JPH0442939Y2 - - Google Patents

Info

Publication number
JPH0442939Y2
JPH0442939Y2 JP1987160138U JP16013887U JPH0442939Y2 JP H0442939 Y2 JPH0442939 Y2 JP H0442939Y2 JP 1987160138 U JP1987160138 U JP 1987160138U JP 16013887 U JP16013887 U JP 16013887U JP H0442939 Y2 JPH0442939 Y2 JP H0442939Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit boards
external leads
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987160138U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0165138U (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987160138U priority Critical patent/JPH0442939Y2/ja
Publication of JPH0165138U publication Critical patent/JPH0165138U/ja
Application granted granted Critical
Publication of JPH0442939Y2 publication Critical patent/JPH0442939Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987160138U 1987-10-20 1987-10-20 Expired JPH0442939Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987160138U JPH0442939Y2 (cg-RX-API-DMAC7.html) 1987-10-20 1987-10-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987160138U JPH0442939Y2 (cg-RX-API-DMAC7.html) 1987-10-20 1987-10-20

Publications (2)

Publication Number Publication Date
JPH0165138U JPH0165138U (cg-RX-API-DMAC7.html) 1989-04-26
JPH0442939Y2 true JPH0442939Y2 (cg-RX-API-DMAC7.html) 1992-10-12

Family

ID=31441943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987160138U Expired JPH0442939Y2 (cg-RX-API-DMAC7.html) 1987-10-20 1987-10-20

Country Status (1)

Country Link
JP (1) JPH0442939Y2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2532400Y2 (ja) * 1991-03-22 1997-04-16 富士ゼロックス株式会社 ハイブリットｉｃ

Also Published As

Publication number Publication date
JPH0165138U (cg-RX-API-DMAC7.html) 1989-04-26

Similar Documents

Publication Publication Date Title
JP3907145B2 (ja) チップ電子部品
JP3482702B2 (ja) プラスチックパッケージ内のヒートシンクとして機能する基台
JPH0442939Y2 (cg-RX-API-DMAC7.html)
US5291372A (en) Integral heat sink-terminal member structure of hybrid integrated circuit assembly and method of fabricating hybrid integrated circuit assembly using such structure
JPH05327249A (ja) 電子回路モジュール及びその製造方法
JPH0126111Y2 (cg-RX-API-DMAC7.html)
JPH0635476Y2 (ja) 混成集積回路
JPH0442936Y2 (cg-RX-API-DMAC7.html)
JPS6373694A (ja) 電子回路基板
US5260602A (en) Hybrid integrated-circuit device having an asymmetrical thermal dissipator
JPS61244052A (ja) 半導体装置
JP2544272Y2 (ja) 混成集積回路
JPH0644110Y2 (ja) 半導体装置
JPH01105592A (ja) 混成集積回路の実装方法
JP2854041B2 (ja) 混成集積回路装置
JPH0514516Y2 (cg-RX-API-DMAC7.html)
JPS6242548Y2 (cg-RX-API-DMAC7.html)
JPH0615269U (ja) 混成集積回路装置用リードアレイ
JPS6334287Y2 (cg-RX-API-DMAC7.html)
JPS635248Y2 (cg-RX-API-DMAC7.html)
JPH0534133Y2 (cg-RX-API-DMAC7.html)
JPH0521902Y2 (cg-RX-API-DMAC7.html)
JPH056715Y2 (cg-RX-API-DMAC7.html)
JP2522583Y2 (ja) 放熱フイン付きジヤンパ線ユニツト
JPH0534132Y2 (cg-RX-API-DMAC7.html)