JPH04359487A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPH04359487A
JPH04359487A JP13436091A JP13436091A JPH04359487A JP H04359487 A JPH04359487 A JP H04359487A JP 13436091 A JP13436091 A JP 13436091A JP 13436091 A JP13436091 A JP 13436091A JP H04359487 A JPH04359487 A JP H04359487A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
main body
perforation
body side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13436091A
Other languages
Japanese (ja)
Inventor
Tomoyuki Fukuda
智之 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Priority to JP13436091A priority Critical patent/JPH04359487A/en
Publication of JPH04359487A publication Critical patent/JPH04359487A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Abstract

PURPOSE:To prevent a plating layer from remaining at a perforation on a main body side when a disposable printed wiring board is cut off by providing an idle hole which is paired with the perforation at the disposable printed wiring board, fitting separation auxiliary parts which interlock both holes of the perfo rated and the idle hole which oppose each other, and then soldering the fitted portion into each hole. CONSTITUTION:A jumper wire 8 is fitted into a perforation 3 and an idle hole 4 which are paired each other and both are soldered for mounting. Then, a main body side printed wiring board 1 and a disposable printed wiring board 2 are separated. In this caee, since the soldering and copper-plating layer within the perforation 3 has a stronger fixing strength to a jumper wire 8 than that to the main body side printed wiring board 1, it is separated from the main body side printed wiring board 1 along with the disposable printed wiring board 2 and the jumper wire 8, thus preventing a solder and copper-plated layer from remaining within the main body side perforation 9. Therefore, the copper-plated layer and solder of the main body side perforation can positively be removed to the disposable printed wiring board side by utilizing auxiliary parts for separation without increasing the number of processes.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、プリント配線基板に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to printed wiring boards.

【0002】0002

【従来の技術】従来、一般に、プリント配線基板の製造
時はもとより、製造後のプリント配線基板に対し電子部
品を自動機により実装する時に、位置決めを行うための
孔が前記プリント配線基板に設けられている。位置決め
用孔を有する部分は、最終的には不用となるもので、ミ
シン目孔により本体側基板から分離して捨てられる。と
ころが、前記プリント配線基板、特に複合両面スルーホ
ール基板にミシン目孔を形成した後、両面側配線パター
ンの相互間を導通させるためのスルーホール用孔等にメ
ッキ処理を施すと、ミシン目孔にもメッキ層が付着し、
位置決め用孔を有する捨て基板を本体から切り離した時
に、本体側の切離し端面、つまり破断したミシン目孔の
何れかの部分にメッキ層が付着して残る場合があり、こ
のメッキ層の残存により、プリント配線基板自体の絶縁
性が低下し、その他好ましくない事態の発生が予測され
る。
2. Description of the Related Art Conventionally, holes for positioning are generally provided in a printed wiring board not only when manufacturing a printed wiring board but also when mounting electronic components on the manufactured printed wiring board using an automatic machine. ing. The portion having the positioning hole will eventually become unnecessary, and will be separated from the main body side substrate by the perforation hole and discarded. However, when perforations are formed on the printed wiring board, especially a composite double-sided through-hole board, and plating is applied to the through-hole holes for establishing electrical continuity between the wiring patterns on both sides, the perforations are The plating layer also adheres,
When a disposable board with a positioning hole is separated from the main body, a plating layer may remain attached to the cut-off end face of the main body, that is, any part of the broken perforation, and due to the remaining plating layer, It is predicted that the insulation properties of the printed wiring board itself will deteriorate and other undesirable situations will occur.

【0003】そこで、従来は、ミシン目孔により捨て基
板を本体から切離す時点において、そのミシン目孔にメ
ッキ層を有しない製造方法が採用されていた。
[0003] Conventionally, therefore, a manufacturing method has been adopted in which a plating layer is not provided at the perforation at the time when the sacrificial substrate is separated from the main body by the perforation.

【0004】0004

【発明が解決しようとする課題】しかしながら、前記製
造方法としては、スルーホール用孔等にメッキ処理を施
した後、更にミシン目孔を形成するための2次加工を行
っており、この結果、工数が増えて、コスト高を招いて
いた。
[Problems to be Solved by the Invention] However, in the above manufacturing method, after plating the holes for through holes, etc., secondary processing is performed to form perforations, and as a result, The number of man-hours increased, leading to higher costs.

