JPH0442935Y2 - - Google Patents
Info
- Publication number
- JPH0442935Y2 JPH0442935Y2 JP1985113209U JP11320985U JPH0442935Y2 JP H0442935 Y2 JPH0442935 Y2 JP H0442935Y2 JP 1985113209 U JP1985113209 U JP 1985113209U JP 11320985 U JP11320985 U JP 11320985U JP H0442935 Y2 JPH0442935 Y2 JP H0442935Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- pin
- socket
- shape
- spherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
〈産業上の利用分野〉
本考案は、ROM等のパツケージングされた集
積回路（以下ICという）パツケージのリードフ
レーム先端の形状に関するものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to the shape of the tip of a lead frame of a packaged integrated circuit (hereinafter referred to as IC) package such as a ROM.
〈従来の技術〉
従来よりICは、第３図に示す如く、半導体回
路モジールがICパツケージ４でパツケージされ
てあり、該半導体回路に接続されてあるリードフ
レーム８よりなつている。該リードフレームの先
端であるICピン９の形状は、第４図の如く基板
への実装を主に目的としているための平板状で鋭
角的な形状になつている。<Prior Art> Conventionally, as shown in FIG. 3, an IC consists of a semiconductor circuit module packaged in an IC package 4, and a lead frame 8 connected to the semiconductor circuit. The shape of the IC pin 9, which is the tip of the lead frame, is a flat, acute-angled shape mainly intended for mounting on a board, as shown in FIG.
〈考案が解決しようとする問題点〉
しかし最近ICをICソケツトへ取り付ける用途
が増大してきているため、このようなICをソケ
ツトへの装着をくり返すと、先端が平板状である
ため、該リードフレームの先端が傷ついたり、場
合によつては、先端が取れてしまつて不良品の発
生する原因となることがしばしばある。<Problems that the invention seeks to solve> However, recently, the use of mounting ICs into IC sockets has been increasing, and when such ICs are repeatedly mounted into sockets, the tips of the ICs are flat, so the leads may be damaged. The leading edge of the frame is often damaged or even detached, resulting in defective products.
〈問題点を解決するための手段〉
本考案は以上の現況に対してなされたものであ
り、ICのリードフレーム先端を球状にすること
により、ICソケツトへの脱着の際の安全性、操
作性が高いICを提供するものである。<Means for Solving the Problems> The present invention was developed in response to the above-mentioned situation, and by making the tip of the IC lead frame spherical, it improves safety and operability when attaching and detaching an IC to an IC socket. It provides a high IC.
〈実施例〉
以下本考案を、一実施例により、図面を参照し
ながら説明する。<Example> The present invention will be described below by way of an example with reference to the drawings.
すなわち本考案では、第１図に示す如く、IC
パツケージ４から出ているICピン６の形状をほ
ぼ球形にしたものである。第３図は、該第１図の
Ａ方向から見た横の断面図であり、先端は、上部
に対して球状に厚みがある形状となつている。 In other words, in this invention, as shown in Figure 1, the IC
The shape of the IC pin 6 protruding from the package 4 is approximately spherical. FIG. 3 is a horizontal cross-sectional view seen from direction A in FIG. 1, and the tip has a spherical shape with a thicker shape than the top.
なお本考案による形状をもつICを受けるICソ
ケツト１０は、第５図に示す如く、ピン受け部１
２内に、弾性力を有するつぼ形をした導電性金属
を設けた形状とすればよい。 The IC socket 10 for receiving an IC having the shape according to the present invention has a pin receiving part 1 as shown in FIG.
2 may have a shape in which a pot-shaped conductive metal having elastic force is provided.
〈作用〉
本考案のICを、このようなICソケツト１０に
装着すれば、ICピン１４の先端の球状になつて
いる所は、ICソケツト１０のピン受け部１２内
のつぼ形をした穴間内いすつぽり挿入されて、安
定性が高まつたものとなる。<Function> When the IC of the present invention is installed in such an IC socket 10, the spherical tip of the IC pin 14 fits between the pot-shaped holes in the pin receiving portion 12 of the IC socket 10. The inner seat is inserted for increased stability.
