JPH0436145Y2 - - Google Patents
Info
- Publication number
- JPH0436145Y2 JPH0436145Y2 JP1986121117U JP12111786U JPH0436145Y2 JP H0436145 Y2 JPH0436145 Y2 JP H0436145Y2 JP 1986121117 U JP1986121117 U JP 1986121117U JP 12111786 U JP12111786 U JP 12111786U JP H0436145 Y2 JPH0436145 Y2 JP H0436145Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- temporary fixing
- component
- long
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
Ａ 産業上の利用分野
本考案は、長尺の部品を実装するプリント基板
に関し、特に、両端下部に仮止めピンを突設した
長尺の部品を自動半田付け工程を経て実装するた
めのプリント基板の改良に関するものである。[Detailed description of the invention] A. Industrial application field The present invention relates to a printed circuit board on which long parts are mounted, and in particular, the present invention applies an automatic soldering process to long parts with temporary fixing pins protruding from the bottom of both ends. This paper relates to improvements to printed circuit boards for subsequent mounting.
Ｂ 考案の概要
本考案は、両端下部に仮止めピンを突設した長
尺の部品を実装して自動半田付けを施すプリント
基板において、
前記仮止めピンを嵌入させるピン孔を、前記部
品の長手方向へ長い長孔とすると共に、この長孔
の長尺寸法を、自動半田付け時のプリント基板の
熱膨張によるプリント基板と仮止めピンとの相対
移動を許容可能な長さに設定したことにより、
仮止めピンをプリント基板のピン孔に嵌入係止
した状態で自動半田付け工程により端子等の半田
付けを行う際に、半田付けの熱でプリント基板が
熱膨張しても、仮止めピンがピン孔内において部
品の長手方向へ相対移動してプリント基板の撓み
が生じないようにし、これにより部品のプリント
基板からの浮き上がりを阻止するようにしたもの
である。B. Summary of the invention The present invention provides a printed circuit board in which a long component with temporary fixing pins protruding from the bottom of both ends is mounted and automatically soldered, in which the pin hole into which the temporary fixing pin is inserted is placed along the longitudinal side of the component. By making the long hole long in the direction, and setting the long dimension of this long hole to a length that allows for relative movement between the printed circuit board and the temporary fixing pin due to thermal expansion of the printed circuit board during automatic soldering, When soldering terminals, etc. in an automatic soldering process with the temporary fixing pin inserted and locked into the pin hole of the printed circuit board, even if the printed circuit board thermally expands due to the heat of soldering, the temporary fixing pin will not remain pinned. The parts are moved relative to each other in the longitudinal direction within the hole to prevent the printed circuit board from bending, thereby preventing the parts from lifting off the printed circuit board.
Ｃ 従来の技術
従来のプリント基板への長尺の部品の実装につ
いて第２図乃至第５図に示す。第２図は実装状態
を示す斜視図、第３図は仮止めピンの正面図、第
４図はプリント基板の裏面図、第５図は半田付け
完了後のプリント基板の撓み状態を示す正面図で
ある。C. Prior Art Conventional mounting of long components on a printed circuit board is shown in FIGS. 2 to 5. Figure 2 is a perspective view showing the mounted state, Figure 3 is a front view of the temporary fixing pin, Figure 4 is a back view of the printed circuit board, and Figure 5 is a front view showing the deflected state of the printed circuit board after soldering is completed. It is.
第２図乃至第５図において、１は長尺の部品
で、この部品１は両端に下方へ突出する仮止めピ
ン２，２を備え、また長手方向へ列設された多数
の端子３，３……を備えている。 In FIGS. 2 to 5, reference numeral 1 denotes a long component, and this component 1 is provided with temporary fixing pins 2, 2 projecting downward at both ends, and a large number of terminals 3, 3 arranged in a row in the longitudinal direction. It is equipped with...
上記長尺の部品１を実装するプリント基板４
は、仮止めピン２，２を嵌入するための一対の円
形ピン孔５，５と、端子３を挿入するための多数
の挿入孔６，６……とを有する。 Printed circuit board 4 on which the long component 1 is mounted
has a pair of circular pin holes 5, 5 into which the temporary fixing pins 2, 2 are inserted, and a large number of insertion holes 6, 6, . . . into which the terminals 3 are inserted.
