JPH0436237U - - Google Patents

Info

Publication number
JPH0436237U
JPH0436237U JP1990078363U JP7836390U JPH0436237U JP H0436237 U JPH0436237 U JP H0436237U JP 1990078363 U JP1990078363 U JP 1990078363U JP 7836390 U JP7836390 U JP 7836390U JP H0436237 U JPH0436237 U JP H0436237U
Authority
JP
Japan
Prior art keywords
semiconductor device
opening
passivation film
entire surface
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990078363U
Other languages
English (en)
Japanese (ja)
Other versions
JP2513016Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990078363U priority Critical patent/JP2513016Y2/ja
Publication of JPH0436237U publication Critical patent/JPH0436237U/ja
Application granted granted Critical
Publication of JP2513016Y2 publication Critical patent/JP2513016Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10125—Reinforcing structures
    • H01L2224/10126—Bump collar

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1990078363U 1990-07-23 1990-07-23 半導体装置 Expired - Fee Related JP2513016Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990078363U JP2513016Y2 (ja) 1990-07-23 1990-07-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990078363U JP2513016Y2 (ja) 1990-07-23 1990-07-23 半導体装置

Publications (2)

Publication Number Publication Date
JPH0436237U true JPH0436237U (uk) 1992-03-26
JP2513016Y2 JP2513016Y2 (ja) 1996-10-02

Family

ID=31621575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990078363U Expired - Fee Related JP2513016Y2 (ja) 1990-07-23 1990-07-23 半導体装置

Country Status (1)

Country Link
JP (1) JP2513016Y2 (uk)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58125839A (ja) * 1982-01-21 1983-07-27 Nec Corp 半導体装置
JPH02307235A (ja) * 1989-05-23 1990-12-20 Mitsubishi Electric Corp ワイヤボンデイング方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58125839A (ja) * 1982-01-21 1983-07-27 Nec Corp 半導体装置
JPH02307235A (ja) * 1989-05-23 1990-12-20 Mitsubishi Electric Corp ワイヤボンデイング方法

Also Published As

Publication number Publication date
JP2513016Y2 (ja) 1996-10-02

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees