JPH04352346A - Automatic arrangement and wiring apparatus - Google Patents

Abstract

PURPOSE:To form, at a functional block level, a pad, for test use, wherein a pin-putting operation can be easily performed by means of a prober which confirms the operation of an LSI. CONSTITUTION:A pad addition means, for test use, which automatically adds, at a functional block level, a pad for test use in order to perform a pin-putting operation by means of a prober on the basis of pad information 18, for test use, which indicates whether the pad for test use can be added or not is installed inside an automatic arrangement and wiring apparatus 1. When the operation of a functional block inside an LSI is confirmed, the pin-putting operation by means of the prober can easily be performed.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic placement and routing apparatus capable of providing test pads for checking the operation of a functional block level LSI when designing an integrated circuit such as an LSI.

0002

2. Description of the Related Art FIG. 5 is a block diagram showing the configuration of a conventional automatic placement and wiring device. In the figure, 51 is an automatic placement and wiring device, 2 is an automatic placement means, 3 is an automatic wiring means, 4 is connection information, 5 is physical information, 6 is a design rule, and 7 is a layout pattern. FIG. 6 is an example of a functional block layout pattern diagram created using a conventional automatic placement and routing device. In the figure, 52 is a functional block;
9 is a standard cell, 10 is an output pin, 11 is an input pin, 12
is the wiring. Also, Figure 7 shows L using function blocks.
This is an example of an SI layout pattern diagram, and in the diagram,
53 is an LSI, 52-1 to 52-3 are functional blocks, 1
6 is an input bonding pad, and 17 is an output bonding pad.

Next, the operation of the conventional automatic placement and wiring apparatus will be explained. The automatic placement and routing device 51 receives connection information 4,
After reading physical information 5 and design rules 6 such as wiring width and wiring spacing, automatic placement means 2 first places standard cells 9, input pins 11, and output pins 10. Next, between the standard cells 9 where the automatic wiring means 3 are arranged,
Then, wiring is automatically performed between the standard cell 9 and the input pin 11 or output pin 10 according to the connection information 4 so as to satisfy the design rule 6, and a layout pattern 7 as shown in FIG. 6 is output as the wiring result. do.

Layout pattern 7 of LSI 13 (FIG. 7)
) is created using a functional block level layout pattern 7 as shown in FIG. 6 created by the automatic placement and routing device 1. To check the operation of the LSI completed using layout pattern 7, apply a signal to the input bonding pad 16 using an LSI tester, and then apply a signal to the output bonding pad 1.
This is done by checking whether the signal is output as desired from step 7. If it does not work as desired, please check the LSI
Apply a probe to the internal wiring of the device, check the operation of the internal signals, and search for areas (functional blocks) that do not operate. For example, when checking the operation of the functional block 52-2 when the LSI 13 in FIG. Use a microscope to place the needle on the prober and check the operation.

[0005]

[Problems to be Solved by the Invention] Conventional automatic placement and wiring devices are configured as described above, and when an LSI does not operate as desired, a probe is applied to the internal wiring of the LSI with a propper. I was checking the internal wiring signals. However, the internal wiring is usually very thin (2 μm to 5 μm).
μm), there was a problem that the needle of the prober was misaligned and the work could not be performed as desired. In addition, even if you search for thick wiring parts (about 10 μm) manually, it is not easy because the layout pattern is complex, and there is also the problem that a lot of time is spent putting the needle on the prober and checking the operation of internal signals. there were.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an automatic placement and wiring device that can create a layout pattern that facilitates needle placement with a prober. .

[0007]

[Means for Solving the Problems] An automatic placement and routing device according to the present invention provides placement means (automatic placement and routing) for placing standard cells, input pins, and output pins in units of functional blocks of an integrated circuit according to design rules 6 set in advance. Means 2
), the standard cells, input pins,
Wiring means for wiring output pins to each other (automatic wiring means 3)
The automatic placement and wiring apparatus 1 includes test pad information 18 indicating whether or not a test pad can be added to the output pin, and determines the position of a predetermined output pin based on this test pad information. A test pad adding means 19 for adding a test pad to the test pad is provided.

