JPH0442967A - Manufacture of solid-state colored image sensing device - Google Patents

Abstract

PURPOSE:To make possible the formation of a solid-state colored image sensing device, which inhibits a phenomenon that penetrating light is scattered and a false signal is generated to the minimum, by a method wherein after the surface of a semiconductor substrate is flattened, a dyed resin film is patterned in a single layer, the regions only of resin film patterns to be dyed are opened and a process for dyeing into a prescribed color is repeated. CONSTITUTION:A flattened layer 2 consisting of a transparent film is formed in the surface of a semiconductor substrate 1 having a photoelectric conversion part and a signal transfer part on its surface. Then, a photosensitive resin is evenly applied on the layer 2 and a prescribed patterning is performed on positions to correspond to pixels to form dyeable transparent resin films 3a, 3b and 3c. Then, a transparent resin film is entirely applied and a first transparent resin film 4 patterned so as to open the colored resin films 3a only is formed. Then, the patterned films 3a are dyed into a magenta. The film 4 remains intact. Then, for dyeing selectively this remaining film 4 in such a way as to cover, a process identical with the above-mentioned process is repeated.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a method for manufacturing a color solid-state imaging device, and particularly to a method for manufacturing a color solid-state imaging device, in particular a method for manufacturing a color filter for color separation directly on the surface of a semiconductor substrate on which a photoelectric conversion section and a signal transfer section are formed. Regarding the method.

2. Description of the Related Art The configuration of a conventional color solid-state imaging device is shown in FIG. This manufacturing method will be explained. First, a flattening layer 12 made of a transparent resin film is formed on the semiconductor substrate 11 in order to flatten the surface of the semiconductor substrate 11 . Next, a photosensitive resin with dyeing properties adjusted by adding dichromate as a crosslinking agent to a membrane material such as gelatin or casein is uniformly applied, and gelatin is applied to two parts of the predetermined photodiode area of the semiconductor substrate 11. Alternatively, after performing predetermined buttering to leave a casein layer, the colored resin layer 13a dyed in the first color is formed by dyeing with a dye having the first spectral characteristics. Next, a transparent film 14 is applied to the entire surface to prevent color mixing. Next, a photosensitive resin film made of the same gelatin or casein as described above is applied to the entire surface and subjected to predetermined buttering, and then dyed with a dye having second spectral characteristics to obtain a colored product that is dyed in a second color. A resin film 13b is formed. Next, in order to prevent color mixture, a transparent film 15 having the same properties as above is applied to the entire surface. By repeating the above process, for example magenta,
Yellow and cyan colored resin layers are formed, and finally a transparent protective film 16 is applied to complete the color solid-state imaging device.

Problems to be Solved by the Invention In such a conventional manufacturing method, the dyed resin film 1 of the top layer
A flattening layer 12, transparent resin films 14 and 15 are under 3c.
Since many transparent layers are stacked, the dyed resin film 13c
The light that has passed through the photodiode is scattered before reaching the photodiode and enters the area around the photodiode and the transfer gate, resulting in false signals, which significantly deteriorates the characteristics of the color solid-state imaging device.

The present invention solves these problems by reducing the number of transparent resin film layers through which incident light passes, suppressing the scattering of the incident light, and preventing the incident light from reaching the photodiode so as not to generate false signals. The object of the present invention is to provide a solid-state imaging device.

Means for Solving the Problem In order to solve this problem, the color solid-state imaging device of the present invention flattens the surface of the semiconductor substrate, then patterns a single layer of resin film to become the dyed resin film of each pixel, and then A transparent film serving as a color mixture prevention film opens only the region of the resin film pattern to be dyed in a predetermined manner, and is dyed in a predetermined color. A color solid-state imaging device is manufactured by repeating the steps of forming a transparent film and dyeing the resin film.

Effect: With this configuration, the conventional multilayer structure in which a colored resin film was formed for each pixel is now applied in a single layer on the top of the flattened semiconductor substrate surface, and each pixel is patterned all at once. , each dyed resin film can have a single layer structure.

