JPS6351451U - - Google Patents
Info
- Publication number
- JPS6351451U JPS6351451U JP1986146176U JP14617686U JPS6351451U JP S6351451 U JPS6351451 U JP S6351451U JP 1986146176 U JP1986146176 U JP 1986146176U JP 14617686 U JP14617686 U JP 14617686U JP S6351451 U JPS6351451 U JP S6351451U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- heat dissipation
- dissipation fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986146176U JPS6351451U (cs) | 1986-09-24 | 1986-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986146176U JPS6351451U (cs) | 1986-09-24 | 1986-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6351451U true JPS6351451U (cs) | 1988-04-07 |
Family
ID=31058405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986146176U Pending JPS6351451U (cs) | 1986-09-24 | 1986-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6351451U (cs) |
-
1986
- 1986-09-24 JP JP1986146176U patent/JPS6351451U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6351451U (cs) | ||
| JPH01176946U (cs) | ||
| JPH03122543U (cs) | ||
| JPH0336137U (cs) | ||
| JPS5822742U (ja) | 半導体装置 | |
| JPH02131351U (cs) | ||
| JPH038445U (cs) | ||
| JPS61205145U (cs) | ||
| JPS59103455U (ja) | 半導体装置 | |
| JPS5860942U (ja) | 混成集積回路装置 | |
| JPH0289844U (cs) | ||
| JPS6061741U (ja) | 放熱フイン付半導体装置 | |
| JPS58166048U (ja) | Ｉｃパツケ−ジ | |
| JPH01104027U (cs) | ||
| JPS63142849U (cs) | ||
| JPS5914338U (ja) | 混成集積回路 | |
| JPS6258045U (cs) | ||
| JPH0323944U (cs) | ||
| JPS58116236U (ja) | 混成集積回路 | |
| JPS63140625U (cs) | ||
| JPS58168135U (ja) | 半導体装置 | |
| JPS63174460U (cs) | ||
| JPS5851442U (ja) | 混成集積回路装置 | |
| JPS6258046U (cs) | ||
| JPS587337U (ja) | 混成集積回路装置 |