JPH0440586U

JPH0440586U -

Info

Publication number: JPH0440586U
Application number: JP8120090U
Authority: JP
Priority date: 1990-07-31
Filing date: 1990-07-31
Publication date: 1992-04-07

Description

[Brief explanation of the drawing]

第１図は、本考案による基板構造の一実施例を
示す加工前の基板の図であり、Ａは平面図、Ｂは
断面図、第２図は、第１図の基板に回路素子を取
り付けた状態を示し、Ａは平面図、Ｂは断面図、
第３図は、第２図の基板の切断部分を切除した状
態を示し、Ａは平面図、Ｂは断面図、第４図は、
第３図の基板をシヤーシに装着した状態を示し、
Ａは斜視図、Ｂは断面図、第５図は、従来の基板
構造の一例の概略断面図である。１１……放熱すべき回路素子、１２……基板、
１３……シヤーシ、１３ａ……放熱部材、１４…
…基板、１５ａ，１５ｂ……Ｖカツト、１６……
切除部分、１７……スリツト、１８……スペーサ
、１９……捨て基板。 FIG. 1 is a diagram of an unprocessed board showing an embodiment of the board structure according to the present invention, where A is a plan view, B is a cross-sectional view, and FIG. 2 shows circuit elements attached to the board of FIG. 1. A is a plan view, B is a sectional view,
FIG. 3 shows a state where the cut portion of the substrate in FIG. 2 has been removed, A is a plan view, B is a sectional view, and FIG.
The board shown in Figure 3 is shown mounted on the chassis.
A is a perspective view, B is a sectional view, and FIG. 5 is a schematic sectional view of an example of a conventional substrate structure. 11...Circuit element to dissipate heat, 12...Substrate,
13... Chassis, 13a... Heat radiation member, 14...
...Substrate, 15a, 15b...V cut, 16...
Cutout portion, 17...Slit, 18...Spacer, 19...Discarded board.

Claims

[Claims for Utility Model Registration] In a board on which various parts including circuit elements to be heat radiated are mounted and mounted on a chassis, the circuit elements to be heat radiated are mounted horizontally on the board, and the circuit element to be heat radiated is mounted horizontally on the board, and the circuit 1. A substrate structure characterized in that the lower surface of an element is provided with a cutout portion defined by a slit and connected to a sacrificial substrate.