JPH043500Y2 - - Google Patents
Info
- Publication number
- JPH043500Y2 JPH043500Y2 JP500987U JP500987U JPH043500Y2 JP H043500 Y2 JPH043500 Y2 JP H043500Y2 JP 500987 U JP500987 U JP 500987U JP 500987 U JP500987 U JP 500987U JP H043500 Y2 JPH043500 Y2 JP H043500Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal substrates
- insulating film
- space
- substrates
- conductive path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 50
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 43
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000010396 two-hybrid screening Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP500987U JPH043500Y2 (fr) | 1987-01-16 | 1987-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP500987U JPH043500Y2 (fr) | 1987-01-16 | 1987-01-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63114038U JPS63114038U (fr) | 1988-07-22 |
| JPH043500Y2 true JPH043500Y2 (fr) | 1992-02-04 |
Family
ID=30786193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP500987U Expired JPH043500Y2 (fr) | 1987-01-16 | 1987-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH043500Y2 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2810453B2 (ja) * | 1989-11-16 | 1998-10-15 | 三洋電機株式会社 | 混成集積回路装置 |
-
1987
- 1987-01-16 JP JP500987U patent/JPH043500Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63114038U (fr) | 1988-07-22 |
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