circuit board on which the photodetector is mounted is tilted at a predetermined angle to match the curvature and installation position of the condensing mirrors and lenses that form the condensing system. The light-receiving surface of the element was aligned with the focal point of the condensing system.
［考案が解決しようとする問題点］
しかし、上述の構成においては、回路基板の傾
斜角度を厳密に調整することが難しく、光検出素
子の感度によつては傾斜角度が光検出装置の応答
性に敏感に影響するため、回路基板の設置にかな
りの手間を要し、作業効率を低下させていた。[Problems to be solved by the invention] However, in the above configuration, it is difficult to precisely adjust the tilt angle of the circuit board, and depending on the sensitivity of the photodetector, the tilt angle may affect the response of the photodetector. Because of the sensitive effects on circuit boards, installing circuit boards required considerable effort, reducing work efficiency.
そこで本考案の目的は、回路基板を傾斜するこ
となく、光検出素子を所定の角度に傾斜させた状
態での取付けを容易に高精度なものにすることに
ある。 SUMMARY OF THE INVENTION Therefore, an object of the present invention is to easily and accurately mount a photodetector element at a predetermined angle without tilting the circuit board.
［問題点を解決するための手段］
本考案の特徴は、パツケージの下面から垂下す
る端子ピンを有する光検出素子と、光検出素子が
接続される回路基板と、回路基板に対して光検出
素子を傾斜した姿勢に支持する支持台とからな
り、
支持台は、パツケージと回路基板との間に介在
し、パツケージの下面を受ける傾斜面と端子ピン
の少なくとも一つが貫通する透孔を有していると
ころにある。[Means for Solving the Problems] The features of the present invention include a photodetecting element having a terminal pin hanging down from the bottom surface of the package, a circuit board to which the photodetecting element is connected, and a structure in which the photodetecting element is connected to the circuit board. The support stand is interposed between the package and the circuit board and has an inclined surface for receiving the lower surface of the package and a through hole through which at least one of the terminal pins passes. It's where you are.
［作用］
光検出素子の端子ピンを支持台の透孔に挿入さ
せ、光検出素子のパツケージの下面を支持台の斜
面で受けさせた後、支持台の下面から突出してい
るいる端子ピンを回路基板の回路パターンに接続
することによつて光検出素子が取付けられる。こ
のとき、光検出素子は支持台の傾斜面の傾斜角度
応じて、回路基板に対して傾斜した状態に取付け
られている。[Function] After inserting the terminal pin of the photodetecting element into the through hole of the support base and allowing the bottom surface of the package of the photodetection element to be received by the slope of the support base, connect the terminal pin protruding from the bottom surface of the support base to the circuit. The photodetector element is attached by connecting to the circuit pattern on the board. At this time, the photodetecting element is attached in an inclined state with respect to the circuit board according to the inclination angle of the inclined surface of the support base.
［実施例］
以下、図面を参照して本考案の一実施例につい
て説明する。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.
第１，２図に示されているように、光検出素子
１は、パツケージ１１とパツケージ１１の下面か
ら垂下する３本の端子ピン１２，１３，１４を有
しており、パツケージ１１の上面１１ａは受光面
となつている。第３図に示したように、支持台３
はパツケージ１１の下面を受ける傾斜面３１を有
しており、傾斜面３１上には端子ピン１２が貫通
する透孔が設けられており、側面には端子ピン１
３，１４が嵌合する溝３３，３４が形成されてい
る。また支持台３の下面には回路基板２に穿設さ
れている位置決め孔２１に嵌合する位置決め突起
３５が突設されている。 As shown in FIGS. 1 and 2, the photodetecting element 1 has a package 11 and three terminal pins 12, 13, 14 hanging from the bottom surface of the package 11. is the light-receiving surface. As shown in FIG.
has an inclined surface 31 that receives the lower surface of the package 11, a through hole through which the terminal pin 12 passes is provided on the inclined surface 31, and a through hole through which the terminal pin 12 passes through is provided on the inclined surface 31;
Grooves 33 and 34 into which the parts 3 and 14 fit are formed. Furthermore, a positioning protrusion 35 that fits into a positioning hole 21 formed in the circuit board 2 is protruded from the lower surface of the support base 3 .
そこで光検出素子１を回路基板２に取付けるに
は、先ず、光検出素子１の端子ピン１２を支持台
３の透孔３２に貫通させ、端子ピン１３，１４を
溝３３，３４に嵌合させ、パツケージ１１の下面
を傾斜面３１に対接させる。ついで支持台３の突
起３５を回路基板２の位置決め孔２１に嵌合さ
せ、支持台３を回路基板２上の所定の位置に装着
するとともに、端子ピン１２，１３，１４に回路
基板に穿設されている所定の端子挿入孔を貫通さ
せる。その後、各端子ピンの先端を回路基板の下
面の回路パターン（図示せず）にハンダ付けする
ことにより取付けが終了する。その際、光検出素
子１は回路基板２に対して、支持台３の傾斜面３
１の傾斜角度に応じた傾斜角度をもつて取付けら
れる。 Therefore, in order to attach the photodetecting element 1 to the circuit board 2, first, the terminal pin 12 of the photodetecting element 1 is passed through the through hole 32 of the support base 3, and the terminal pins 13 and 14 are fitted into the grooves 33 and 34. , the lower surface of the package 11 is brought into contact with the inclined surface 31. Next, the protrusions 35 of the support stand 3 are fitted into the positioning holes 21 of the circuit board 2, and the support stand 3 is installed in a predetermined position on the circuit board 2, and the terminal pins 12, 13, 14 are drilled into the circuit board. Pass through the predetermined terminal insertion hole. Thereafter, the attachment is completed by soldering the tip of each terminal pin to a circuit pattern (not shown) on the bottom surface of the circuit board. At that time, the photodetecting element 1 is placed on the inclined surface 3 of the support base 3 with respect to the circuit board 2.
It is installed with an inclination angle corresponding to the inclination angle of 1.
第４図は本考案における光検出素子の取付け構
造を、赤外線検出装置に適用した例を示してい
る。 FIG. 4 shows an example in which the mounting structure of the photodetecting element according to the present invention is applied to an infrared detection device.
赤外線検出装置４の内部には集光ミラー４１が
取付けられており、水平状態に設置された回路基
板２上に赤外線の波長領域に対応した光検出素子
１が支持台３を介して取付けられている。光検出
素子１は上述した取付構造をもつて取付けられ、
支持台３の傾斜面３１の傾斜角度が、光検出素子
１の受光面１１ａが集光ミラー４の焦点に一致す
るように角度設定されているため、回路基板を傾
斜させて設置することなく、集光ミラー４１によ
つて集光された赤外線を効率良く受光することが
できる。 A condensing mirror 41 is installed inside the infrared detection device 4, and a photodetection element 1 corresponding to the infrared wavelength range is installed on a horizontally installed circuit board 2 via a support 3. There is. The photodetecting element 1 is mounted with the above-mentioned mounting structure,
Since the inclination angle of the inclined surface 31 of the support base 3 is set so that the light receiving surface 11a of the photodetecting element 1 coincides with the focal point of the condensing mirror 4, the circuit board can be installed without being inclined. The infrared rays collected by the collector mirror 41 can be efficiently received.
［考案の効果］
以上のように本考案によれば、回路基板を設置
しやすい状態で設置しても、光検出素子を所定の
角度で傾斜させて取付けることができるので、高
い受光効率を容易に得ることができ、作業能率が
向上する。[Effects of the invention] As described above, according to the invention, even if the circuit board is installed in an easy-to-install condition, the photodetecting element can be installed at a predetermined angle, making it easy to achieve high light reception efficiency. can be obtained, improving work efficiency.
図面は本考案の一実施例に関するものであり、
第１図は光検出素子を回路基板に取付けた状態を
示す断面図、第２図は光検出素子の底面図、第３
図は支持台の正面図、第４図は本考案を赤外線検
出装置に適用した例を示す断面図である。
１……光検出素子、２……パツケージ、１２，
１３，１４……端子ピン、２……回路基板、３…
…支持台、３１……透孔、３２……透孔。
The drawings relate to one embodiment of the present invention,
Figure 1 is a sectional view showing the photodetector mounted on a circuit board, Figure 2 is a bottom view of the photodetector, and Figure 3 is a bottom view of the photodetector.
The figure is a front view of the support base, and FIG. 4 is a sectional view showing an example in which the present invention is applied to an infrared detection device. 1...Photodetection element, 2...Package, 12,
13, 14...Terminal pin, 2...Circuit board, 3...
...Support stand, 31...Through hole, 32...Through hole.
Claims (1)
る光検出素子と、上記光検出素子が接続される回
路基板と、上記回路基板に対して上記光検出素子
を傾斜した姿勢に支持する支持台とからなり、 上記支持台は、上記パツケージと上記回路基板
との間に介在し、上記パツケージの下面を受ける
傾斜面と端子ピンの少なくとも一つが貫通する透
孔を有している ことを特徴とする光検出素子の回路基板への取付
構造。[Claims for Utility Model Registration] A photodetecting element having a terminal pin hanging from the bottom surface of a package, a circuit board to which the photodetecting element is connected, and an inclined position of the photodetecting element with respect to the circuit board. a support stand for supporting the package, the support stand being interposed between the package and the circuit board, and having an inclined surface for receiving a lower surface of the package and a through hole through which at least one of the terminal pins passes. A structure for mounting a photodetector on a circuit board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986135008U JPH0443784Y2 (en) | 1986-09-03 | 1986-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986135008U JPH0443784Y2 (en) | 1986-09-03 | 1986-09-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6341729U JPS6341729U (en) | 1988-03-18 |
| JPH0443784Y2 true JPH0443784Y2 (en) | 1992-10-15 |
Family
ID=31036782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986135008U Expired JPH0443784Y2 (en) | 1986-09-03 | 1986-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0443784Y2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58144885U (en) * | 1982-03-26 | 1983-09-29 | 株式会社日立製作所 | Luminous body fixing device |
| JPS60136190U (en) * | 1984-02-20 | 1985-09-10 | 株式会社富士通ゼネラル | light emitting diode holder |
-
1986
- 1986-09-03 JP JP1986135008U patent/JPH0443784Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6341729U (en) | 1988-03-18 |
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