Furthermore, since the distance between each dyed resin film and the photodiode can be shortened, it is possible to suppress false signals caused by light incident on areas other than the photodiode section due to diffuse reflection of incident light.

EXAMPLES Hereinafter, examples of the present invention will be described based on the drawings. 1st
FIG. 1(a) to FIG. 1(e) show the manufacturing process of an embodiment of the present invention.

As shown in FIG. 1(a), a flattening layer 2 made of a transparent film is formed on the surface of a semiconductor substrate 1 having a photoelectric conversion section and a signal transfer section (not shown) on the surface by a coating method, and the semiconductor substrate l
flatten the surface as much as possible. The planarization process is repeated one or more times to achieve the desired planarization. Next, a photosensitive resin with dyeing properties adjusted by adding dichromate as a crosslinking agent to a film material such as gelatin or casein as a crosslinking agent is uniformly applied onto the flattening layer 2, and a photosensitive resin corresponding to each pixel is coated. A dyeable transparent resin film 3 is formed by performing predetermined patterning at the position.
Form a, 3b, and 3c. Next, a transparent resin film is applied to the entire surface for selective dyeing, and as shown in FIG. A transparent resin film 4 is formed. Patterning accuracy is colored transparent resin film 3a and 3
It suffices if the pattern is formed between the patterns b and does not necessarily need to match the pattern of the colored resin film. Next, the patterned colored resin film 3a is dyed magenta, for example. The first transparent resin film 4 remains as it is as a color mixture prevention film. Next, in order to cover and selectively dye the remaining first transparent resin film 4, a second transparent resin film 5 is applied to the entire surface, and then a second transparent resin film 5 is applied as shown in FIG. 1(e). Patterning is performed so that only the colored resin film 3b to be dyed in the second color, for example, yellow, is opened. Then dye it yellow. The second transparent resin film 5 is left as is. Similarly, as shown in FIG. 1(d), a third transparent resin film 6 is uniformly applied and patterned, and the dyeable transparent resin film 3c is dyed in a third color, for example, cyan.

By completing the above steps, the colored transparent resin film 3a dyed magenta, the colored transparent resin film 3b dyed yellow, and the colored transparent resin film 3c dyed cyan are formed in a single layer structure. Finally, as shown in FIG. 1(e), a transparent resin film serving as a protective film 7 is applied over the entire structure to complete the color solid-state imaging device.

Effects of the Invention The present invention provides a color filter for color separation and a colored transparent resin film that acts in 12 layers, each of which is a single layer, and one layer of the transparent resin film.
Since the structure is formed in layers close to the semiconductor substrate,
By minimizing the phenomenon of light passing through a colored transparent resin film scattering before reaching the photodiode and irradiating the area around the transfer gate, causing false signals, the color has excellent color reproducibility and image quality. There are seven effects that can provide a solid-state imaging device.

[Brief explanation of drawings]

FIGS. 1A to 1E are cross-sectional views showing the manufacturing process of a color solid-state imaging device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a conventional color solid-state imaging device. 1... Semiconductor substrate, 2... Manual layer,
3a. 3b, 3e...Colored transparent resin film, 4...
- First transparent resin film, 5... Second transparent resin film, 6... Third transparent resin film, 7... Protective film.

Claims (2)

[Claims] (1) A step of applying a transparent resin film to a semiconductor substrate surface to form a flattening layer, a step of applying a colored transparent resin film, and a step of applying a first transparent resin film to the surface of the semiconductor substrate to form a flattening layer, and applying a first transparent resin film to the surface of the semiconductor substrate to form a flattening layer. a first step of exposing the transparent resin film and dyeing it in a first color;
Applying a second transparent resin film while leaving the first transparent resin film,
A color solid-state imaging device comprising a second step of opening first and second transparent resin films stacked together and dyeing them in a second color in order to expose the colored transparent resin film at a predetermined location. Production method. (2) The method for manufacturing a color solid-state imaging device according to claim 1, wherein the first step and the second step are repeated a predetermined number of times.