JPH04348153A - Phenol resin composition for laminate - Google Patents

Abstract

PURPOSE:To obtain a phenol resin composition for laminate having excellent tracking resistance and low-temperature punchability and excellent balance of other characteristics. CONSTITUTION:(A) A phenol resin is blended with (B) 5-30wt.% melamine resin and (C) 5-20wt.% urea resin. A melamine modified phenol resin, urea modified phenol resin or melamine-urea co-condensed resin is usable in the above range of ratio.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenolic resin composition for laminates having excellent tracking resistance and low-temperature punching workability.

0002

2. Description of the Related Art In recent years, electronic devices have made remarkable progress and become more diverse, and various strict conditions have come to be imposed on the component materials used therein. Among these, one of the requirements for substrates that is currently becoming more demanding is tracking resistance as a countermeasure against fire accidents in high voltage applications such as televisions. Polyester resins and melamine-modified phenolic resins are used to improve tracking resistance.

0003

[Problems to be Solved by the Invention] However, although paper-based laminates using polyester resin have excellent tracking resistance, they do not have sufficient moisture resistance and also have drawbacks such as warping during soldering. be. Although melamine-modified phenolic resin is effective in tracking resistance, it has the drawback of being susceptible to cracking due to brittleness during punching.

The present invention has been made to eliminate the above-mentioned drawbacks, and has excellent tracking resistance and punching workability.
It is also an object of the present invention to provide a phenolic resin composition for laminates that has good and well-balanced other properties.

[0005]

[Means for Solving the Problem] As a result of intensive research to achieve the above object, the present inventor discovered that the above object could be achieved by modifying phenolic resin with melamine resin and urea resin. It is a completed invention.

That is, the present invention has (A) a phenol resin, (B) a melamine resin, and (C) a urea resin as essential components, and the above-mentioned (B) is added to the entire resin composition.
This is a phenolic resin composition for a laminate, characterized in that the melamine resin (C) is blended in an amount of 5 to 30% by weight, and the urea resin (C) is blended in an amount of 5 to 20% by weight.

The present invention will be explained in detail below.

The phenolic resin (A) used in the present invention broadly includes all phenolic resins commonly used for laminates. Further, the phenolic resin may be modified, and oil-modified phenolic resin is particularly preferably used in terms of punching workability. These phenolic resins can be used alone or in combination of two or more.

The melamine resin (B) used in the present invention is a resin containing a methylol group obtained by subjecting an aldehyde to a condensation reaction with melamine or a guanamine such as formguanamine, acetoguanamine, or benzoguanamine. It also includes methylated melamine resins, butylated melamine resins, etc. in which the methylol groups of this resin are etherified with methanol, butanol, etc., and these can be used alone or in a mixture of two or more. The blending ratio of the melamine resin is preferably such that the resin solid content is 5 to 30% by weight based on the entire resin composition. If the proportion is less than 5% by weight, it has no effect on tracking resistance, and if it exceeds 30% by weight, low-temperature punching workability is poor, which is not preferable.

The urea resin (C) used in the present invention is a resin containing a methylol group obtained by subjecting urea and aldehyde to a condensation reaction. It includes methylated urea resin, butylated urea resin, etc. in which the methylol group of the resin is etherified with methanol, butanol, etc., and these can be used alone or in a mixture of two or more types. The blending ratio of the urea resin is preferably such that the resin solid content is 5 to 20% by weight based on the entire resin composition. If the proportion is less than 5% by weight, there is no effect on tracking resistance or low-temperature punching workability, and if the proportion is less than 5% by weight,
Exceeding this is not preferable because heat resistance decreases.

[0011] In addition, melamine-modified phenol resin, urea-modified phenol resin, melamine-urea cocondensation resin, etc. modified in the same ratio as the phenol resin, melamine resin, and urea resin can be used instead of the phenol resin, melamine resin, and urea resin. It can be used for.

The phenolic resin composition for laminates of the present invention contains a phenol resin, a melamine resin, and a urea resin as essential components, but a flame retardant and other components may be added as necessary unless it contradicts the purpose of the present invention. Can be blended. A phenolic resin composition for a laminate can be easily produced by blending these components.

