JPH04354350A - Wafer transfer device - Google Patents

Abstract

PURPOSE:To provide a wafer transfer method and a device which can simultaneously and automatically transfer a plurality of wafers stored in a basket. CONSTITUTION:If one attaches a basket 2, which stores a plurality of wafers W..., to a drum (other vessel) 3 in open condition and rotates these basket 3 and the drum 3 by a specified angle with a driving source (rotating means) 7, all the wafers W... in the basket 2 shift to the drum with their own weights. If one closes the drum 3 by an opening and closing means after that, the transfer work of the wafers W... is finished, and the wafers W... inside the basket 2 are transferred simultaneously and automatically to the drum 3, and the automation of the wafer manufacture materializes.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer method and apparatus for simultaneously and automatically transferring a plurality of wafers housed in a basket to another container in the semiconductor manufacturing field.

0002

2. Description of the Related Art Semiconductor wafers used as substrates for semiconductor devices are produced by slicing a single crystal ingot of silicon or the like in a direction perpendicular to its rod axis, and then lapping, etching, annealing, etc. Obtained by processing such as polishing.

Incidentally, although each of the above-mentioned various processes has been automated, the reality is that a series of processes has not yet been completely automatically performed inline.

0004

SUMMARY OF THE INVENTION It is therefore desirable to perform a series of processes fully automatically, but in order to achieve this, it is necessary to automate the wafer transfer work. For example, in order to transfer multiple wrapped wafers stored in a basket to an etching process and automatically etch them, it is necessary to automatically transfer the wafers in the basket to the drum of the etching machine. .

The present invention has been made in view of the above circumstances, and the object thereof is to provide a wafer transfer method and a wafer transfer method that can simultaneously and automatically transfer a plurality of wafers housed in a basket. The goal is to provide equipment.

[0006]

[Means for Solving the Problems] In order to achieve the above object, the method of the present invention involves attaching a basket containing wafers to another container in an open state, rotating the basket together with the container through a predetermined angle, and then moving the basket inside the basket. After the wafers are transferred into the container, the basket is removed from the container and the container is closed.

The present invention also provides a wafer transfer device comprising a transfer means for transferring a basket containing wafers, an attachment/detachment means for attaching and detaching the basket to and from a container, and a means for rotating and opening/closing the container. It is characterized by what it did.

[0008]

[Operation] If a basket containing a plurality of wafers is attached to another open container and the basket and container are rotated together by a predetermined angle by a rotating means, all the wafers in the basket will be absorbed by their own weight. to move it into the container. Thereafter, when the container is closed by the opening/closing means, the wafer transfer operation is completed, and the wafers in the basket are simultaneously and automatically transferred to the container, realizing automation of the wafer manufacturing process.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a side view of a wafer transfer apparatus 1 according to the present invention, and FIG. 2 is a front view of the same apparatus 1.

The wafer transfer device 1 according to this embodiment is for simultaneously and automatically transferring a plurality of wrapped wafers W stored in a basket 2 to a drum 3 of an etching machine. This is provided in a state where it is immersed in pure water in the transfer tank 4.

In FIG. 2, reference numerals 5 and 6 denote drum chucks coaxially provided facing each other, and these drum chucks 5 and 6 are moved forward and backward in the direction of arrow a in the figure by drive sources 7 and 8, respectively. , are rotationally driven in the direction of arrow b. A basket setting device 9 is connected to both the drum chucks 5, 6 so as to rotate together, and the basket setting device 9 is connected to the drum chucks 5, 6 in the radial direction (arrow c in the figure) by a drive source 10. A basket setting table 11 is provided which can be moved in the direction of the basket. A stopper 1 is provided at the bottom of this basket set table 11.
2 and 13 are protruded, and the same basket set stand 11
is provided with a basket fixing device 14. The basket fixing device 14 has a basket presser 15 that moves forward and backward relative to the stopper 12 in the direction of arrow d in the figure.

Further, in FIG. 1, 16 is a positioning device for the basket 2, and this is a positioning device for the basket 2.
is located directly below the drum 3, in the direction of the arrow e shown in the figure (
It has a rod 17 that moves forward and backward in a direction perpendicular to the direction of arrow d.

By the way, the drum 3 is supported and transported by a transport robot 20, and the drum chucks 5, 6
The structure of the drum 3 will be explained based on FIGS. 3 and 4. In addition, FIG. 3 is a side view of the drum 3 (
4), FIG. 4 is a sectional view taken along the line BB in FIG. 3.

In the figure, reference numeral 21 denotes a housing consisting of half-disc-shaped side plates 21a and 21b arranged parallel to each other and facing each other, to which rotating shafts 22 and 23 are coaxially connected. . Also, both side plates 21a, 2 of the housing 21
Between 1b, four rollers 24 are installed parallel to each other on the same circumference and rotatably supported, and between these rollers 24, three reinforcing bars 25 are installed parallel to each other. It is constructed in

A plurality of ring-shaped comb teeth 24a are formed in the axial direction on the outer periphery of the intermediate portion of each roller 24 in the axial direction, and a wafer W is inserted between the plurality of comb teeth 24a. Engagement grooves 24b to be supported at intervals are formed. Further, a small-diameter gear 26 is connected to one end of the side plate 21b of each roller 24 that projects outward.

On the other hand, a movable housing 27 constituting an opening/closing mechanism for the drum 3 is rotatably supported on the rotating shafts 22 and 23, and a side plate 27a of the movable housing 27
, 27b, a set bar 28 is rotatably supported and installed. The gear 26 is attached to one end of the set bar 28 that protrudes outward from the movable housing 27.
The same gear 29 is connected.

Further, gears 30 and 31 of different sizes and diameters are rotatably supported on the outer periphery of the rotating shaft 23, and the gear 26 is integrally supported on the outer periphery of the large diameter gear (center gear) 30. ...and the gear 29 are in mesh with each other.

It should be noted that rectangular protrusions 5a projecting from the end recesses of the drum chucks 5 and 6 are provided on the respective end surfaces of the rotating shaft 32 of the movable housing 27 and the rotating shaft 23 of the housing 21.
, 6a (see Fig. 2) is to be engaged with the engagement recess 3 having a rectangular cross section.
2a and 23a are respectively formed.

Next, FIG.
This will be explained with reference to FIGS. Incidentally, FIGS. 5 to 12 are explanatory diagrams showing the wafer transfer operation according to its procedure.

First, the drive sources 7 and 8 are driven to rotate the drum chucks 5 and 6, and the basket setting base 11 of the basket setting device 9 connected to the drum chucks 5 and 6 is moved to the position shown by the broken line in FIG. to the solid line position.

Next, the basket 2 containing a plurality of wafers W (for example, 20 wafers) that have been wrapped and cleaned before etching in the previous process is transferred to a basket setting table as shown in FIG. 6 by a transport system (not shown). 11, and drive the positioning device 16 to move the rod 17 as shown in FIG.
When the basket 2 is pushed and brought into contact with the stopper 13, the basket 2 is positioned. Then, in this state, the basket fixing device 14 shown in FIG. 2 is driven to fix the basket 2 to the stopper 12 by the basket presser 15.

On the other hand, the empty drum 3 is removed from the etching machine (not shown), transported to the wafer transfer device 1 by the drum transport robot 20, and supported at both ends by both drum chucks 5 and 6. That is, when the drum 3 is positioned as shown by the solid line in FIG. chucking, protrusions 5a protruding from the drum chucks 5, 6;
6a is an engagement recess 3 formed on the end face of the rotating shafts 32, 23.
2a and 23a, respectively.

When the basket 2 is fixedly set on the basket setting table 11 as shown in FIG.
As shown in FIG. 8, the movable housing 27 of the drum 3 is in a state of being tilted toward the housing 21, and the drum 3 is open downward. In this state, the drive source 10 of the basket setting device 9 is driven, and the basket setting table 11
8 together with the basket 2, the upper opening of the basket 2 is fitted into the opening of the drum 3, and the basket 2 is attached to the drum 3.

