JPH0440460A - Inspecting method for exposure device - Google Patents

Abstract

PURPOSE:To improve the efficiency of operating an exposure device and the efficiency of manufacturing a non defective substrate by inspecting the exposure state of a check sheet which is exposed by allowing the light emitting means to emit light and deciding a projection pattern of a projecting member. CONSTITUTION:In the case of directly carrying an ultraviolet ray photosensitive type check sheet 22 on an acrylic board 19 of an exposure unit 7 by a traverser unit 5 after carrying out a pattern film 3, the sheet 22 is mounted on the film 3 on the acrylic board 19. The projection pattern of the film 3 is projected on the sheet 22 by temporarily emitting the light of a mercury lamp 20 while keeping the aforesaid state, and the sheet 22 is sensitized. After emitting the light of the lamp 20, the sheet 22 is pulled out so that a circuit pattern which is sensitized on the sheet 22 may be inspected by using a circuit inspecting device or an enlarge lens optical system, and the projection pattern of the film 3 is checked. Thus, the exposure device can be efficiently operated and also the substrate to be exposed can be prevented from being wasted.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an inspection method for an exposure apparatus that exposes a substrate such as a printed wiring board.

(Prior Art) It has been known to manufacture printed wiring boards using, for example, an exposure apparatus. This exposure device fixes a pattern film with a projected pattern on a translucent acrylic plate, fixes a photosensitive substrate on top of this pattern film, and emits ultraviolet rays from below the acrylic plate. By irradiating the substrate with ultraviolet light through the acrylic plate and the pattern film, the circuit pattern of the pattern film is projected onto the substrate.

(Problems to be Solved by the Invention) However, in such an exposure apparatus, fine dust may adhere to the circuit pattern of the pattern film in advance, or
Although defective pattern films are removed by inspecting circuit patterns for disconnections, there are cases in which disconnections or dust adhesion occur on the pattern film after inspection due to some reason during the exposure process.

Therefore, the exposed substrates are inspected by randomly sampling the substrates manufactured by the exposure equipment, but the chemical treatment process after exposure takes approximately 20 to 30 minutes, and Since it is necessary to expose a considerable number of substrates to determine whether the disconnection phenomenon is due to the pattern film or the disconnection phenomenon caused by the pattern film, the operation of the exposure equipment must be stopped during that time, and a large number of wasted substrates are manufactured. There was a problem with being exposed.

(Means for Solving the Problems) The exposure apparatus inspection method according to the present invention has been made to solve the above problems, and improves the operating efficiency of the exposure apparatus as well as the production efficiency of defect-free substrates. The purpose is to improve.

In order to achieve such an object, a method for inspecting an exposure apparatus according to the present invention includes: a light emitting means of an ultraviolet irradiation type is faced to one side of a projection member having a projection pattern and having translucency; In an inspection method of an exposure apparatus, a substrate is disposed on the other surface side, and the light emitting means is made to emit light to expose the projection pattern of the projection member to the substrate, wherein the substrate is located on the other surface side of the projection member. Beforehand, a check sheet sensitive to ultraviolet rays is disposed on the other side of the projection member, the light emitting means is made to emit light to expose the check sheet, and the exposure state of the exposed check sheet is checked. The method is characterized in that the projection pattern of the projection member is determined by inspection.

(Function) According to the method for inspecting an exposure apparatus according to the present invention, the check sheet is exposed to light by the light emitted from the light emitting means, so that the projection pattern of the projection member can be immediately inspected by inspecting the check sheet.

(Example) Hereinafter, a method for inspecting an exposure apparatus according to an example of the present invention will be described with reference to the drawings.

FIG. 1 shows an exposure apparatus according to this embodiment, in which 1 is an exposure apparatus, 2 is a substrate, 3 is a pattern film as a projection member, 4 is a pre-alignment unit for laminating the substrates 2, and 5 is a substrate. 2, a traverser unit that transports
6 is an alignment unit that aligns the substrate 2 with respect to the pattern film 3; 7 is the pattern film 3;
An exposure unit 8 is used to fix the substrate 2 and expose a projected pattern onto the substrate 2, and 8 is a storage unit that stores the exposed substrate 2.

As shown in FIGS. 2 and 3, the substrate 2 is provided with a pair of target marks 2a, 2a for alignment with the batten film 3, and the pattern film 3 is provided with a pair of target marks 2a, 2a for alignment with the batten film 3. ．． Alignment marks 3a, 3a as reference marks for positioning a, 2a
is provided.

The traverser unit 5 is the pre-alignment unit 4.
It is driven to suction and take out the substrate 2 sheet by sheet, reciprocate toward the alignment unit 6, exposure unit 7, and storage unit 8, and has a suction unit main body 9 and a suction arm portion 10.11. are doing. Traverser unit 5
is controlled to be driven horizontally and vertically by a drive control device 12. A drive mechanism for driving the traverser unit 5 horizontally and vertically is not shown.

Further, the air suction device of the traverser unit 5 is also omitted from illustration. Drive of the traverser unit 5 in the horizontal and vertical directions and air suction control are performed based on the control of the drive control device 12.

