JPH0437469A - Production of electronic parts - Google Patents
Production of electronic partsInfo
- Publication number
- JPH0437469A JPH0437469A JP2127314A JP12731490A JPH0437469A JP H0437469 A JPH0437469 A JP H0437469A JP 2127314 A JP2127314 A JP 2127314A JP 12731490 A JP12731490 A JP 12731490A JP H0437469 A JPH0437469 A JP H0437469A
- Authority
- JP
- Japan
- Prior art keywords
- endless belt
- soldering
- lead terminal
- lead terminals
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 24
- 238000005476 soldering Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 7
- 230000004907 flux Effects 0.000 claims abstract description 6
- 230000007797 corrosion Effects 0.000 claims abstract description 5
- 238000005260 corrosion Methods 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims abstract description 5
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 9
- 230000002265 prevention Effects 0.000 claims description 9
- 238000005406 washing Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000005086 pumping Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は絶縁基板上の端子接続用電極にリード端子をは
んだ接続する電子部品の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing an electronic component in which lead terminals are soldered to terminal connection electrodes on an insulating substrate.
従来の技術
リード端子付電子部品のリード端子接続方法として、第
６図、第６図に示すような機構であった。As a conventional method for connecting lead terminals of electronic components with lead terminals, a mechanism as shown in FIGS. 6 and 6 has been used.
第５図、第６図において、１２は絶縁基板１ｏとリード
端子１１の浮き防止用のヒータ付ブロック、１４はステ
ンレス等の耐熱耐腐食性材料のマスク、１３は前記マス
ク１４の固定枠、１６ははんだ、１６ははんだ汲み上げ
槽より形成される。5 and 6, 12 is a block with a heater for preventing the insulating substrate 1o and lead terminals 11 from floating; 14 is a mask made of heat-resistant and corrosion-resistant material such as stainless steel; 13 is a fixing frame for the mask 14; 16 16 is formed from a solder pumping tank.
前記構成のはんだ接合動作について述ベルト、浮き防止
用のヒータ付ブロックが下降しマスク１４上の絶縁基板
１０を押え、ばんだ１５の面がマスク１４の下面に接触
するまではんだ汲み上げ槽１６を上昇させ、絶縁基板１
ｏとリード端子１１をはんだ接合する。Regarding the soldering operation of the above configuration, the belt and the block with a heater for preventing floating descend to press the insulating substrate 10 on the mask 14, and the solder pumping tank 16 is raised until the surface of the solder 15 comes into contact with the lower surface of the mask 14. Insulated substrate 1
o and the lead terminal 11 are soldered together.
発明が解決しようとする課題
しかしながら、以上説明した従来の方法では以下の問題
点を有している。Problems to be Solved by the Invention However, the conventional method described above has the following problems.
第１に、はんだ付け時の熱によりリード端子１１の温度
が上昇し、リード端子１１の表面のはんだメッキが溶け
だしその結果、リード端子１１の板厚が不均一になる現
象が発生する。First, the temperature of the lead terminal 11 increases due to heat during soldering, and the solder plating on the surface of the lead terminal 11 begins to melt, resulting in a phenomenon in which the thickness of the lead terminal 11 becomes uneven.
第２には、はんだ付け時の熱によりリード端子１１の温
度が上昇して、リード端子１１とマスク１４間よりリー
ド端子１１の表面に沿ってはんだ１６が吸い上がりその
結果、リード端子１１表面の板厚が不均一になる現象が
発生する。Secondly, the temperature of the lead terminal 11 increases due to the heat generated during soldering, and the solder 16 is sucked up along the surface of the lead terminal 11 from between the lead terminal 11 and the mask 14, and as a result, the temperature of the lead terminal 11 increases. A phenomenon occurs in which the plate thickness becomes uneven.
第３として、リード端子１１のはんだ付け後にモールド
成形を行う場合および端子フォーミングを行う場合、前
記のリード端子１１の板厚が不均一により、モールド成
形においては、金型密着の不具合いによる樹脂材の漏れ
不良、寸法精度の不良および金型自身の摩耗という欠点
があり、リード端子１１のフォーミングでは、フォーミ
ング精度を低下させたりする問題がある。Thirdly, when molding or terminal forming is performed after soldering the lead terminal 11, due to the non-uniform thickness of the lead terminal 11, resin material may not be used during molding due to poor mold adhesion. There are disadvantages such as leakage defects, poor dimensional accuracy, and wear of the mold itself, and in forming the lead terminals 11, there is a problem that the forming accuracy is reduced.
