JPH0440554U - - Google Patents
Info
- Publication number
- JPH0440554U JPH0440554U JP8183090U JP8183090U JPH0440554U JP H0440554 U JPH0440554 U JP H0440554U JP 8183090 U JP8183090 U JP 8183090U JP 8183090 U JP8183090 U JP 8183090U JP H0440554 U JPH0440554 U JP H0440554U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- lens body
- lead frame
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8183090U JPH0440554U (me) | 1990-07-31 | 1990-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8183090U JPH0440554U (me) | 1990-07-31 | 1990-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0440554U true JPH0440554U (me) | 1992-04-07 |
Family
ID=31628113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8183090U Pending JPH0440554U (me) | 1990-07-31 | 1990-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440554U (me) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0681368U (ja) * | 1993-05-06 | 1994-11-22 | 株式会社テンヨー | 額 縁 |
| JP2004319591A (ja) * | 2003-04-11 | 2004-11-11 | Sharp Corp | 半導体発光装置およびその製造方法 |
| JP2011223044A (ja) * | 2000-04-26 | 2011-11-04 | Osram Opto Semiconductors Gmbh | ルミネセンス変換エレメントを備えた光放出半導体素子 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4851588A (me) * | 1971-10-27 | 1973-07-19 | ||
| JPH01152676A (ja) * | 1987-12-09 | 1989-06-15 | Rohm Co Ltd | 発光ダイオード装置 |
| JPH0231451A (ja) * | 1988-07-20 | 1990-02-01 | Mitsui Petrochem Ind Ltd | 発光ダイオード |
-
1990
- 1990-07-31 JP JP8183090U patent/JPH0440554U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4851588A (me) * | 1971-10-27 | 1973-07-19 | ||
| JPH01152676A (ja) * | 1987-12-09 | 1989-06-15 | Rohm Co Ltd | 発光ダイオード装置 |
| JPH0231451A (ja) * | 1988-07-20 | 1990-02-01 | Mitsui Petrochem Ind Ltd | 発光ダイオード |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0681368U (ja) * | 1993-05-06 | 1994-11-22 | 株式会社テンヨー | 額 縁 |
| JP2011223044A (ja) * | 2000-04-26 | 2011-11-04 | Osram Opto Semiconductors Gmbh | ルミネセンス変換エレメントを備えた光放出半導体素子 |
| JP2004319591A (ja) * | 2003-04-11 | 2004-11-11 | Sharp Corp | 半導体発光装置およびその製造方法 |