The alignment unit 6 has a table 13 for positioning the substrate 2, and a pair of CCD cameras 14, 14 are disposed below the table 13.
Alignment mark 3a 3 of pattern film 3
Openings 13a, 13a are formed for observing a. First, the pattern film 3 is carried onto the table 13, and alignment marks 3a, 3a are placed on a pair of CCDs.
Observed by camera 14.14. The pair of CCD cameras Ill, 14 have alignment marks 3a,
A first storage means 15 for observing and storing the position of the substrate 3a and a second storage means 16 for storing target marks 2a, 2a on the substrate 2 when the substrate 2 is transferred to the table 13, which will be described later, are connected. ing. A first calculation means 17 is connected to the first storage means 15 and the second storage means 16, and in the first calculation means 17, the first storage means 15
By comparing the storage data of the alignment marks 3a, 3a stored in the storage means 16 with the storage data of the target marks 2a, 2a stored in the second storage means 16,
The amount of positional deviation of the target mark 2a2a with respect to the alignment marks 3a, 3a is calculated as first correction data for moving the chiffle 3. First calculation means 1
7, the support rod 13b of the chifur 13 is connected to X, Y,
A drive control means 18 for driving in the θ direction is connected, and the first correction data calculated by the first calculation means 17 is transmitted to this drive control means 18 to move the table 13.

The exposure unit 7 includes a light-transmitting acrylic plate 19 that fixes the pattern film 3 conveyed by the traverser unit 5, an ultraviolet irradiation type mercury lamp 20 as a light emitting means, and a acrylic plate 19 that emits light from the mercury lamp 20. It is equipped with a mirror 2 which focuses light on the side.

The ultraviolet light irradiated from the mercury lamp 20 is applied to the acrylic plate 1
The substrate 2 is illuminated by the light emitted from the mercury lamp 20 through the mercury lamp 9 and the pattern film 3.
A projection pattern is projected onto the pattern film 30.

The exposure apparatus 1 of this embodiment is inspected by the following inspection method.

First, the pattern film 3 is taken out from the pre-alignment unit 4 by the traverser unit 5 and conveyed onto the chiffle 13 of the alignment unit 6. After conveying the pattern film 3 to the table 13, a pair of CCD
Alignment marks 3a, 3a by camera 14.14
is observed. Observation data of this alignment mark 3a is stored in the first storage means 15. After the observation data of the alignment marks 3a, 3a is stored in the first storage means 15, the traverser unit 5 transports the pattern film 3 to the acrylic plate 19 of the exposure unit 7.

After carrying out the pattern film 3, an ultraviolet-sensitive check sheet 22 is carried onto the acrylic plate 19 of the direct exposure unit 7 by the traverser unit 5. This check sheet 22 is sensitive to the ultraviolet wavelength range, and the color density changes depending on the amount of energy irradiated with ultraviolet rays.The color change is considered irreversible, and the amount of ultraviolet rays can be calculated by re-irradiation. It is. The check sheet 22 is placed on the pattern film 3 on the acrylic board 19. When the mercury lamp 20 is temporarily turned on in this state, the projection pattern of the pattern film 3 is projected onto the check sheet 22.
is exposed to light. After the mercury lamp 20 emits light, the check sheet 22 is taken out and the circuit pattern exposed on the check sheet 22 is inspected using a circuit inspection device (not shown) or a magnifying lens optical system, so that the projected pattern on the pattern film 3 can be checked. .

If there is any abnormality in the projected pattern during the check of the projected pattern, the pattern film 3 is peeled off from the acrylic plate 19 and a new pattern film 3 is set on the acrylic plate 19. This new pattern film 3 is inspected again as described above, and if it is determined to be clean, the traverser unit 5 is driven to transport the substrate 2 onto the table 13. After conveying the substrate 2 to the table 13, the CC
Target mark 2 on board 2 by D camera 14.14
a, 2a, the second storage means 16 stores the position data of the target marks 2a, 2a, and the first
The calculation means 17 calculates the amount of positional deviation of the target mark 2a2a with respect to the alignment marks 3a, 3a. x, y, calculated by the first calculation means 17
The amount of deviation in the θ direction is sent as first correction data to the drive control means 18 for the table 13, the table 13 is moved by an amount equivalent to the positional deviation, and the deviation of the substrate 2 with respect to the pattern film 3 is eliminated.

(Effects of the Invention) Since the inspection method for an exposure apparatus according to the present invention is configured as described above, the projection pattern of the projection member is exposed on the check sheet before exposing the substrate, and the exposed check sheet is projected. Since the pattern is inspected, the projection member can be inspected quickly, the exposure apparatus can be operated efficiently, and the substrate to be exposed can be prevented from being wasted.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of an exposure apparatus used in an embodiment of the present invention. FIG. 2 is an explanatory diagram of a pattern film used in the exposure apparatus of FIG. 1. FIG. 3 is an explanatory diagram of a substrate exposed by the exposure apparatus of FIG. 1. DESCRIPTION OF SYMBOLS 1... Exposure device, 2... Substrate 3... Pattern film 5... Traverser unit 6... Alignment unit 7... Exposure unit 13... Table, 14... CCD camera 19.・
・Acrylic plate 20...Mercury lamp 22...Check sheet

Claims (1)

[Claims] A light-emitting means of ultraviolet irradiation type is provided on one surface side of a projection member having a projection pattern and having translucency, and a substrate is disposed on the other surface side of the projection member, and the light-emitting means is caused to emit light. In an inspection method for an exposure apparatus in which a substrate is exposed to a projection pattern of the projection member, before the substrate is positioned on the other surface of the projection member, the other surface of the projection member is exposed to light that is sensitive to ultraviolet rays. An exposure apparatus characterized in that a check sheet is provided, the light emitting means is made to emit light to expose the check sheet, and the projection pattern of the projection member is determined by inspecting the exposure state of the exposed check sheet. inspection method.