第４の問題として、はんだ付けを行うとマスク１４の上
面てはフラックスが付着し、下面にははんだが付着とい
う問題が発生しマスク１４の洗浄をしなければならなく
なる。このため歩留りが低下したり作業性が著しく低下
する原因となっていた。A fourth problem is that when soldering is performed, flux adheres to the upper surface of the mask 14, and solder adheres to the lower surface, making it necessary to clean the mask 14. This has caused a decrease in yield and a significant decrease in workability.
第５では、この方法ではリード端子１１が連続フープ状
態では使用できず、リード端子１１を短冊状態にしなけ
ればはんだ付け作業ができないという欠点があり、これ
も作業性を著しく低下させていた。Fifth, this method has the drawback that the lead terminal 11 cannot be used in a continuous hoop state, and the soldering work cannot be performed unless the lead terminal 11 is in a strip state, which also significantly reduces workability.
本発明は以上のような従来の欠点を除去し、リード端子
の板厚が変化せず作業性に優れた電子部品の製造方法を
提供しようとするものである。The present invention aims to eliminate the above-mentioned conventional drawbacks and provide a method for manufacturing electronic components that does not change the thickness of the lead terminal and has excellent workability.
課題を解決するための手段
本発明は上記課題を解決するため、絶縁基板とリード端
子浮き防止機構部を２ブロツクに分はリード端子に密着
する機構にし、前記ブロック部の温度が下がるとヒータ
で加熱し、ブロック部の温度が上昇しすぎると水冷却を
行い前記ブロック部の温度コントロールを行い、リード
端子の温度上昇を防ぐとともにマスク部においては、ス
テンレス等の耐熱耐腐食性材料でエンドレスベルトを形
成し、前記エンドレスベルトにてマスキングを行い、エ
ンドレスベルトを動かすことによりベルトに付着したは
んだをスキーシイにより除去し、フランクス残りは洗浄
を行う方法としたものである。Means for Solving the Problems In order to solve the above problems, the present invention has a mechanism in which the insulating substrate and the lead terminal floating prevention mechanism are arranged in two blocks in close contact with the lead terminals, and when the temperature of the block parts decreases, the heater is activated. If the temperature of the block part rises too much during heating, water cooling is performed to control the temperature of the block part to prevent the temperature of the lead terminals from rising.In the mask part, an endless belt is made of heat-resistant and corrosion-resistant material such as stainless steel. The method is such that the solder adhered to the belt is removed by a squeegee by moving the endless belt, and the remaining franks are washed.
作用
上記方法により、絶縁基板とリード端子とのはんだ付け
を行う際、リード端子には温度コントロールされたリー
ド端子浮き防止ブロックが密着するためリード端子の温
度上昇が防げる。このことによりリード端子のはんだメ
ッキが溶けることなく、またリード端子表面に沿っては
んだの吸い上りも防げる。さらにマスクをエンドレスベ
ルトにすることにより、リード端子の連続フープ化が行
え、リード端子を送ると同時に、エンドレスベルトを動
かすことにより、エンドレスベルトに付着したはんだの
除去、フラックスの洗浄も行え作業性の向上が図れる。Effect: According to the method described above, when soldering the insulating substrate and the lead terminals, the temperature-controlled lead terminal floating prevention block comes into close contact with the lead terminals, so that the temperature of the lead terminals can be prevented from rising. This prevents the solder plating on the lead terminal from melting and also prevents solder from wicking up along the surface of the lead terminal. Furthermore, by making the mask into an endless belt, the lead terminals can be made into a continuous hoop, and by moving the endless belt at the same time as sending the lead terminals, the solder attached to the endless belt can be removed and the flux can be cleaned, improving work efficiency. Improvements can be made.
