JPH0442936Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and in particular to regulation of the position of external leads of a hybrid integrated circuit.

(B) Prior Art A conventional hybrid integrated circuit consisting of two hybrid integrated circuit boards is, as shown in FIG. Circuit element 2 provided on circuit boards 21 and 22
3, 24, and the first and second hybrid integrated circuit boards 2
External lead 25 led out from one side of 1, 22
and first and second hybrid integrated circuit boards 21 and 22
and a frame 26 that supports the .

The first and second hybrid integrated circuit boards 21 and 22 are made of aluminum substrates with an insulating surface. The first hybrid integrated circuit board 21 is provided with a circuit element 23 that generates little heat, and the second hybrid integrated circuit board 22 is provided with a circuit element 24 that generates heat.
An external lead 25 is horizontally extended from one side of the first and second terminals for connection to an external circuit.
The first and second hybrid integrated circuit boards 21 and 22 are connected by lead wires 27. When the first and second hybrid integrated circuit boards 21 and 22 are fixed together via the frame 26,
A space formed by the side walls of the frame 26 and both ends of the first and second hybrid integrated circuit boards 21, 22 is filled with insulating resin 28 such as epoxy resin to integrate them.

A hybrid integrated circuit as described above is described in Japanese Utility Model Publication No. 55-8316.

(c) Problems to be solved by the invention External leads 25, 25 of the above-mentioned hybrid integrated circuit
Since it is drawn out horizontally, connectors etc. are often used for connection with external circuits. In addition, a hybrid integrated circuit that is mounted on a substrate such as a printed circuit board and connected to an external circuit has a first and a second circuit as shown in Fig. 4.
The external leads 25, 25 are bent at right angles and spaced apart in the same direction. However, the first and second external leads 25, 25 of such a hybrid integrated circuit
Even if they are made thicker to a certain extent to prevent bending, the first and second external leads 30, 30 are inevitably bent during insertion into an automatic machine or during packaging work, and the space between the respective leads 30, 30 is inevitably bent. There was a problem in that the spacing between the two was disturbed, which hindered automatic mounting on a mounting board such as a printed circuit board, and reduced work efficiency.

(d) Means for solving the problem The present invention has been made in view of the above points, and as shown in FIG. 1, the first and second external leads 4 and 5 are bent in the same direction. between the first and second
This problem is solved by inserting a reinforcing member 6 provided with first and second notches 10 and 11 corresponding to the distance between the external leads 4 and 5.

(E) Effect As described above, by inserting the reinforcing member provided with the first and second notches between the first and second external leads, the respective external leads can be The position of the external leads can be regulated, and deviations in the spacing between external leads can be eliminated. Further, the external lead can be reinforced by the reinforcing member.

(F) Embodiments The present invention will be explained in detail below based on the embodiments shown in FIGS. 1 and 2.

As shown in FIGS. 1 and 2, the hybrid integrated circuit of the present invention includes two hybrid integrated circuit boards 1 and 2, a first and a second hybrid integrated circuit board 1,
a circuit element 3 provided on the circuit element 2 and first and second external leads 4 and 5 led out from one side thereof;
a frame body 7 that supports the first and second hybrid integrated circuit boards 1 and 2 at a distance; first and second external leads 4;
5 and a reinforcing member 6 inserted between the two.

The first and second hybrid integrated circuit boards 1 and 2 are made of aluminum with excellent thermal conductivity, and an aluminum oxide film is formed on the surface by anodizing. A conductive path of a desired shape is formed on the first and second hybrid integrated circuit boards 1 and 2, and on the conductive path are circuit elements 3 that generate less heat, such as transistors, chip resistors, and chip capacitors, and power transistors, etc. A conductive pad is formed at one side end of each of the first and second hybrid integrated circuit boards 1 and 2, to which a heat generating circuit element 3 is fixed and a conductive path thereof is extended. First and second external leads 4 and 5 are connected to the external circuit for connection to an external circuit. The first external lead 4 is
After being led out horizontally from the side edge of the hybrid integrated circuit board 1, it is bent at a right angle toward the second hybrid integrated circuit board 2. The second external lead 5 is bent in the same direction as the first external lead 4 so as to be spaced parallel to the bent end of the first external lead 4. a hybrid integrated circuit board 1 provided with external leads 4 and 5;
Resin is injected into the space formed by the frame member 2 and the frame member 7. Further, the first hybrid integrated circuit board 1 and the second hybrid integrated circuit board 2 are held apart by a frame 7.

The features of the present invention are that the first and second external leads 4,
A reinforcing member 6 is disposed at the spaced apart portion of 5.

As shown in FIGS. 1 and 2, the reinforcing member 6 has a protrusion 8 inserted between the first and second external leads 4 and 5.
and the support plate 9 are integrally formed, and the cross-sectional shape is T.
Formed in a mold shape. The support plate 9 is provided with a first notch 10 corresponding to the first external lead 4 and a second notch 11 corresponding to the second external lead 5. 1 external lead 4
A third notch portion 12 is provided for.

By inserting the reinforcing member 6 described above into the spaced apart portion between the first external lead 4 and the second external lead 5, the end of the first external lead 4 is placed within the first notch 10. , the portion of the external lead bent at a right angle is disposed within the third notch 12 . Further, the second external lead 5 is arranged in the second notch 11, and the side surface of the support plate 9 provided with the notch 11 is arranged so as to be in contact with the side surface of the second hybrid integrated circuit board 2. Therefore, deviation in the distance between the first and second external leads 4 and 5 can be completely prevented.

As described above, according to the present invention, the first and second external leads 4 and 5 are bent.
By inserting the reinforcing member 6 having first and second notches 10 and 11 corresponding to the external leads 4 and 5, the first external lead 4 is connected to the second notch at the first notch 10. Since the position of the external lead 5 is restricted by the second notch 11, it is possible to eliminate positional deviations in the distance between the first and second external leads 4 and 5 and the distance between the respective leads.

(g) Effects of the invention As described above, according to the invention, the reinforcement is provided with notches at the same intervals as the intervals between the first and second external leads bent in the same direction. By inserting the member, the position of each external lead is regulated by the notch, which eliminates misalignment of the interval between each external lead, and has the advantage of improving the efficiency of automatic mounting on a mounting board such as a printed circuit board. It is.

Furthermore, since the external leads are held by reinforcing members, they have the advantage of not being bent during packaging work or the like.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a sectional view showing this embodiment, and FIGS. 3 and 4 are sectional views showing a conventional example. 1, 2...first and second hybrid integrated circuit boards,
3... Circuit element, 4, 5... First and second external leads, 6... Reinforcement member, 7... Frame, 8... Projection, 9... Support plate, 10, 11, 12... ...first, second and third notches.

Claims (1)

[Scope of utility model registration request] first and second hybrid integrated circuit boards provided with circuit elements; and bent so as to extend in the same direction from the same side of the first and second hybrid integrated circuit boards and to be located substantially parallel to each other. In a hybrid integrated circuit comprising first and second external leads and a frame for disposing the first and second hybrid integrated circuit boards facing each other and spaced apart from each other, a protrusion formed in a vertical direction and a horizontal A T-shaped reinforcing member integrated with the formed support plate is disposed between the first and second external leads, the first external lead is held in contact with the protrusion, and the first external lead is held in contact with the projection. A hybrid integrated circuit characterized in that end portions of the first and second external leads are arranged and positioned within first and second notches provided in the support plate.