JPH04352461A - Structure for mounting integrated circuit board - Google Patents

Abstract

PURPOSE:To obtain a highly reliable structure for mounting boards of integrated circuits, by which the manufacturing processes, the material costs and the sizes of the boards of integrated circuit modules are reduced and their mounting density is increased, and which is applied to the boards of the integrated circuits in various commercial electronic apparatuses. CONSTITUTION:A structure for mounting boards of integrated circuits, comprises an IC4, whose lead terminal 3 is bent upward once and thereafter, is bent downward again. With the part bent upward of the lead terminal 3, connected is a board 1 for integrated circuits, and with the part bent downward of the lead terminal 3, connected is a board 2 for integrated circuits.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for an integrated circuit board used in consumer electronic equipment and the like.

0002

[Prior Art] In recent years, conductors, resistors, etc. are formed on circuit boards using the thick film printing method, and ICs and chip components (transistors, capacitors, coils, resistors), etc. are mounted on the circuit boards and integrated. Miniaturization and high-density packaging were achieved by using circuit module boards.

A conventional integrated circuit board mounting structure will be described below. FIG. 2 is a cross-sectional view of a conventional integrated circuit board mounting structure. In FIG. 2, an IC 4 and a chip component 5
is mounted on the land 6 of the integrated circuit module board 1 and fixed with solder. The integrated circuit module board 1 and an external integrated circuit board 2 are connected via COM terminals 3 provided around the integrated circuit module board 1.

The operation of the integrated circuit board mounting structure constructed as described above will be described below. First, the lead terminals 3 of the IC 4 fixed to the integrated circuit module board 1 are connected to the chip components 5 of the integrated circuit module board 1.
Connect to the COM terminal 7 through the COM terminal 7. Further, the lead terminals 3, which do not connect to the chip components 5 but directly connect to the comb terminals 7, are also connected to the integrated circuit board 2 via the comb terminals 7 provided around the integrated circuit module board 1.

[0005]

[Problems to be Solved by the Invention] However, in the above configuration, since the integrated circuit board 2 and the integrated circuit module board 1 are connected by the COM terminals 7 provided around the periphery of the integrated circuit module board 1, the number of COM terminals makes it difficult for the integrated circuit module board 1 to Since the board size is determined, the integrated circuit module board 1 cannot be miniaturized and mounted with high density, and the process and material costs for forming the COM terminals 7 cannot be reduced, nor can the defect rate be reduced. had.

The present invention solves the above-mentioned conventional problems and proposes a mounting structure for an integrated circuit board.

[0007]

[Means for Solving the Problem] A mounting structure for an integrated circuit board in which an electronic component provided with a lead terminal is mounted on an integrated circuit board, the electronic component being mounted on an integrated circuit board by one lead terminal provided on the electronic component. and a plurality of integrated circuit boards.

[0008]

[Function] With this structure, the lead terminals of electronic components are connected to the connections between multiple integrated circuit boards, allowing high-density mounting of the boards, reducing the number of com terminals, reducing material costs, and reducing the defective rate. Can be done.

[0009]

Embodiment An embodiment of the present invention will be described below with reference to FIG.

In FIG. 1, the lead terminals 3 of the IC 4 are bent upward and then bent downward. The upper lead terminals 3 are connected to the integrated circuit module board, and the lower lead terminals 3 are connected to the integrated circuit board 2.

The mounting structure of the integrated circuit board constructed as described above will be explained with reference to FIG. First, IC4
The lead terminals 3 bent upward are connected to an integrated circuit module board 1, on which a chip component 5 is mounted, and which is equipped with a function trim for adjusting the characteristics of a single IC. Also,
Lead terminals 3 in the lower direction are connected to the integrated circuit board 2 .

As described above, according to this embodiment, the integrated circuit module substrate 1 is connected to the lead terminal 3 in the upper direction of the IC 4.
By connecting the integrated circuit board 2 to the lead terminals 3 in the lower direction, the integrated circuit module board 1 is miniaturized, and the lead terminals 3 bent in the lower direction are connected to the com terminals 7 Because it performs the role of COM terminal, it can be achieved without a COM terminal.

[0013]

As described above, the present invention connects the tip of the lead terminal to the second integrated circuit board, and connects any part of the lead terminal other than the tip to the first integrated circuit board. As a result, it is possible to realize an excellent integrated circuit board mounting structure that can achieve miniaturization, high-density mounting, and elimination of com terminals on the integrated circuit board.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing one embodiment of the integrated circuit board mounting structure of the present invention.

[Figure 2] Cross-sectional view showing the mounting structure of a conventional integrated circuit board

[Explanation of symbols]

1 Integrated circuit module board 2 Integrated circuit board 3 Lead terminal 4 IC 5 Chip parts 6 Land

Claims (2)

[Claims] 1. A mounting structure for an integrated circuit board in which an electronic component provided with a lead terminal is mounted on an integrated circuit board, wherein one lead terminal provided on the electronic component connects the electronic component to a plurality of electronic components. A mounting structure for an integrated circuit board, characterized in that it is electrically connected to an integrated circuit board. 2. A semiconductor device comprising a lead terminal, an electronic component provided with a plurality of the lead terminals, and a first integrated circuit board and a second integrated circuit board arranged to sandwich the electronic component. Claim 1, wherein the tip of the lead terminal is connected to the second integrated circuit board, and any part other than the tip of the lead terminal is connected to the first integrated circuit board. Mounting structure of the described integrated circuit board.