実施例
以下、本発明の実施例について図面を参照しながら説明
する。EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例における電子部品の製造方法
の全体図を示すものである。第２図〜第４図は第１図の
各部分の断面拡大図である。第１図において１は本発明
のはんだ付けに用いるエンドレスベルトでステンレス等
の耐熱耐腐食性材料を用いる。２は前記エンドレスベル
ト送りピンローラである。３は本発明のｊｒｌんだ付け
に用いるリード端子浮き防止ブロックであり、加熱、冷
却機構を備えている。４は本発明に用いる加熱、冷却機
構を備えているエンドレスベル） 受１’ｔブロックで
ある。５ばはんだ汲み上げ槽である。６はピンローラ用
付着はんだ取りスキーシイである。６′はエンドレスベ
ルト用付着はんだ取りスキーシイでアル。７はエンドレ
スベルト１に付着したフラックスを除去する洗浄槽であ
る。はんだ取りスキーシイ６．６’、洗浄槽７によりエ
ンドレスベルト１０表面をきれいに保つことができる。FIG. 1 shows an overall diagram of a method for manufacturing an electronic component according to an embodiment of the present invention. 2 to 4 are enlarged cross-sectional views of each portion of FIG. 1. In FIG. 1, reference numeral 1 denotes an endless belt used for soldering according to the present invention, which is made of a heat-resistant and corrosion-resistant material such as stainless steel. 2 is the endless belt feeding pin roller. 3 is a lead terminal floating prevention block used for JRL soldering of the present invention, and is equipped with a heating and cooling mechanism. 4 is an endless bell receiving block equipped with a heating and cooling mechanism used in the present invention. This is a 5-ba solder pumping tank. 6 is a pin roller adhesive solder removal squeegee. 6' is a squeegee for removing adhesive solder for endless belts. 7 is a cleaning tank for removing flux attached to the endless belt 1. The surface of the endless belt 10 can be kept clean by the solder remover 6.6' and the cleaning tank 7.
第２図は第１図のピンローラ２のムーム′部の拡大断面
図である。第３図は第１図のエンドレスベルト洗浄槽７
のＢ−Ｂ’の拡大断面図である。第４図は第１図のはん
だ付け部のｃ−ｃ’の拡大断面図であり、８は絶縁基板
浮き防止押えであり、９はリード端子取り併用はんだを
示し共晶はんだや高温はんだが多く用いられる。１０は
絶縁基板を示し９６％アルミナの無機系セラミックスや
ガラスエポキシ基板等の材料が多く用いられる。１１は
リード端子を示す。１７はリード端子浮き防止ブロック
３の冷却のための水を流す穴である。１８はリード端子
浮き防止ブロック３の加熱用ヒータを示す。FIG. 2 is an enlarged sectional view of the moom' portion of the pin roller 2 shown in FIG. 1. Figure 3 shows the endless belt cleaning tank 7 in Figure 1.
It is an enlarged sectional view of BB' of. Figure 4 is an enlarged cross-sectional view of the soldering part in Figure 1 taken along line c-c', where 8 is the insulating board lifting prevention holder, and 9 is the solder used in conjunction with lead terminal attachment, which is often eutectic solder or high-temperature solder. used. Reference numeral 10 indicates an insulating substrate, and materials such as 96% alumina inorganic ceramics and glass epoxy substrates are often used. 11 indicates a lead terminal. Reference numeral 17 denotes a hole through which water flows for cooling the lead terminal floating prevention block 3. Reference numeral 18 indicates a heater for heating the lead terminal floating prevention block 3.
発明の詳細
な説明したように本発明は、リード端子浮き防止ブロッ
クをリード端子に密着させ、前記ブロックを温度コント
ロールすることにより、（１）リード端子はんだメッキ
溶けを防止することができる。DETAILED DESCRIPTION OF THE INVENTION As described in detail, the present invention can (1) prevent lead terminal solder plating from melting by bringing a lead terminal lifting prevention block into close contact with the lead terminal and controlling the temperature of the block.
（２）リード端子のはんだ吸い上りを防止することがで
きる。(2) Solder wicking on the lead terminals can be prevented.
（３）上記の効果によりリード端子はんだ付け後の工程
の歩留まりの向上が図れる。(3) Due to the above effects, the yield of the process after lead terminal soldering can be improved.
（４モールド成形金型の寿命の拡大が図れる。(4-Mold The life of the molding die can be extended.
（５）マヌクのエンドレスベルト化により、リード端子
の連続フープ化の実現１歩留の向上、生産効率の向上が
図れる。(5) By converting Manuku into an endless belt, it is possible to realize a continuous hoop of lead terminals 1. It is possible to improve yield and production efficiency.
以上生産面９品質面でその実用的効果は大なるものがあ
る。It has great practical effects in terms of production and quality.
第１図は本発明の電子部品の型造方法の一実施施の全体
の構成図、第２図〜第４図は第１図の各部の拡大断面図
、第６図は従来のはんだ付け方法を示す説明図、第６図
は第６図の断面図である。
１・・・・・・エンドレスベルト、２・・・・・・ピン
ローラ、３・・・・・・リード端子浮き防止ブロック、
４・・・・・・エンドレスベルト受はブロック、５・・
・・・・はんだ汲み上げ槽、６・・・・・・はんだ取り
スキーシイ、６′・・・・・・はんだ取りスキーシイ、
７・・・・・・洗浄槽、８・・・・・・基板押え、９・
・・・・・はんだ、１ｏ・・・・・・絶縁基板、１１・
・・・・・リード端子、１７・・・・・・冷却用穴、１
８・・・・・・ヒータ。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名第１
図
７ エン）レスＡ゛ルト
ｌコχＪビ罎み五１７’檜
１１にと束フスキージイ
清浄槽
第３図 ２
第
図Fig. 1 is an overall configuration diagram of one implementation of the electronic component molding method of the present invention, Figs. 2 to 4 are enlarged sectional views of each part of Fig. 1, and Fig. 6 is a conventional soldering method. FIG. 6 is a sectional view of FIG. 1...Endless belt, 2...Pin roller, 3...Lead terminal floating prevention block,
4...The endless belt holder is a block, 5...
...Solder pumping tank, 6... Soldering pump, 6'... Soldering pump,
7...Cleaning tank, 8...Substrate holder, 9.
...Solder, 1o...Insulating substrate, 11.
...Lead terminal, 17...Cooling hole, 1
8... Heater. Name of agent: Patent attorney Shigetaka Awano and 1 other person 1st
Fig. 7 En)Ress A゛゛゛゛゛゜〇〇〇〇〇〉〈〉〉Hinoki 〈11〉 and the sewage tank Fig. 3〉〈〉
Claims (1)
両面に形成した端子接続用電極と、前記端子接続用電極
に対してはんだ付け接続されるリード端子を有し、前記
端子接続用電極と前記リード端子のはんだ接合において
耐熱耐腐食性材料でエンドレスベルトを形成し、被はん
だ付け部をマスキングを行うとともに、前記エンドレス
ベルトに付着したはんだカス取り、フラックスの洗浄を
行うとともに、前記リード端子のはんだ付け時の熱によ
るはんだメッキの溶けを防止する温度調整を行うリード
端子浮き防止ブロックとエンドレスベルト受けブロック
ではんだ付けする電子部品の製造方法。an insulating substrate, a terminal connecting electrode formed on a front surface, a back surface, or both surfaces of the insulating substrate, and a lead terminal connected to the terminal connecting electrode by soldering, the terminal connecting electrode and the lead terminal; During soldering, an endless belt is formed from a heat-resistant and corrosion-resistant material, and the parts to be soldered are masked, and the solder residue and flux adhered to the endless belt are removed and flux is cleaned, and when the lead terminals are soldered. A method for manufacturing electronic components that is soldered using a lead terminal floating prevention block and an endless belt receiving block that adjust the temperature to prevent solder plating from melting due to heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2127314A JPH0437469A (en) | 1990-05-16 | 1990-05-16 | Production of electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2127314A JPH0437469A (en) | 1990-05-16 | 1990-05-16 | Production of electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0437469A true JPH0437469A (en) | 1992-02-07 |
Family
ID=14956876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2127314A Pending JPH0437469A (en) | 1990-05-16 | 1990-05-16 | Production of electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0437469A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005096459A1 (en) * | 2004-03-31 | 2005-10-13 | Fci Connectors Singapore Pte Ltd. | Coaxial cable soldering method and equipment |
-
1990
- 1990-05-16 JP JP2127314A patent/JPH0437469A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005096459A1 (en) * | 2004-03-31 | 2005-10-13 | Fci Connectors Singapore Pte Ltd. | Coaxial cable soldering method and equipment |
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