[0013]

[Function] The phenolic resin composition for laminates of the present invention achieves the object by blending a phenol resin, a melamine resin, and a urea resin. That is, the phenol nuclei in the phenol resin are easily carbonized, and when carbonized, the tracking resistance decreases. On the other hand, although the melamine core of melamine resin improves tracking resistance, it becomes hard and brittle and reduces low-temperature punching workability. Phenol for laminated boards that prevents this and has an imino group-containing urea resin that is effective in tracking resistance, has excellent tracking resistance and low-temperature punching workability, and has a good balance with other properties. A resin composition could be obtained.

[0014]

[Examples] Next, the present invention will be explained in detail with reference to Examples, but the present invention is not limited to the following Examples. [A] Production of phenol resin Place 250 g of phenol in a four-necked flask with a condenser.
, cresol 340g, nonylphenol 300g
, 350 g of tung oil and 720 g of 37% formalin were added, monomethylamine was added to adjust the pH to 6,
While stirring, the mixture was heated to 100°C and reacted for 3 hours. Then, dehydrated under reduced pressure to make toluene/methanol = 7/
3 Diluted with mixed solvent, resin solid content 55%, viscosity 2.
3 poise (25℃) Gelation time 2 minutes 10 seconds (150
An oil-modified phenolic resin solution was prepared at 10°C. [B] Production of melamine resin A four-necked flask with a condenser was charged with 310 g of melamine and 1200 g of 37% formalin, and monoethylamine was added to adjust the pH to 7.
The mixture was heated to ℃ and allowed to react for 4 hours. Thereafter, the resin was dehydrated under reduced pressure and diluted with methanol to give a resin solid content of 55% and a viscosity of 1.
0 poise (25℃), gelation time 1 minute 50 seconds (15
A melamine resin solution was prepared at a temperature of 0°C. [C] Production of urea resin In a four-necked flask with a condenser, 240 g of urea and 3
1300 g of 7% formalin was charged, monoethylamine was added to adjust the pH to 7, and the mixture was heated to 70° C. with stirring and reacted for 3 hours. After that, it was dehydrated under reduced pressure and diluted with methanol, and the resin solid content was 55%, the viscosity was 0.8 poise (at 25°C), and the gelation time was 2 minutes and 30 seconds (at 150°C).
) was produced.

EXAMPLE A phenol resin composition for a laminate was prepared by blending a phenol resin, a melamine resin, a urea resin, and other components into the composition shown in Table 1.

Comparative Examples 1 to 2 A phenolic resin composition for a laminate was manufactured by blending each component according to the composition shown in Table 1.

The phenolic resin compositions for laminates produced in Examples and Comparative Examples 1 and 2 were applied and impregnated onto 10 mils kraft paper to produce prepregs with a resin content of 50% by weight and a microwave flow of 8%. . Next, 8 sheets of this prepreg were layered with a 35 μm thick adhesive-coated copper foil, and 170
A copper-clad laminate having a thickness of 1.6 mm was manufactured by integrally molding the product under heat and pressure at 100 kg/cm2 at 100 kg/cm2 for 75 minutes. Regarding these copper-clad laminates, water absorption rate, insulation resistance,
Tests were conducted on solder heat resistance, flame resistance, tracking resistance, and punching workability. The results are shown in Table 1, and the present invention was excellent in tracking resistance and punching workability, and the remarkable effects of the present invention could be confirmed.

[0018]

[Table 1] *1: Manufactured by Toto Kasei Co., Ltd., bromine-based flame retardant, trade name, *2
: Manufactured by Daiichi Kogyo Seiyaku Co., Ltd., tetrabromodiphenyl ether, trade name, *3 : Cresyl diphenyl phosphate, *4 :
Measured according to JIS-C-6481, *5: 260°C
*6: Measured according to UL94. *7: Measured with pattern spacing of 0.5 mm and other conditions in accordance with IEC Publication 112.
*8: 1.78 mm without defects such as cracks
The surface temperature of a laminate that allows IC pitch punching.

[0019]

Effects of the Invention As is clear from the above explanation and Table 1, the phenolic resin composition for laminates of the present invention has excellent tracking resistance and low-temperature punching workability, and also has other properties that are not impaired. It is well-balanced without being overwhelming.

Claims (1)

[Claims] Claim 1: (A) phenolic resin, (B) melamine resin, and (C) urea resin are essential components, and the above (B)
A phenolic resin composition for a laminate, characterized in that it contains the melamine resin of (C) in an amount of 5 to 30% by weight, and the urea resin of (C) in an amount of 5 to 20% by weight.