JPH11307155A - Electric contact plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the resistance and the inductance between a terminal and an electrode correspondingly connected, and to reduce the loss of the connection and to improve its high frequency characteristics. SOLUTION: Provided for an insulating plate 1 having a predetermined thickness and size, multiple pole-like conductive rubber pieces 2 which are so retained as to penetrate the insulating plate 1 from its one surface to the other surface at positions of the insulating plate 1 corresponding to multiple terminals 301 of a circuit board 300 and multiple electrodes 202 of a semiconductor integrated circuit 200. Metal pieces 3 are formed each of which is so retained as to penetrate the conductive rubber piece 2 from its one surface to the other surface at the central axis of each of the multiple conductive rubber pieces 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an electric contact plate,
In particular, electrical contacts that are pressed and held between a plurality of terminals on the surface of a substrate and a plurality of land-type and bump-type electrodes formed on the surface of an electronic component such as an IC or a circuit board, and correspondingly connect these terminals and electrodes. Belongs to the board.

[0002]

2. Description of the Related Art A plurality of terminals formed on the surface of a substrate such as a printed wiring board are connected to a plurality of electrodes of a land type or a bump type formed on the surface of an electronic component such as an LSI or another circuit board. In this case, a socket or a connector is used. In these sockets and connectors, an electric contact plate which is pressed and held between a plurality of terminals on the surface of a substrate and a plurality of electrodes on the surface of an electronic component and connects the plurality of terminals / electrodes in a corresponding manner is often used.

FIGS. 5A and 5B show a first conventional example of such an electric contact plate. As shown in FIG. 5A, the electrical contact plate 100x of the first example is an insulating plate made of an insulating rubber material having a predetermined thickness and size (similar to that of the semiconductor integrated circuit 200). 1x and this insulating plate 1
x, a plurality of terminals 3 formed on the surface of the circuit board 300
01 and a plurality of thin metal wires 4 penetrating from one surface of the insulating plate 1x to the other surface and corresponding to the plurality of bump-shaped electrodes 202 formed on the surface of the package 201 of the semiconductor integrated circuit 200. And a configuration having the following. The electric contact plate 100x of the first example is used as one configuration of a connector or the like, and as shown in FIG. 5B, a plurality of terminals 301 of the circuit board 300 are determined by a positioning means such as a connector and a pressing means. And the plurality of electrodes 202 of the semiconductor integrated circuit 200 are brought into pressure contact with each other via the thin metal wires 4 to be connected. The diameter of the thin metal wire 4 is usually
The thickness of the insulating plate 1x, that is, the length between the terminal 301 and the electrode 202 is 0.5 to 1.0 mm.
It is about.

FIG. 6 is a sectional view showing a second example of a conventional electric contact plate. The electric contact plate 100y of the second example is
An insulating plate 1y formed of insulating rubber with a predetermined thickness and size, for example, a plurality of terminals 301 of the circuit board 300 and a plurality of electrodes 20 of the semiconductor integrated circuit 200;
2 and a plurality of conductive rubbers 2y penetrating from one surface to the other surface of the insulating plate 1y and held by the insulating plate 1y (connection between substrates). For example, see Japanese Utility Model Application Laid-Open No. 56-91484).

In the electric contact plate 100y of the second example,
The plurality of terminals 301 of the circuit board 300 are connected to the semiconductor integrated circuit 2 by positioning means such as a connector and pressing means.
00 and a plurality of electrodes 202 are brought into pressure contact with each other via the conductive rubber 2y to make corresponding connection. These electric contact plates 100
In x and 100y, coplanarity (a plurality of electrodes and the like are not necessarily on one plane) is absorbed by forming the insulating plates 1x and 1y with an insulating rubber material.

[0006]

In the first example (100x), the above-mentioned conventional electrical contact plate is provided with a plurality of insulating plates 1x made of insulating rubber material at predetermined portions of the insulating plate 1x. The thin metal wires 4 are embedded, and the thin metal wires 4 are pressed and sandwiched between the plurality of terminals 301 of the circuit board 300 and the plurality of electrodes 202 of the semiconductor integrated circuit 200 from both sides. The thickness of the insulating plate 1x is 0.5
Although it is as thin as about 1.0 mm, the diameter of the thin metal wire 4 is several
Since it is as thin as about 0 μm, there is a problem that the resistance value and the inductance value between the terminal 301 and the electrode 202 become large. In the second example (100y), a predetermined portion of the insulating plate 1y made of an insulating rubber material is provided. A plurality of conductive rubbers 2y penetrating the insulating plate 1y are embedded, and these conductive rubbers 2y are pressed and sandwiched from both sides by a plurality of terminals of a circuit board and a plurality of electrodes of a semiconductor integrated circuit. It has a structure to connect between the terminals and electrodes of
The cross-sectional area of the conductive rubber 2y connecting the terminal and the electrode is the first.
Although it is much larger than the thin metal wire 4 of the example, since the conductivity is small, the resistance value between the terminal and the electrode also becomes large, and the high-frequency characteristics are deteriorated. Both examples have a problem in that the insulating plates 1x and 1y and the conductive rubber 2y gradually deteriorate in elasticity (set), and the coplanarity is insufficiently absorbed, thereby lowering the reliability of the connection.

SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, first, the object of the present invention is to reduce the resistance value and the inductance value between correspondingly connected terminals and electrodes, thereby reducing the loss and increasing the high frequency. Characteristics can be improved,
Another object of the present invention is to provide an electric contact plate capable of maintaining high connection reliability.

[0008]

The electric contact plate of the present invention comprises:
An electrical contact plate which is pressed and held between a plurality of terminals formed on a substrate surface and a plurality of land-type or bump-type electrodes formed on an electronic component surface, and correspondingly connects the plurality of terminals and electrodes. In order to achieve the above object, the present invention has the following features. (A) an insulating plate having a predetermined thickness and size (b) a portion of the insulating plate corresponding to a plurality of terminals on the substrate surface and a plurality of electrodes on the electronic component surface; (C) A plurality of pillar-shaped conductive rubbers which are held so as to penetrate from one surface to the other surface. (C) Each end surface of the plurality of conductive rubbers can contact terminals on the substrate surface and electrodes on the electronic component surface. One or a plurality of metal pieces that are held so as to penetrate from one end face to the other end face of these conductive rubbers in an appropriate area.

The insulating plate is made of an insulating rubber material, and each of the plurality of conductive rubbers is configured to protrude from at least one surface of the insulating plate by a predetermined dimension. You. Furthermore, the metal piece is made of an elastic metal material, and has a spring structure that is curved in advance so that the metal piece is easily deformed when pressed from both ends.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention is directed to an insulating plate having a predetermined thickness and size, a plurality of terminals of the insulating plate, and a plurality of terminals of the surface of the electronic component. At a portion corresponding to the plurality of electrodes, a plurality of pillar-shaped conductive rubbers held so as to penetrate the insulating plate from one surface to the other surface, and an end surface of the substrate surface at each end surface of each of the plurality of conductive rubbers A structure having a metal piece held so as to penetrate from one end surface of the conductive rubber to the other end surface in a region where the terminal and the electrode on the surface of the electronic component can contact the electrode;
It has a structure.

With such a configuration and structure,
The terminals and electrodes to be connected can be connected in parallel with both the metal piece and the conductive rubber, and at the same time, the cross-sectional area of the metal piece can be made larger than that of the conventional thin metal wire.
The resistance value and the inductance value between the electrodes can be reduced, the loss between these terminals and the electrodes can be reduced, and the high frequency characteristics can be improved. Furthermore, by increasing the number of metal pieces penetrating the conductive rubber, the resistance and inductance between the correspondingly connected terminals and electrodes can be further reduced, and the high-frequency characteristics can be further improved.

In a second embodiment of the present invention, the metal piece is formed of an elastic metal material, and is configured as a spring structure that is slightly curved in advance so that the metal piece is easily deformed when pressed from both ends. With such a configuration and structure, the coplanarity can be absorbed by the elasticity of the metal piece irrespective of the elastic deterioration (set) of the conductive rubber and the insulating plate, and the spring structure of the metal piece is used. By doing so, it is possible to reduce the contact load to the conductive rubber, etc., to reduce the ratio of the sag, and to secure the pressurized contact connection by the conductive rubber. Connection reliability can be kept high.

[0013]

Next, an embodiment of the present invention will be described with reference to the drawings. FIGS. 1A and 1B are sectional side views showing a first embodiment of the present invention, in which a plurality of terminals of a circuit board and a plurality of electrodes of a semiconductor integrated circuit are connected by an electric contact plate of this embodiment. FIG. 6 is a cross-sectional side view showing a state in which are connected correspondingly. The electrical contact plate 100 according to the first embodiment has a predetermined thickness (for example, about 0.5 to 1.0 mm) and size (for example, about the same as the semiconductor integrated circuit 200), and has insulating rubber. The insulating plate 1 is formed from a material, and at a portion of the insulating plate 1 corresponding to the plurality of terminals 301 of the circuit board 300 and the plurality of electrodes 202 of the semiconductor integrated circuit 200, the insulating plate 1 is moved from one surface to the other. A plurality of pillar-shaped conductive rubbers 2 held so as to penetrate the surface of each of the conductive rubbers 2, and a region which can be in contact with the terminal 301 of the circuit board 300 and the electrode 202 of the semiconductor integrated circuit 200 on each end face of the plurality of conductive rubbers 2. For example, it has a metal piece 3 held so as to penetrate from one end face of the conductive rubber 2 to the other end face with a central axis, and has a plurality of terminals 301 of the circuit board 300 and a semiconductor integrated circuit 200.
And the structure is such that the plurality of terminals 301 and the electrodes 202 are connected to each other by pressurization between the plurality of bump-type electrodes 202.