〈効果〉
ICピンの先端が球状のため、先端をいためる
ことがなく、ICソケツトへの何回もの脱着が着
実に行なうことが可能となる。<Effects> Since the tips of the IC pins are spherical, they can be reliably inserted into and removed from the IC socket many times without damaging the tips.
第１図は本考案のICパツケージを示す説明図、
第３図は従来例を示すICパツケージの説明図、
第２図は本考案のICパツケージのICピンを第１
図のＡ方向から見た断面を示す説明図、第４図
は、第３図のＢ方向から見た所を示す従来のIC
ピンを示す断面の説明図、第５図はICソケツト
の一例を示す断面の説明図。
２……IC、４……ICパツケージ、６，９……
ICピン、８……リードフレーム、１０……ICソ
ケツト、１２……ピン受け部、１４……ICピン
先端部。
Figure 1 is an explanatory diagram showing the IC package of the present invention.
Figure 3 is an explanatory diagram of an IC package showing a conventional example.
Figure 2 shows the IC pins of the IC package of this invention.
An explanatory diagram showing a cross section seen from direction A in the figure, and Fig. 4 is an explanatory diagram showing a cross section seen from direction B in Fig. 3.
FIG. 5 is an explanatory diagram of a cross section showing a pin, and FIG. 5 is an explanatory diagram of a cross section showing an example of an IC socket. 2...IC, 4...IC package, 6,9...
IC pin, 8...Lead frame, 10...IC socket, 12...Pin receiver, 14...IC pin tip.
Claims (1)
平板状のリードフレームにより複数の端子が出て
いるICパツケージにおいて、 該リードフレームの先端形状が全て球状である
ことを特徴とするICパツケージ。[Scope of claim for utility model registration] A semiconductor integrated circuit is packaged,
An IC package in which a plurality of terminals are protruded from a flat lead frame, characterized in that the tips of the lead frames are all spherical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985113209U JPH0442935Y2 (en) | 1985-07-24 | 1985-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985113209U JPH0442935Y2 (en) | 1985-07-24 | 1985-07-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6221546U JPS6221546U (en) | 1987-02-09 |
| JPH0442935Y2 true JPH0442935Y2 (en) | 1992-10-12 |
Family
ID=30994791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985113209U Expired JPH0442935Y2 (en) | 1985-07-24 | 1985-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442935Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4864485A (en) * | 1971-12-13 | 1973-09-06 | ||
| JPS6030529B2 (en) * | 1977-04-28 | 1985-07-17 | 日本コンタクトレンズ製造株式会社 | Molding mold for manufacturing silicone resin contact lenses |
| JPS6057159B2 (en) * | 1976-10-20 | 1985-12-13 | シ−メンス・アクチエンゲゼルシヤフト | MOS semiconductor memory |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5252093U (en) * | 1975-10-13 | 1977-04-14 | ||
| JPS6030529U (en) * | 1983-08-04 | 1985-03-01 | 信英通信工業株式会社 | electronic components |
| JPS6057159U (en) * | 1983-09-24 | 1985-04-20 | 株式会社島津製作所 | Electronic components for through-hole printed circuit boards |
-
1985
- 1985-07-24 JP JP1985113209U patent/JPH0442935Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4864485A (en) * | 1971-12-13 | 1973-09-06 | ||
| JPS6057159B2 (en) * | 1976-10-20 | 1985-12-13 | シ−メンス・アクチエンゲゼルシヤフト | MOS semiconductor memory |
| JPS6030529B2 (en) * | 1977-04-28 | 1985-07-17 | 日本コンタクトレンズ製造株式会社 | Molding mold for manufacturing silicone resin contact lenses |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6221546U (en) | 1987-02-09 |
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