【0005】本発明は、上述した問題点を解決するため
になされたものであり、スルーホール用孔にメッキ処理
をするプリント配線基板において、一般に広く使用され
ている印刷工法をそのまま利用し、かつ工程数の増加を
招くこともなく、本体から捨て基板を切り離すとき、本
体側のミシン目孔にメッキ層が残存するといったことを
確実に防止し得るプリント配線基板を提供することを目
的とする。
The present invention has been made to solve the above-mentioned problems, and utilizes the widely used printing method as it is in printed wiring boards in which through-hole holes are plated. To provide a printed wiring board that can reliably prevent a plating layer from remaining in perforations on the main body side when a waste board is separated from the main body without increasing the number of steps.

【0006】[0006]

【課題を解決するための手段】この目的を達成するため
に本発明は、本体側基板と捨て基板との間に分離用のミ
シン目孔を設けたプリント配線基板を対象として、特に
、前記捨て基板に、前記ミシン目孔と対をなす捨て孔を
設け、互いに相対する前記ミシン目孔と捨て孔とに、そ
の両孔間を連結するための分離補助部品を嵌入し、その
分離補助部品の各嵌入部分を前記各孔内に半田付けした
ことを特徴とするものである。
[Means for Solving the Problems] In order to achieve this object, the present invention targets a printed wiring board in which perforations for separation are provided between a main body side board and a disposable board, and particularly, A second hole is provided in the substrate to form a pair with the perforation hole, and a separation auxiliary part for connecting the two holes is inserted into the perforation hole and the second hole which are opposite to each other, and the separation auxiliary part is Each fitting portion is soldered into each hole.

【0007】[0007]

【作用】上記の構成を有する本発明のプリント配線基板
において、分離する際、ミシン目孔内の半田及びミシン
目孔内壁の銅メッキは、強固に分離補助部品の足に固定
されているため、使用する本体側基板から、銅メッキ及
び半田が分離補助部品と共に捨て基板側に全て付着し、
使用する本体側基板のミシン目孔に残らない。
[Function] In the printed wiring board of the present invention having the above configuration, when separating, the solder in the perforation hole and the copper plating on the inner wall of the perforation hole are firmly fixed to the legs of the separation auxiliary part. All the copper plating and solder from the main body side board to be used, along with the separation auxiliary parts, will adhere to the discarded board side.
It will not remain in the perforations of the main body side board to be used.

【0008】[0008]

【実施例】以下、本発明を具体化した一実施例を図面を
参照して説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment embodying the present invention will be described below with reference to the drawings.

【0009】図1は、本発明を実施するために具体化し
たプリント配線基板を示し、その本体側基板1と捨て基
板2との間に分離用のミシン目孔3及びスリット9が設
けられている。捨て孔4が各ミシン目孔3に1個宛相対
して捨て基板2に設けられている。部品実装用孔5、ミ
シン目孔3及び捨て孔4は、全て銅メッキ層を有するス
ルーホールとなっている。前記部品実装用孔5は電子部
品7をその実装に際して嵌入するものであり、また、前
記各ミシン目孔3とこれ等に相対する捨て孔4とに、そ
の両孔3、4間を連結するためのジャンパー線8(分離
用補助部品を構成する)が嵌入されるようになっている
FIG. 1 shows a printed wiring board embodying the present invention, in which perforations 3 and slits 9 for separation are provided between a main body side board 1 and a disposable board 2. There is. A sacrificial hole 4 is provided in the sacrificial substrate 2, one for each perforation hole 3. The component mounting hole 5, the perforation hole 3, and the sacrificial hole 4 are all through holes having a copper plating layer. The component mounting hole 5 is used to insert the electronic component 7 when mounting the component, and the holes 3 and 4 are connected to each of the perforations 3 and the sacrificial hole 4 facing them. A jumper wire 8 (constituting an auxiliary part for separation) is inserted.

【0010】次に、プリント配線基板を製造する方法に
ついて、特に本発明の主要部を説明する。
Next, a method for manufacturing a printed wiring board will be described, particularly the main parts of the present invention.