[0008]

[Operation] In the automatic placement and wiring device 1 according to the present invention, a test pad is placed at a predetermined output pin position based on test pad information 18 indicating whether or not a test pad can be added to an output pin of a functional block. Since test pad adding means 19 for adding pads is provided, test pads 20 can be added for each functional block, and LSI
To facilitate needle placement work with a prober to check the operation function of the device.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a functional block diagram showing the configuration of an embodiment of the present invention, in which the same reference numerals are given to parts having the same functions as in the prior art. In FIG. 1, 1 is an automatic placement and wiring device, 2 is an automatic placement means, 3 is an automatic wiring means, 19 is a test pad adding means, 4 is connection information, 5 is physical information, 6 is a design rule, and 7 is a layout pattern. , 18 indicate test pad information.

The automatic placement means 2 of the automatic placement and wiring device 1 includes:
Standard cells, input pins, and output pins are arranged in functional blocks of an LSI (integrated circuit) in accordance with design rules 6 such as preset wiring widths and wiring spacings. Automatic wiring means 3 connects standard cells, input pins, and output pins arranged in a functional block to each other so as to satisfy design rules 6 set in advance according to connection information 4. For example, connections are made between standard cells and between standard cells and input pins or output pins.

The test pad information 18 is information indicating whether or not a test pad can be added to the output pin arranged in the functional block, and is based on the data of the automatic wiring results routed by the automatic wiring means 3. This is information for searching for output pin data and determining whether a test pad can be added to the found output pin data. The test pad adding means 19 adds a test pad to a predetermined output pin position of the functional block based on the test pad information 18.

FIG. 2 is an example of a layout pattern diagram created for a functional block by the automatic placement and wiring apparatus of FIG. 1, and FIG. 3 is an example of a layout pattern diagram of an LSI incorporating the functional blocks of FIG. In FIG. 2, 21
is the outer frame created by the automatic wiring means 3, 9 is the standard cell, 10
11 is an output pin, 11 is an input pin, 12 is a wiring, 20 is a test pad, and 22 is an outer frame created by the test pad adding means 19.

Standard cell 9, input pin 11, output pin 10
is arranged at a predetermined position of the functional block 8 by the automatic arrangement means 2. Further, the automatic wiring means 3 connects the wiring 12 between the standard cells 9 and between the standard cells 9 and the input pin 11 or the output pin 10. The outer frame 22 is created by the test pad adding means 19 in order to provide the test pad 20 on the output pin 10.

In FIG. 3, 13 is an LSI, 8-1 to 8
-3 is a functional block, 16 is an input bonding pad, and 17 is an output bonding pad. L.S.
When creating a layout pattern for I13, function blocks 8-1 to 8-3 as explained in FIG.
3, and connect it to the input bonding pad 1.
6 and output bonding pads 17 are installed at predetermined locations and connected to each other by wiring.

FIG. 4 is a flowchart showing the operation of the test pad adding means of the automatic placement and wiring apparatus shown in FIG. The operation of the entire apparatus and the operation of the test pad adding means in the automatic placement and wiring apparatus of FIG. 1 will be described below with reference to FIGS. 1 to 4.

When the automatic placement and wiring device 1 reads connection information 4, physical information 5, and design rules 6 such as wiring width and wiring spacing, the automatic placement means 2 places standard cells 9, input pins 11, and output pins 10. do. Next, the automatic wiring means 3 connects the standard cells 9 arranged by the automatic arrangement means 2 and between the standard cells 9 and the input pins 11 or output pins 10 according to the design rules according to the connection information 4. Wire to satisfy 6. At this time, the automatic wiring means 3 creates an outer frame 21 for providing the test pad 20 on the output pin 10.

[0017] Automatic placement means 2 and automatic wiring means 3
After completing the arrangement and wiring of the standard cell 9, input pin 11 and output pin, test pad addition means 1
9 works. The test pad adding means does not perform any processing if the test pad 20 is not added, but if the test pad 20 is added, it adds the test pad 20 to the output pin 10 and connects the outer frame 21 created by the automatic wiring means 3. After erasing, the outer frame 22 is created again, and a functional block level layout pattern 7 as shown in FIG. 2 is output. L shown in Figure 3
When creating the layout pattern 7 of the SI 13, a layout pattern diagram as shown in FIG. 3 is created using the functional block level layout pattern 7 created by the automatic placement and routing device 1.

