JPH04352351A - Package for integrated circuit - Google Patents

Abstract

PURPOSE:To provide a package, for integrated circuit, wherein leads connected in their end parts can easily be handled even when they are formed in such a way that an insulating substrate is divided into sides as units. CONSTITUTION:A group of leads 5 formed by dividing an insulating substrate 1 into sides as units are united in such a way that end parts of lead frames 4 are bonded by using connection members 8.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an integrated circuit package in which leads extend outward from all sides of an insulating substrate.

0002

[Prior art] As a prior art, Japanese Patent Application Laid-Open No. 61-220
363 and Japanese Unexamined Patent Publication No. 3-29353 are known. These technologies involve connecting leads at the ends and dividing the connected leads into each side of the insulating substrate.In this way, the leads connected at the ends are divided into multiple parts. By providing this, it is possible to reduce the cost of a press die when forming a lead, and also to easily clad the end of the lead with a clad tape, thereby making it possible to keep the manufacturing cost of the lead low.

0003

[Problem to be Solved by the Invention] In the conventional technology, a plurality of leads (lead groups) that are divided into each side of an insulating substrate and integrated are each independent, so they can be attached to a jig independently as well. It was installed. For this reason, there are problems in that it is difficult to handle, such as requiring a lot of effort to attach the lead group to the jig. Also, after attaching the lead group to the insulating board,
Since each lead group was independent, if an external force was applied to the lead group during handling or transportation, the external force was likely to be applied to one lead group, resulting in the problem of deformation of the leads. Was.

0004

OBJECTS OF THE INVENTION The present invention has been made in view of the above circumstances, and its object is to provide an integrated circuit package in which the leads can be easily handled even if the leads connected at the ends are divided. It's on offer.

[0005]

Means for Solving the Problems In order to achieve the above object, the integrated circuit package of the present invention employs the following technical means. An integrated circuit package includes a rectangular insulating substrate on which an integrated circuit is mounted, and a plurality of leads fixed to the insulating substrate and extending outward from the four sides of the insulating substrate. The leads are connected at their ends, and the connected leads are provided as a lead group on each side of the insulating substrate, and these four lead groups are joined and integrated, respectively.

[0006]

[Operations and Effects of the Invention] In the integrated circuit package of the present invention, the lead group is joined and integrated, so when setting the leads on the jig, the leads can be mounted on the jig in one operation. This makes the lead easier to handle. In addition, since each lead group is joined and integrated, even if an external force is applied to the lead group after the lead group is attached to the insulating board, it is dispersed to the lead group to which the external force is not directly applied, resulting in Deformation can be suppressed.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an integrated circuit package of the present invention will be explained based on an embodiment shown in the drawings. [Configuration of Embodiment] FIGS. 1 to 3 show an embodiment of the present invention, and FIG. 1 shows an exploded perspective view of a jig, a lead, and an insulating substrate. The integrated circuit package of this embodiment has a plurality of leads 2 radially bonded to the surface of an insulating substrate 1.

The insulating substrate 1 is a square ceramic sintered substrate on which an integrated circuit (not shown) is mounted. A depression 3 in which an integrated circuit is mounted is formed in the center of the front surface (lower surface in FIG. 1) of the insulating substrate 1.

The leads 2 are connected to the terminals of the motherboard when the integrated circuit package is mounted on the motherboard, and are bonded to the surface of the insulating substrate 1 by glass sealing. The outer circumferential side of the leads 2 is directed outward from each of the four sides of the insulating substrate 1, and the leads 2 for each side of the insulating substrate 1 have a number, pitch, width, length, thickness, etc.
Each side has the same shape. For this reason, lead 2
are formed on each side and bonded to the surface of the insulating substrate 1. The leads 2 formed on each side are connected at their outer ends by a lead frame 4 to form a lead group 5. Note that the lead frame 4 is cut before mounting on the motherboard. The end of each lead 2, which becomes the inner side when bonded to the insulating substrate 1, is connected by wire to the integrated circuit mounted on the insulating substrate 1, and the surface is coated with aluminum to improve bonding performance. ing.