しかして、上記部品１をプリント基板４上に実
装する場合には、先ず部品１の端子３をプリント
基板４の挿入孔６に挿入すると共に、仮止めピン
２，２をピン孔５，５に嵌入して半田付け前に部
品１をプリント基板４上に仮止めし、次いで自動
半田付け工程により端子３とプリント基板４上の
ランド等との半田付けを行つて完了する。 When mounting the component 1 on the printed circuit board 4, first insert the terminals 3 of the component 1 into the insertion holes 6 of the printed circuit board 4, and then insert the temporary fixing pins 2, 2 into the pin holes 5, 5. Before fitting and soldering, the component 1 is temporarily fixed on the printed circuit board 4, and then soldering between the terminal 3 and the lands on the printed circuit board 4 is completed by an automatic soldering process.
Ｄ 考案が解決しようとする問題点
上記従来の実装においては、自動半田付けの工
程でプリント基板４が熱により膨張し部品１の長
手方向へ伸長する。ところが、仮止めピン２，２
は固定されているので、プリント基板４の伸長を
抑えようとする。このためプリント基板４は下方
へ逃げて第５図に示すように下方へ撓み、部品１
がプリント基板４から浮き上がつた状態で端子３
の半田付けが完了してしまう。また、この部分で
生じた応力が他の部分で反りとなつてあらわれる
こともある等の問題点がある。D Problems to be Solved by the Invention In the conventional mounting described above, the printed circuit board 4 expands due to heat during the automatic soldering process and extends in the longitudinal direction of the component 1. However, the temporary fixing pins 2, 2
Since it is fixed, the expansion of the printed circuit board 4 is suppressed. Therefore, the printed circuit board 4 escapes downward and is bent downward as shown in FIG.
Terminal 3 is lifted up from printed circuit board 4.
soldering is completed. Further, there is a problem that the stress generated in this part may appear as warpage in other parts.
本考案は上記従来の問題点を解決しようとする
ものである。 The present invention attempts to solve the above-mentioned conventional problems.
Ｅ 問題点を解決するための手段
本考案においては、上記従来の問題点を解決す
るため、仮止めピンを嵌入させるピン孔を、部品
の長手方向へ長い長孔とし、この長孔の長手方向
寸法は、自動半田付け時のプリント基板の熱膨張
によるプリント基板と仮止めピンとの相対移動を
許容可能な長さに設定した。E Means for Solving Problems In the present invention, in order to solve the above-mentioned conventional problems, the pin hole into which the temporary fixing pin is inserted is made into a long hole that is long in the longitudinal direction of the component, and The dimensions were set to allow for relative movement between the printed circuit board and the temporary fixing pins due to thermal expansion of the printed circuit board during automatic soldering.
Ｆ 作用
本考案のプリント基板においては、長尺の部品
の仮止めピンをピン孔に嵌入して自動半田付けを
行つた場合、半田付けの熱でプリント基板が部品
の長手方向に伸長すると、部品の仮止めピンが長
孔から成るピン孔内を長手方向に移動してプリン
ト基板の伸長を許容するから、プリント基板の仮
止めピン間の伸長に伴う応力を抑制して下方への
撓みをなくすことができる。F Effect In the printed circuit board of the present invention, when automatic soldering is performed by inserting temporary fixing pins of long components into pin holes, when the printed circuit board expands in the longitudinal direction of the component due to the heat of soldering, the component The temporary fixing pins move longitudinally within the elongated pin hole to allow the printed circuit board to expand, suppressing the stress caused by the expansion between the temporary fixing pins on the printed circuit board and eliminating downward deflection. be able to.
Ｇ 実施例
第１図に本考案によるプリント基板の一実施例
を示す。同図はプリント基板の裏面図である。G. Embodiment FIG. 1 shows an embodiment of a printed circuit board according to the present invention. This figure is a back view of the printed circuit board.
第１図において、１１はプリント基板で、この
プリント基板１１には、従来と同様に、長尺な部
品１の仮止めピンを２，２を嵌入するための一対
のピン孔１２，１２が形成されている。このピン
孔１２は、ピン２の移動を許容する長尺の部品１
の長手方向へ長い長孔となつている。 In FIG. 1, numeral 11 is a printed circuit board, and this printed circuit board 11 has a pair of pin holes 12, 12 for inserting temporary fixing pins 2, 2 for a long component 1, as in the conventional case. has been done. This pin hole 12 is a long part 1 that allows movement of the pin 2.