[0018] LSI created using layout pattern 7
13 is confirmed by applying a signal to the input bonding pad 16 using an LSI tester and confirming whether the signal from the output bonding pad 17 is output as desired. If the operation does not work as desired, use the test pad 2 of function blocks 8-2 and 8-3.
0 with a prober, check the operation of the functional blocks, and look for parts that are not working.

That is, for example, when the LSI 13 in FIG. 3 does not operate due to a factor in the functional block 8-2, when checking the operation of the functional block 8-2, the signal attached to the output pin of the functional block 8-2 is used. Test pad 20
Then check the operation of the LSI by applying the needle with a prober.

Next, the operation of the test pad adding means will be explained using the flowchart of FIG. First, the test pad means 19 determines whether or not to perform the process of adding a test pad (step S1). If the process is not to be performed (NO), the process ends without doing anything, and if the process is to be performed (YE).
S) reads the test pad information 18 (step S).
2). Next, data of the output pin 10 is searched from the automatic wiring result data of the test pad information 18 (step S
3). If there is no data on output pin 10 (step S4
If NO), the outer frame 21 of the functional block 8 is regenerated, the wiring is corrected, the layout pattern 7 is output, and the process ends (steps S5 to S7).

[0021] Also, if there is data on output pin 10 (
If the test pad 20 can be added to the data of the output pin 10 that has been found (step S8), if the test pad 20 cannot be added because it violates design rule 6 ( If NO), an error message is output (step S9), and if it can be added, a test pad 20 is added on the same wiring layer as the output pin 10 (step S10). After the test pad addition means 19 performs the above processing on all output pins 10, it erases the outer frame 21 created by the automatic wiring means 3 and replaces the outer frame 22 including the test pads 20. Create and outer frame 22
A layout pattern 7 is output in which the wiring of input pins 11 and output pins 10 that are not in contact with is extended to the outer frame 22, and the test pad creation process is completed.

[0022]

As described above, according to the present invention, there is provided a placement means for arranging standard cells, input pins, and output pins in units of functional blocks of an integrated circuit according to preset design rules; In addition to wiring means for connecting standard cells, input pins, and output pins to each other so as to satisfy the specified design rules, the test pad has test pad information indicating whether or not a test pad can be added to the output pin. Since we newly provided a test pad adding means for adding a test pad to a predetermined output pin position based on this test pad information, L
When confirming the operation of a functional block inside an integrated circuit such as an SI, there is an effect that the needle application work with a prober can be easily and reliably performed.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention.

FIG. 2 is an example of a layout pattern diagram of functional blocks created using the automatic placement and routing apparatus of FIG. 1;

FIG. 3 is an example of a layout pattern diagram of an LSI incorporating the functional blocks of FIG. 2;

FIG. 4 is a flowchart showing the operation of a test pad adding means in the automatic placement and routing apparatus of FIG. 1;

FIG. 5 is a block diagram showing the configuration of a conventional automatic placement and routing device.

FIG. 6 is an example of a functional block layout pattern diagram created using the automatic placement and routing apparatus of FIG. 5;

7 is an example of a layout pattern diagram of an LSI incorporating the functional blocks of FIG. 6; FIG.

[Explanation of symbols]

1 Automatic placement and wiring device 2 Automatic placement means 3 Automatic wiring means 4 Connection information 5 Physical information 6 Design rules 7 Layout pattern 8 Functional block 9 Standard cell 10 Output pin 11 Input pin 12 Wiring 13 LSI 8-1 to 8-3 Functional blocks 16 Input bonding pad 17 Output bonding pad 18 Test pad information 19 Test pad addition means 20 Test pad

Claims (1)

[Claims] 1. Arrangement means for arranging standard cells, input pins, and output pins in units of functional blocks of an integrated circuit in accordance with preset design rules; An automatic placement and routing device equipped with wiring means for wiring cells, input pins, and output pins to each other has test pad information indicating whether or not a test pad can be added to the output pin; 1. An automatic placement and wiring device comprising: a test pad adding means for adding a test pad to a predetermined output pin position based on test pad information.