JPH03110885U - - Google Patents

Info

Publication number
JPH03110885U
JPH03110885U JP1990019671U JP1967190U JPH03110885U JP H03110885 U JPH03110885 U JP H03110885U JP 1990019671 U JP1990019671 U JP 1990019671U JP 1967190 U JP1967190 U JP 1967190U JP H03110885 U JPH03110885 U JP H03110885U
Authority
JP
Japan
Prior art keywords
lsi package
heat dissipation
dissipation structure
cover
leaf spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990019671U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990019671U priority Critical patent/JPH03110885U/ja
Publication of JPH03110885U publication Critical patent/JPH03110885U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1990019671U 1990-02-27 1990-02-27 Pending JPH03110885U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990019671U JPH03110885U (fr) 1990-02-27 1990-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990019671U JPH03110885U (fr) 1990-02-27 1990-02-27

Publications (1)

Publication Number Publication Date
JPH03110885U true JPH03110885U (fr) 1991-11-13

Family

ID=31522776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990019671U Pending JPH03110885U (fr) 1990-02-27 1990-02-27

Country Status (1)

Country Link
JP (1) JPH03110885U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020087971A (ja) * 2018-11-15 2020-06-04 株式会社デンソー 半導体部品の放熱構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62219598A (ja) * 1986-03-19 1987-09-26 富士通株式会社 素子の放熱方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62219598A (ja) * 1986-03-19 1987-09-26 富士通株式会社 素子の放熱方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020087971A (ja) * 2018-11-15 2020-06-04 株式会社デンソー 半導体部品の放熱構造

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