JPH0440589U - - Google Patents
Info
- Publication number
- JPH0440589U JPH0440589U JP8057690U JP8057690U JPH0440589U JP H0440589 U JPH0440589 U JP H0440589U JP 8057690 U JP8057690 U JP 8057690U JP 8057690 U JP8057690 U JP 8057690U JP H0440589 U JPH0440589 U JP H0440589U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- cooling structure
- heat sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000011344 liquid material Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8057690U JPH0440589U (fr) | 1990-07-31 | 1990-07-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8057690U JPH0440589U (fr) | 1990-07-31 | 1990-07-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0440589U true JPH0440589U (fr) | 1992-04-07 |
Family
ID=31625764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8057690U Pending JPH0440589U (fr) | 1990-07-31 | 1990-07-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0440589U (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284862A (ja) * | 2000-03-30 | 2001-10-12 | Tech Res & Dev Inst Of Japan Def Agency | 電子機器冷却装置 |
JP2011000884A (ja) * | 2009-06-17 | 2011-01-06 | Laird Technologies Inc | 適合型多層熱伝導性中間構体およびそれを具備するメモリモジュール |
JP2015211144A (ja) * | 2014-04-28 | 2015-11-24 | 日立オートモティブシステムズ株式会社 | 電子回路装置およびその製造方法 |
JP2016100512A (ja) * | 2014-11-25 | 2016-05-30 | 日本電気株式会社 | 冷却装置 |
-
1990
- 1990-07-31 JP JP8057690U patent/JPH0440589U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284862A (ja) * | 2000-03-30 | 2001-10-12 | Tech Res & Dev Inst Of Japan Def Agency | 電子機器冷却装置 |
JP2011000884A (ja) * | 2009-06-17 | 2011-01-06 | Laird Technologies Inc | 適合型多層熱伝導性中間構体およびそれを具備するメモリモジュール |
JP2015211144A (ja) * | 2014-04-28 | 2015-11-24 | 日立オートモティブシステムズ株式会社 | 電子回路装置およびその製造方法 |
JP2016100512A (ja) * | 2014-11-25 | 2016-05-30 | 日本電気株式会社 | 冷却装置 |
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