With such a configuration and structure,
Since the corresponding connection between the terminal 301 and the electrode 202 is connected in parallel with both the metal piece 3 and the conductive rubber 2, the cross-sectional area of the metal piece 3 can be made larger than the cross-sectional area of the conventional thin metal wire 4. The resistance value and the inductance value between the terminal 301 and the electrode 202 can be reduced, so that the loss between the terminal and the electrode can be reduced and the high-frequency characteristics can be improved.

In the first embodiment, the insulating plate 1 is formed of an insulating rubber material, so that the plurality of terminals 301 of the circuit board 300 and the plurality of electrodes 202 of the semiconductor integrated circuit 200 are connected. When a plurality of conductive rubbers 2 (including metal pieces 3) are sandwiched under pressure between
As shown in FIG. 7, the insulating plate 1 is also deformed and conforms to the surface of the circuit board 300 including the plurality of land-shaped terminals 301, absorbs coplanarity, and connects the electric contact plate 100 and the circuit board 300.
Electrical connection with the battery. In the case where the terminals and electrodes are of a bump type (solder ball type), the conductive rubber 2 and the metal piece 3 are in close contact with the surface of the solder ball, and their electrical connection is ensured as in the case of the land type.

FIG. 2 is an exploded side view showing an example of an IC socket for mounting a semiconductor integrated circuit 200a having a plurality of land-shaped electrodes 202a on a circuit board 300 using the electric contact plate 100 of this embodiment. is there. The IC socket performs positioning between the electric contact plate 100, a positioning frame 14 for positioning between the electric contact plate 100 and the semiconductor integrated circuit 200a, and positioning between the positioning frame 14 and the circuit board 300, A plurality of terminals 3 of the circuit board 300
01 and the plurality of electrodes 202a of the semiconductor integrated circuit 200a, the electric contact plate 100 is pressed and clamped, and a fixing screw 11, a pressure spring 12,
It has a structure including a pressing plate 13, an insulating sheet 15, a back plate 16, and positioning pins 17. With such an IC socket, the plurality of terminals 301 of the circuit board 300 and the plurality of electrodes 202 of the semiconductor integrated circuit 200a are provided.
a and presses the opposite ends of the corresponding conductive rubber 2 and metal piece 3 of the electric contact plate 100 with an appropriate pressure, and the terminals 301 and the electrodes 202a are reliably connected to each other.

FIGS. 3 (a) and 3 (b) are a sectional side view and a top view (part) showing a second embodiment of the present invention. In the first embodiment, only one metal piece 3 is provided on the center axis of each conductive rubber 2. However, in the second embodiment, the metal piece 3 is provided on a portion other than the center axis of each conductive rubber 2. Another metal piece 3 is also provided at the site. By providing a plurality of metal pieces 3 on one conductive rubber 2 in this manner, the resistance value and the inductance value between the terminal 301 and the electrode 202a can be further reduced, and the loss between the terminal and the electrode can be reduced. Further reduction and further improvement of high frequency characteristics can be achieved.

FIGS. 4A and 4B are cross-sectional side views showing a third embodiment of the present invention, and a plurality of terminals of a circuit board and a plurality of electrodes of a semiconductor integrated circuit by using an electric contact plate of this embodiment. FIG. 7 is a cross-sectional side view showing a state in which a corresponding connection is made. In the third embodiment, the metal piece 3a is formed of an elastic metal material, and has a spring structure in which the metal piece 3a is slightly curved in advance so as to be easily deformed when pressed from both ends and penetrates the conductive rubber 2a. In addition, the conductive rubber 2a has a structure that slightly protrudes from both surfaces of the insulating plate 1a. Metal piece 3
By using a as a spring structure, the metal piece 3a can reliably hold the pressure contact connection between the terminal 301 and the electrode 202a regardless of the elastic deterioration (set) of the conductive rubber 2a, Connection reliability can be kept high. In addition, since the metal piece 3a has a spring structure, the contact pressure between the terminal 301 and the electrode 202a can be largely shared on the metal piece 3a side, and the load on the conductive rubber 2a can be reduced. Can be kept low, and the traveling speed can be slowed down. Therefore, the pressure contact connection by the conductive rubber 2a can be ensured, and the connection reliability can be similarly kept high.

Further, by projecting the conductive rubber 2a from the surface of the insulating plate 1a, even if the insulating plate 1a is made of a rigid material, the coplanarity is absorbed and the land type (of course, bump type) terminals 301, The surface of the electrode 202a can be brought into close contact with the conductive rubber 2a and the metal piece 3a with an appropriate pressure, and the reliability of connection can be increased.

Further, since the restriction of the portion of the conductive rubber 2a projecting from the surface of the insulating plate 1a in the horizontal direction is reduced, the amount of vertical deformation is increased even with a small load, and the contact due to the deformation is increased. Since a pressure is obtained, the degree of settling of the conductive rubber 2a due to a load (pressurization) can be suppressed to a low level, and the connection reliability can be kept high.

If the terminals and electrodes are of the bump type, the coplanarity can be sufficiently absorbed and the reliability of the connection can be improved without projecting the conductive rubber 2a from the surface of the insulating plate 1a. Also, the metal piece 3a having the spring structure is
Similarly to the embodiment, a plurality of conductive rubbers may be provided for each conductive rubber.

[0022]

As described above, the present invention has a structure in which a plurality of conductive rubbers penetrating a predetermined portion of an insulating plate are provided with at least one metal piece penetrating the conductive rubbers. As a result, the conductive rubber and the metal piece are connected in parallel between the terminal of the substrate and the electrode of the electronic component, which are in pressure contact with both ends of the conductive rubber and the metal piece, and at the same time, the cross-sectional area of the metal piece is reduced. It is possible to reduce the resistance value and inductance value between these terminals and electrodes, reduce the loss, improve the high frequency characteristics, and make the metal piece elastic. Elastic deterioration of conductive rubber (sag) by forming it from metal material and bending it slightly to make it a spring structure
Regardless of the elasticity of the metal piece, the coplanarity can be absorbed and the connection between the terminal and the electrode can be reliably maintained, and at the same time, the load on the conductive rubber is reduced to suppress its elastic deterioration, Since pressure contact connection can be secured,
There is an effect that the reliability of the connection between the terminal and the electrode can be kept high.

[Brief description of the drawings]

FIG. 1 is a cross-sectional side view showing a first embodiment of the present invention, showing a state where a plurality of terminals of a circuit board and a plurality of electrodes of a semiconductor integrated circuit are correspondingly connected by an electric contact plate of the embodiment. It is sectional side view shown.

FIG. 2 is an exploded side view showing an example of an IC socket when a semiconductor integrated circuit is mounted on a circuit board using the electric contact plate of the embodiment shown in FIG.

FIG. 3 is a sectional side view and a top view (part) showing a second embodiment of the present invention.

FIG. 4 is a cross-sectional side view showing a third embodiment of the present invention, and shows a state in which a plurality of terminals of a circuit board and a plurality of electrodes of a semiconductor integrated circuit are correspondingly connected by an electric contact plate of this embodiment. It is sectional side view shown.

FIG. 5 is a cross-sectional side view showing a first example of a conventional electric contact plate and a cross-sectional side view showing a state where a plurality of terminals of a circuit board and a plurality of electrodes of a semiconductor integrated circuit are correspondingly connected by the electric contact plate. FIG.

FIG. 6 is a cross-sectional side view showing a second example of a conventional electric contact plate.

[Explanation of symbols]

1, 1a, 1x, 1y Insulating plate 2, 2a, 2y Conductive rubber 3, 3a Metal piece 4 Fine metal wire 100, 100a, 100b, 100x, 100y Electric contact plate 200, 200a Semiconductor integrated circuit 201, 201a Packages 202, 202a Electrode 300 Circuit board 301 Terminal

Claims (4)

[Claims] 1. An electric device which is sandwiched under pressure between a plurality of terminals formed on a substrate surface and a plurality of land-type or bump-type electrodes formed on a surface of an electronic component, and correspondingly connects the plurality of terminals and electrodes. An electrical contact plate comprising the following components. (A) an insulating plate having a predetermined thickness and size (b) a portion of the insulating plate corresponding to a plurality of terminals on the substrate surface and a plurality of electrodes on the electronic component surface; (C) A plurality of pillar-shaped conductive rubbers which are held so as to penetrate from one surface to the other surface. (C) Each end surface of the plurality of conductive rubbers can contact terminals on the substrate surface and electrodes on the electronic component surface. One or a plurality of metal pieces that are held so as to penetrate from one end face to the other end face of these conductive rubbers in an appropriate area. 2. The electric contact plate according to claim 1, wherein said insulating plate is made of an insulating rubber material. 3. The electrical contact plate according to claim 1, wherein each of the plurality of conductive rubbers protrudes from at least one surface of the insulating plate by a predetermined dimension. 4. The metal piece is made of an elastic metal material,
2. The electric contact plate according to claim 1, wherein the electric contact plate has a spring structure which is curved in advance so as to be easily deformed when pressed from both ends.