JPH03149783A - Ic socket - Google Patents

Abstract

PURPOSE:To prevent the breakage of the lead of a semiconductor device and suppress the increase of contact resistance by providing a conducting rubber at a contact section with the lead of the semiconductor device, and electrically connecting it to the lead of the semiconductor device. CONSTITUTION:A conducting rubber 3 is filled in the lead 3 of an IC socket, the lead 1 of a semiconductor device is inserted into a fine hole provided at its center section, thus electric conduction is obtained. The face of the lead 2 of the IC socket in contact with the lead 1 of the semiconductor device is made of the conducting rubber 3. Even if the semiconductor device is repeatedly fitted and removed from the IC socket, the lead 1 of the semiconductor device is not broken, the contact area is large, defective contact and the increase of contact resistance are reduced, and electric conduction is easily obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC socket, and more particularly to an IC socket with an improved structure of a portion that comes into contact with a lead of a semiconductor device.

[Conventional technology]

Conventionally, this type of DIP type IC socket has a lead 22 of the IC socket, as shown in FIGS. 3(a) and 3(b).
is composed of two metal plates having spring properties, and the leads 1 of the semiconductor device are pressed so that the metal plates come into contact with each other.
There was electrical continuity.

On the other hand, the J-lead type IC socket is shown in Figure 4(a).
, (b), the IC socket lead 32 has a flat contact surface with the semiconductor lead 11, and has a spring structure that presses the J lead type semiconductor device glue 11 with this flat part. However, the metals were in contact with each other, creating electrical continuity.

[Problem to be solved by the invention]

In the conventional IC socket described above, the leads of the IC socket are made of metal, so attaching and detaching the leads of the semiconductor device to and from the IC socket may damage the leads of the semiconductor device, and since the contact is only partial, the contact portion There is a drawback that contact resistance increases due to wear, making it difficult to establish electrical continuity.

SUMMARY OF THE INVENTION An object of the present invention is to provide an IC socket that does not damage the leads of a semiconductor device and can print an increase in contact resistance.

[Means to solve the problem]

The IC socket of the present invention is electrically connected to the lead of the semiconductor device by providing conductive rubber at the contact portion with the lead of the semiconductor device.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings. FIGS. 1(a) and 1(b) are a sectional view and a partially enlarged sectional view of a first embodiment of the present invention.

The first embodiment is an example of a DIP type IC socket. As shown in FIGS. 1(a) and 1(b), the IC socket lead 2 is filled with conductive rubber 3, and the semiconductor device lead 1 is inserted into the pore provided in the center. This structure provides electrical continuity.

With this structure, the surface of the lead 2 of the IC socket that comes into contact with the lead 1 of the semiconductor device is made of conductive rubber 3, so even if the semiconductor device is repeatedly attached and detached from the IC socket, the semiconductor device remains stable. The lead 1 is not damaged, and since the contact area is increased, contact failure and increase in contact resistance are reduced, and electrical continuity is easily established.

FIGS. 2(a) and 2(b) are a sectional view and a partially enlarged sectional view of a second embodiment of the present invention.

The second embodiment is an example of a J lead type. Figure 2 (a
), (b), a conductive rubber 13 is attached to the contact portion of the lead 12 of the IC socket with the semiconductor lead 11, and by pressing the lead 11 of the semiconductor device onto the conductive rubber 13, The structure provides electrical continuity.

With such a structure, the semiconductor device glue 11
When pressed against the conductive rubber 13, there is an advantage that the elasticity of the conductive rubber 13 prevents deformation of the leads 11 of the semiconductor device and ensures electrical continuity.

In other IC sockets for semiconductor devices of types such as QFP, LCC, and PGA, similar effects can be obtained by providing conductive rubber on the contact surface of the leads of the socket with the leads of the semiconductor device.

〔Effect of the invention〕

As explained above, the present invention provides conductive rubber on the surface of the IC socket lead that comes into contact with the lead of the semiconductor device, thereby preventing damage or deformation of the lead of the semiconductor device, and preventing contact failure and contact. This has the effect of suppressing an increase in resistance.

BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1(a) and (b) are a sectional view and a partially enlarged sectional view of a first embodiment of the present invention, and FIG. 2(a) is a sectional view of a first embodiment of the present invention.

(b) is a sectional view and partially enlarged sectional view of the second embodiment of the present invention, and FIGS. 3(a) and (b) are conventional DIP type I
FIGS. 4(a) and 4(b) are a sectional view and a partially enlarged sectional view of an example of a conventional J-lead type IC socket.

1.11.1 Semiconductor device lead, 2,12°22.3
2.--IC socket lead, 3,13.--.Conductive rubber.

Claims (1)

[Claims] An IC socket characterized in that a conductive rubber is provided at a contact portion with a lead of a semiconductor device to electrically connect with the lead of the semiconductor device.