The hole is long in the longitudinal direction.
しかして、このピン孔１２の長手方向の寸法
は、次のようにして定められる。なお、ここで、
ｇは仮止めピン２のピン孔１２内での遊び、Ｐは
仮止めピン２，２間の距離をあらわすものとす
る。 Therefore, the longitudinal dimension of this pin hole 12 is determined as follows. Furthermore, here,
Let g represent the play of the temporary fixing pin 2 within the pin hole 12, and P represent the distance between the temporary fixing pins 2, 2.
即ち、プリント基板１１の材質がガラスエポキ
シである場合、その熱膨張率を0.3％〜0.5％とす
ると、
Ｐ×0.003≧ｇ≧Ｐ×0.005
の式を満たすようにｇを設定することによりプリ
ント基板の反りを抑制することがてきる。 That is, when the material of the printed circuit board 11 is glass epoxy and its coefficient of thermal expansion is 0.3% to 0.5%, by setting g to satisfy the formula P×0.003≧g≧P×0.005, the printed circuit board It is possible to suppress the warping of.
次にこの実施例の作用を説明する。この実施例
のプリント基板１１においては、部品１の左右一
対の仮止めピン２，２をピン孔１２，１２に嵌入
して位置決めし、自動半田付けを行つた場合、半
田付けの熱でプリント基板１１が部品１の長手方
向に伸長すると、仮止めピン２が長孔から成るピ
ン孔１２内を長手方向の遊び距離ｇの範囲内で移
動してプリント基板１１の伸長を許容する。従つ
て、プリント基板１１の仮止めピン２，２間での
伸長に伴う下方への撓みをなくすことができる。
自動半田付けが完了すると、仮止めピン２もプリ
ント基板１１に半田付けされ、プリント基板１１
と部品１との結合の機械的強度が高められる。 Next, the operation of this embodiment will be explained. In the printed circuit board 11 of this embodiment, when the pair of temporary fixing pins 2, 2 on the left and right sides of the component 1 are inserted into the pin holes 12, 12 for positioning, and automatic soldering is performed, the printed circuit board 11 extends in the longitudinal direction of the component 1, the temporary fixing pin 2 moves within the pin hole 12, which is an elongated hole, within the range of the play distance g in the longitudinal direction, thereby allowing the printed circuit board 11 to extend. Therefore, it is possible to eliminate downward bending of the printed circuit board 11 due to the expansion between the temporary fixing pins 2, 2.
When the automatic soldering is completed, the temporary fixing pin 2 is also soldered to the printed circuit board 11, and the printed circuit board 11
The mechanical strength of the connection between the component 1 and the component 1 is increased.
なお、ピン孔１２の長手方向の遊び距離ｇは、
プリント基板１１の材質固有の熱膨張率を上記式
に当てはめて個々に設定する必要がある。 Note that the play distance g in the longitudinal direction of the pin hole 12 is
It is necessary to apply the coefficient of thermal expansion specific to the material of the printed circuit board 11 to the above formula and set it individually.
Ｈ 考案の効果
以上のように、本考案においては、仮止めピン
を嵌入させるピン孔を、部品の長手方向へ長い長
孔とすると共に、この長孔の長尺寸法を、自動半
田付け時のプリント基板の熱膨張によるプリント
基板と仮止めピンとの相対移動を許容可能な長さ
に設定したため、仮止めピンをプリント基板のピ
ン孔に嵌入係止した状態で自動半田付け工程によ
り端子等の半田付けを行う際に、半田付けの熱で
プリント基板が熱膨張しても、仮止めピンがピン
孔内において部品の長手方向へ相対移動するの
で、プリント基板の撓みが生じず、従つて、部品
がプリント基板から浮き上がつて取付けられる等
の取付け不良が生じないという効果を奏する。H. Effect of the invention As described above, in the present invention, the pin hole into which the temporary fixing pin is inserted is a long hole that is long in the longitudinal direction of the component, and the long dimension of this long hole is Since the length is set to allow for relative movement between the printed circuit board and the temporary fixing pin due to the thermal expansion of the printed circuit board, the temporary fixing pin is inserted and locked into the pin hole of the printed circuit board, and terminals, etc. are soldered by an automatic soldering process. Even if the printed circuit board expands due to the heat of soldering during soldering, the temporary fixing pin moves relatively in the longitudinal direction of the component within the pin hole, so the printed circuit board does not bend, and the component This has the effect that installation defects such as mounting with the printed circuit board floating up from the printed circuit board do not occur.
第１図は本考案によるプリント基板の一実施例
を示すプリント基板の裏面図、第２図乃至第５図
は従来のプリント基板への長尺の部品の実装につ
いて示すもので、第２図は実装状態を示す斜視
図、第３図は仮止めピンの正面図、第４図はプリ
ント基板の裏面図、第５図は半田付け完了後のプ
リント基板の撓み状態を示す説明図である。
１……部品、２……仮止めピン、１１……プリ
ント基板、１２……ピン孔。
FIG. 1 is a back view of a printed circuit board showing an embodiment of the printed circuit board according to the present invention, and FIGS. 2 to 5 show mounting of long components on a conventional printed circuit board. FIG. 3 is a front view of the temporary fixing pin, FIG. 4 is a back view of the printed circuit board, and FIG. 5 is an explanatory diagram showing the bent state of the printed circuit board after soldering is completed. 1... Part, 2... Temporary fixing pin, 11... Printed circuit board, 12... Pin hole.
Claims (1)
実装して自動半田付けを施すプリント基板におい
て、前記仮止めピンを嵌入させるピン孔を、前記
部品の長手方向へ長い長孔とし、この長孔の長手
方向寸法は、自動半田付け時のプリント基板の熱
膨張によるプリント基板と仮止めピンとの相対移
動を許容可能な長さに設定したことを特徴とする
プリント基板。 In a printed circuit board on which a long component with temporary fixing pins protruding from the bottom of both ends is mounted and automatically soldered, the pin hole into which the temporary fixing pin is inserted is a long hole extending in the longitudinal direction of the component. A printed circuit board characterized in that the longitudinal dimension of the elongated hole is set to a length that allows relative movement between the printed circuit board and the temporary fixing pin due to thermal expansion of the printed circuit board during automatic soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986121117U JPH0436145Y2 (en) | 1986-08-07 | 1986-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986121117U JPH0436145Y2 (en) | 1986-08-07 | 1986-08-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6327074U JPS6327074U (en) | 1988-02-22 |
| JPH0436145Y2 true JPH0436145Y2 (en) | 1992-08-26 |
Family
ID=31010080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986121117U Expired JPH0436145Y2 (en) | 1986-08-07 | 1986-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436145Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6617118B2 (en) * | 2017-06-21 | 2019-12-04 | 矢崎総業株式会社 | Electronic component unit, wire harness, and connector fixing structure |
| JP6617119B2 (en) | 2017-06-21 | 2019-12-04 | 矢崎総業株式会社 | Electronic component unit, wire harness, and connector fixing structure |
-
1986
- 1986-08-07 JP JP1986121117U patent/JPH0436145Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6327074U (en) | 1988-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0436145Y2 (en) | ||
| JP2002171086A (en) | Component | |
| JPH10228959A (en) | Card bus connector and method for using it | |
| JP3012356U (en) | Shield case structure | |
| JPH0337466B2 (en) | ||
| JP2003045509A (en) | Mounting method of connector on printed circuit board and connector | |
| JP3025324U (en) | Connector mounting jig | |
| CN216700442U (en) | Circuit board device mounting structure and circuit board | |
| JP2553104Y2 (en) | Jig for preventing warpage of printed circuit boards | |
| JPS62246278A (en) | Surface mount connector | |
| JPH027513Y2 (en) | ||
| JPS6042475Y2 (en) | printed circuit board | |
| JPH025590Y2 (en) | ||
| JPS61131495A (en) | Printed circuit board | |
| JPH0754978Y2 (en) | Trance | |
| JP2006049170A (en) | Board connector with tine plate | |
| JP3907389B2 (en) | Shield plate | |
| JPS598376Y2 (en) | Hybrid IC mounting structure | |
| JPS635277Y2 (en) | ||
| JPH0590778A (en) | Electronic component with shield case and lead frame | |
| JPH10247768A (en) | Printed board | |
| JPH07202121A (en) | Semiconductor device | |
| JPH03205769A (en) | Clip lead for hybrid integrated circuit | |
| JPH025497A (en) | Parts mounting structure | |
| JPS6132450A (en) | Structure of flat package ic and mounting method thereof |