JPH0442925Y2 - - Google Patents
Info
- Publication number
- JPH0442925Y2 JPH0442925Y2 JP1986161236U JP16123686U JPH0442925Y2 JP H0442925 Y2 JPH0442925 Y2 JP H0442925Y2 JP 1986161236 U JP1986161236 U JP 1986161236U JP 16123686 U JP16123686 U JP 16123686U JP H0442925 Y2 JPH0442925 Y2 JP H0442925Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat spreader
- pattern
- transistor
- semiconductor device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986161236U JPH0442925Y2 (cs) | 1986-10-21 | 1986-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986161236U JPH0442925Y2 (cs) | 1986-10-21 | 1986-10-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6367255U JPS6367255U (cs) | 1988-05-06 |
| JPH0442925Y2 true JPH0442925Y2 (cs) | 1992-10-12 |
Family
ID=31087359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986161236U Expired JPH0442925Y2 (cs) | 1986-10-21 | 1986-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442925Y2 (cs) |
-
1986
- 1986-10-21 JP JP1986161236U patent/JPH0442925Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6367255U (cs) | 1988-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6028352A (en) | IC stack utilizing secondary leadframes | |
| JP2863155B2 (ja) | 半導体パッケージ及びその組み立て方法 | |
| US5994772A (en) | Semiconductor package | |
| JPH064595Y2 (ja) | ハイブリッドic | |
| JP2708309B2 (ja) | マルチチップ型半導体装置 | |
| JPH0442925Y2 (cs) | ||
| CN100517677C (zh) | 多芯片封装的导线架、其制造方法及其封装构造 | |
| JPS6157542U (cs) | ||
| JPS6351451U (cs) | ||
| JPH01130552U (cs) | ||
| JPH01139447U (cs) | ||
| JPS63147831U (cs) | ||
| JPH01112044U (cs) | ||
| JPH0343738U (cs) | ||
| JPS63187330U (cs) | ||
| JPS61164076U (cs) | ||
| JPH01104048U (cs) | ||
| JPS61109167U (cs) | ||
| JPH0334242U (cs) | ||
| JPS63174460U (cs) | ||
| JPS5914338U (ja) | 混成集積回路 | |
| JPS63164245U (cs) | ||
| JPS61123544U (cs) | ||
| JPH0343742U (cs) | ||
| JPH0388350U (cs) |