Next, if the drive sources 7 and 8 are driven to rotate the drum 3 and the basket 2 integrally by an angle θ1 to the position shown in FIG. It moves to the drum 3 side and is neatly stored at a predetermined position within the drum 3.

Thereafter, the basket setting device 9 is driven again, and the empty basket 2 is placed on the drum 3 as shown in FIG.
, and return it to its original position as indicated by the broken line.
The drive sources 7 and 8 are driven again to rotate the drum 3 by an angle θ2 to the position shown in FIG. 11. Finally, if the drive source 7 is driven to rotate the movable housing 27 by an angle θ3 as shown in FIG. 2
8, and the transfer of the wafers W from the basket 2 to the drum 3 is completed here.

[0027] Then, the drum 3 containing the wafers W...
is removed from the drum chucks 5 and 6 and transported by the drum transport robot 20 to an etching machine (not shown).

As described above, according to this embodiment, all the wafers W in the basket 2 are simultaneously and automatically transferred to the drum 3, thereby realizing automation of the manufacturing process of the wafers W. .

In the above embodiment, the drum 3 is removed from the etching machine and transported to the transfer tank 4 by the drum transport robot 20. Of course, it is also possible to transport the object to the position shown in FIG.

[0030]

As is clear from the above description, according to the present invention, a basket containing wafers is attached to another open container, and the basket is rotated by a predetermined angle together with the container to remove the wafers in the basket. After transferring the wafers into the container, the basket is removed from the container and the container is closed, resulting in the effect that multiple wafers housed in the basket can be transferred simultaneously and automatically. .

[Brief explanation of drawings]

FIG. 1 is a side view of a wafer transfer apparatus according to the present invention.

FIG. 2 is a front view of the wafer transfer device according to the present invention.

[Fig. 3] Side view of the drum (view in the direction of arrow A-A in Fig. 4)
It is.

FIG. 4 is a sectional view taken along line BB in FIG. 3;

FIG. 5 is an explanatory diagram showing wafer transfer work according to its procedure.

FIG. 6 is an explanatory diagram showing wafer transfer work according to its procedure.

FIG. 7 is an explanatory diagram showing a wafer transfer operation according to its procedure.

FIG. 8 is an explanatory diagram showing wafer transfer work according to its procedure.

FIG. 9 is an explanatory diagram showing wafer transfer work according to its procedure.

FIG. 10 is an explanatory diagram showing a wafer transfer operation according to its procedure.

FIG. 11 is an explanatory diagram showing wafer transfer work according to its procedure.

FIG. 12 is an explanatory diagram showing wafer transfer work according to its procedure.

[Explanation of symbols]

1 Wafer transfer device 2 Basket 3 Drum (other container) 7
Drive source 8 Drive source 9 Basket setting device 11
Basket setting stand 14 Basket fixing device 27 Movable housing 28 Set bar W Wafer

Claims (3)

[Claims] Claim 1: A method for automatically transferring a plurality of wafers housed in a basket to another container, comprising:
After attaching the basket containing the wafers to another open container and rotating the basket together with the container at a predetermined angle to transfer the wafers in the basket into the container,
A wafer transfer method characterized by removing a basket from a container and closing the container. 2. An apparatus for automatically transferring a plurality of wafers housed in a basket to another container, comprising:
a transport means for transporting a basket containing wafers;
A wafer transfer device comprising: a means for attaching and detaching the basket to and from a container; a means for rotating the container; and a means for opening and closing the container. 3. The other container is an etching drum, and the etching drum includes a housing comprising side plates facing each other and arranged parallel to each other, and a rotating shaft coaxially connected to the housing. , a plurality of rollers rotatably supported between both side plates of the housing and having a plurality of ring-shaped comb teeth formed in the axial direction on the outer periphery; The small diameter gear worn,
a movable housing rotatably supported on the rotating shaft;
a set bar rotatably supported by a shaft between both side plates of the movable housing; a small-diameter gear connected to one end of the set bar protruding outward from the movable housing; 3. The wafer transfer apparatus according to claim 2, further comprising a large-diameter gear with which the gear meshes with the outer periphery of the wafer transfer apparatus.