JPH0438066U - - Google Patents

Info

Publication number
JPH0438066U
JPH0438066U JP1990080929U JP8092990U JPH0438066U JP H0438066 U JPH0438066 U JP H0438066U JP 1990080929 U JP1990080929 U JP 1990080929U JP 8092990 U JP8092990 U JP 8092990U JP H0438066 U JPH0438066 U JP H0438066U
Authority
JP
Japan
Prior art keywords
light receiving
circuit
element chip
infrared
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990080929U
Other languages
English (en)
Other versions
JP2556376Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990080929U priority Critical patent/JP2556376Y2/ja
Publication of JPH0438066U publication Critical patent/JPH0438066U/ja
Application granted granted Critical
Publication of JP2556376Y2 publication Critical patent/JP2556376Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Optical Communication System (AREA)

Description

【図面の簡単な説明】
第１図乃至第３図は本考案の一実施例を示し、
第１図は赤外線受光装置の正面図、第２図は同背
面図、第３図は同一部切欠側面図であり、第４図
は従来例を示す赤外線受光装置の分解斜視図であ
る。 ２１……赤外線受光装置、２２……回路基板、
２３……ＰＩＮホトダイオードチツプ、２９……
エポキシ系樹脂、３０……受信回路用ＩＣチツプ
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路基板に受光素子のチツプ並びに受信回路素
    子等を配設し、受光回路を形成するとともに、赤
    外線透過フイルタ特性を有する樹脂にて前記受光
    素子チツプを被覆した赤外線受光装置。
JP1990080929U 1990-07-30 1990-07-30 赤外線受光装置 Expired - Lifetime JP2556376Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990080929U JP2556376Y2 (ja) 1990-07-30 1990-07-30 赤外線受光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990080929U JP2556376Y2 (ja) 1990-07-30 1990-07-30 赤外線受光装置

Publications (2)

Publication Number Publication Date
JPH0438066U true JPH0438066U (ja) 1992-03-31
JP2556376Y2 JP2556376Y2 (ja) 1997-12-03

Family

ID=31626410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990080929U Expired - Lifetime JP2556376Y2 (ja) 1990-07-30 1990-07-30 赤外線受光装置

Country Status (1)

Country Link
JP (1) JP2556376Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310573U (ja) * 1986-07-09 1988-01-23
JPH0432544U (ja) * 1990-07-13 1992-03-17
JP3013758U (ja) * 1995-01-19 1995-07-18 ゼネラルパッカー株式会社 真空包装装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310573U (ja) * 1986-07-09 1988-01-23
JPH0432544U (ja) * 1990-07-13 1992-03-17
JP3013758U (ja) * 1995-01-19 1995-07-18 ゼネラルパッカー株式会社 真空包装装置

Also Published As

Publication number Publication date
JP2556376Y2 (ja) 1997-12-03

Similar Documents

Publication Publication Date Title
JPH0438066U (ja)
JPH03103982U (ja)
JPS6327064U (ja)
JPH0339863U (ja)
JPS63157625U (ja)
JPH01176958U (ja)
JPH045601U (ja)
JPS63131116U (ja)
JPH02116147U (ja)
JPS6435765U (ja)
JPH029455U (ja)
JPH0342533U (ja)
JPH0339876U (ja)
JPH02111949U (ja)
JPS59143403U (ja) 脈拍センサ−装置
JPH0272944U (ja)
JPS63181086U (ja)
JPH03110881U (ja)
JPS6424377U (ja)
JPH01179012U (ja)
JPH0486327U (ja)
JPH0477225U (ja)
JPS62170687U (ja)
JPS63114043U (ja)
JPS625763U (ja)