【0011】図2に示すように、前記本体側基板1の部
品実装用孔5に電子部品7を嵌入し、また、互いに対を
なすミシン目孔3と捨て孔4とに前記分離補助部品であ
るジャンパー線8を嵌入し、いずれも半田付け実装する
。その後に、本体側基板1と捨て基板2を分離する。 図3は、捨て基板2を分離する過程を示し、ミシン目孔
3内の半田及び銅メッキ層は、本体側基板1への固定強
度よりも、ジャンパー線8への固定強度が強いため、捨
て基板2及びジャンパー線8と共に、本体側基板1から
分離される。よって、図4に示すように本体側ミシン目
孔9内には半田及び銅メッキ層が残らない。
As shown in FIG. 2, the electronic component 7 is inserted into the component mounting hole 5 of the main body side board 1, and the separation auxiliary component is inserted into the perforation hole 3 and the waste hole 4, which are paired with each other. A certain jumper wire 8 is inserted and both are soldered and mounted. Thereafter, the main body side substrate 1 and the disposable substrate 2 are separated. FIG. 3 shows the process of separating the disposable board 2. The solder and copper plating layer in the perforation hole 3 have a stronger fixing strength to the jumper wire 8 than the fixing strength to the main body side board 1, so It is separated from the main body side substrate 1 together with the substrate 2 and jumper wires 8. Therefore, as shown in FIG. 4, no solder or copper plating layer remains within the perforations 9 on the main body side.

【0012】0012

【発明の効果】以上説明したことから明かなように、本
発明のプリント配線基板によれば、2次加工等コストア
ップ無しに、本体側ミシン目孔の銅メッキ層及び半田を
、分離用補助部品を利用して捨て基板側に確実に取り除
くことが出来る。
Effects of the Invention As is clear from the above explanation, according to the printed wiring board of the present invention, the copper plating layer and solder in the perforations on the main body side can be removed as an auxiliary material for separation without increasing costs such as secondary processing. You can use the parts to reliably remove them to the disposal board.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】図1は第1の実施例のプリント配線基板である
FIG. 1 shows a printed wiring board of a first embodiment.

【図2】図2は、前記プリント配線基板に、電子部品及
び分離補助部品であるジャンパー線を固定した図である
FIG. 2 is a diagram in which electronic components and jumper wires, which are separation auxiliary components, are fixed to the printed wiring board.

【図3】図3は、捨て基板を分離する過程を示す図であ
る。
FIG. 3 is a diagram showing a process of separating a waste substrate.

【図4】図4は、捨て基板分離後の図である。FIG. 4 is a diagram after the waste substrate is separated.

【符号の説明】[Explanation of symbols]

1  本体側基板 2  捨て基板 3  ミシン目孔 4  捨て孔 8  ジャンパー線(分離補助部品) 1 Main body side board 2 Discarded board 3 Perforation hole 4. Disposable hole 8 Jumper wire (separation auxiliary part)

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  本体側基板と捨て基板との間に分離用
のミシン目孔を設けたプリント配線基板において、前記
捨て基板に、前記ミシン目孔と対をなす捨て孔を設け、
互いに相対する前記ミシン目孔と捨て孔とに、その両孔
間を連結するための分離補助部品を嵌入し、その分離補
助部品の各嵌入部分を前記各孔内に半田付けしたことを
特徴とするプリント配線基板。
1. A printed wiring board in which a perforation for separation is provided between a main body side board and a sacrificial board, wherein the sacrificial board is provided with a sacrificial hole that pairs with the perforation,
A separation auxiliary part for connecting the two holes is fitted into the perforation hole and the waste hole which are opposed to each other, and each fitted part of the separation auxiliary part is soldered into each of the holes. Printed wiring board.
JP13436091A 1991-06-05 1991-06-05 Printed wiring board Pending JPH04359487A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13436091A JPH04359487A (en) 1991-06-05 1991-06-05 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13436091A JPH04359487A (en) 1991-06-05 1991-06-05 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH04359487A true JPH04359487A (en) 1992-12-11

Family

ID=15126556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13436091A Pending JPH04359487A (en) 1991-06-05 1991-06-05 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH04359487A (en)

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