JPH0435867U - - Google Patents

Info

Publication number
JPH0435867U
JPH0435867U JP7792190U JP7792190U JPH0435867U JP H0435867 U JPH0435867 U JP H0435867U JP 7792190 U JP7792190 U JP 7792190U JP 7792190 U JP7792190 U JP 7792190U JP H0435867 U JPH0435867 U JP H0435867U
Authority
JP
Japan
Prior art keywords
carrier
sides
substrate
polishing
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7792190U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7792190U priority Critical patent/JPH0435867U/ja
Publication of JPH0435867U publication Critical patent/JPH0435867U/ja
Pending legal-status Critical Current

Links

JP7792190U 1990-07-23 1990-07-23 Pending JPH0435867U (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7792190U JPH0435867U (OSRAM) 1990-07-23 1990-07-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7792190U JPH0435867U (OSRAM) 1990-07-23 1990-07-23

Publications (1)

Publication Number Publication Date
JPH0435867U true JPH0435867U (OSRAM) 1992-03-25

Family

ID=31620741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7792190U Pending JPH0435867U (OSRAM) 1990-07-23 1990-07-23

Country Status (1)

Country Link
JP (1) JPH0435867U (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082890A1 (ja) * 2003-03-20 2004-09-30 Shin-Etsu Handotai Co. Ltd. ウエーハ保持用キャリア並びにそれを用いた両面研磨装置及びウエーハの両面研磨方法
JP2016022542A (ja) * 2014-07-17 2016-02-08 信越半導体株式会社 ウェーハ保持用キャリア並びにそれを用いたウェーハの両面研磨方法及びウェーハ保持用キャリアの評価方法並びに設計方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082890A1 (ja) * 2003-03-20 2004-09-30 Shin-Etsu Handotai Co. Ltd. ウエーハ保持用キャリア並びにそれを用いた両面研磨装置及びウエーハの両面研磨方法
JP2016022542A (ja) * 2014-07-17 2016-02-08 信越半導体株式会社 ウェーハ保持用キャリア並びにそれを用いたウェーハの両面研磨方法及びウェーハ保持用キャリアの評価方法並びに設計方法

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