The manufacturing technology of the lead 2 will be briefly explained. The lead 2 is formed from a thin plate 6 made of, for example, 42 alloy (see FIG. 2) using a press processing technique. What is formed using this press processing technology is
As shown in FIG. 2, this is a lead group 5 in which leads 2 on each side are connected by a lead frame 4. The aluminum cladding formed on the ends of the leads 2 is made by applying an aluminum cladding tape 7 to a thin plate 6 made of 42 alloy before pressing, and then forming the lead group 5 by pressing. It is formed at the end of the lead 2. Note that the lead 2 may be made of other materials such as Kovar.
It may be formed. The lead group 5 formed in this way is
As shown in FIG. 3, after the four lead frames 4 are arranged with their ends facing inward, the lead frames 4 of each lead group 5 are connected via a connecting member 8 using a joining technique such as spot welding, laser welding, or brazing. are joined and integrated. In addition,
The material of the connecting member 8 is the lead frame 4 such as 42 alloy.
It is best to have a coefficient of thermal expansion close to that of This is to prevent misalignment due to thermal expansion differences in the furnace when each lead 2 is bonded to the insulating substrate 1.

Each lead 2 of the integrated lead group 5 is
After alignment on the surface of the insulating substrate 1 whose surface is coated with glass, the glass is melted in a furnace and sealed and bonded to the surface of the insulating substrate 1. This bonding technique will be briefly explained. do. The insulating substrate 1 and the four integrated lead groups 5 are aligned using one jig 9, as shown in FIG. This jig 9 is used to mount the insulating substrate 1 with its surface facing downward after mounting the leads 2 on its upper surface. A substrate positioning section 11 is provided for positioning the substrate. Lead positioning part 1
0 is provided on the outside of the convex portion formed on the surface of the jig 9, and is in contact with the inside of each corner of the connected lead frame 4. The substrate positioning section 11 is abutted only at each corner of the insulating substrate 1, and is provided inside the convex section. Note that the lower part where the insulating substrate 1 is arranged is formed into an opening 12 so that the surface of the insulating substrate 1 and the jig 9 do not come into contact with each other.

When joining the lead group 5 and the insulating substrate 1, first, the integrated lead group 5 is placed on the lead positioning portion 10 of the jig 9 with the aluminum clad side facing downward. Insert. Next, the board positioning section 11
The insulating substrate 1 is fitted inside with the glass coated side facing downward. In this state, the alignment between each lead 2 and the insulating substrate 1 is completed. Then, through the furnace,
The lead 2 is sealed within the glass by melting the glass, and the lead 2 is bonded to the insulating substrate 1.

[Effects of the Embodiment] In the integrated circuit package of this embodiment, the four lead groups are joined and integrated, so when setting the lead 2 on the jig 9, the lead 2
can be attached to the jig 9 in one operation. Therefore, handling of the lead 2 becomes easy. In addition, since each lead group 5 is joined and integrated, even if an external force is applied to the lead group 5 after the leads 2 are joined, the external force is dispersed to the lead group 5 to which the external force is not directly applied, causing deformation of the lead 2. The occurrence of can be suppressed.

(Second Embodiment) FIG. 4 shows an exploded perspective view of an insulating substrate 1, a lead 2, and a jig 9 showing a second embodiment. In this embodiment, an insulating substrate 1 is positioned and mounted on a jig 9 with its surface facing up, and a lead group 5 integrated from above is mounted.
It is used to position and attach the The substrate positioning part 11 of this embodiment has the same size as the outer shape of the insulating substrate 1, and
This is a recess into which the insulating substrate 1 is fitted, and the depth is the same as the thickness of the insulating substrate 1. The lead positioning section 10 is a pin formed on the surface of the jig 9, and is arranged in a positioning hole 13 formed in the lead frame 4 to position the lead 2.

(Modification) In this embodiment, the lead frames are joined by a connecting member and the lead group is integrated.
A step may be provided so that the end portions of the lead frames are thin, and the lead frames may be joined and integrated. In this embodiment, an example was shown in which four lead groups of the same shape were joined and integrated, but lead groups whose opposite sides have the same shape may be joined and integrated.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of a jig, a lead, and an insulating substrate showing a first embodiment.

FIG. 2 is a plan view of a lead group during manufacture.

FIG. 3 is a plan view of an integrated lead group.

FIG. 4 is an exploded perspective view of a jig, a lead, and an insulating substrate showing a second embodiment.

[Explanation of symbols]

1 Insulating substrate 2 Lead 5 Lead group

Claims (1)

[Claims] 1. An integrated circuit package comprising a rectangular insulating substrate for mounting an integrated circuit, and a plurality of leads fixed to the insulating substrate and extending outward from the four sides of the insulating substrate, the package comprising: The leads are connected at their ends, and the connected leads are provided as a lead group on each side of the insulating substrate, and the four lead groups are respectively joined and integrated. Package for integrated circuits.