JPH03181545A - Phenolic resin composition for lamination - Google Patents

Abstract

PURPOSE:To obtain a phenolic resin composition for lamination having excellent tracking resistance, low-temperature punchability, heat-resistance and moisture- resistance by compounding specific amounts of melamine resin and polymide resin to phenolic resin. CONSTITUTION:The objective composition is produced by compounding (A) a phenolic resin with (B) 5-30wt.% of a melamine resin and (C) 5-40wt.% of a polyamide resin produced by reacting a polyamine with a polymerized fatty acid. The sum of B and C is 10-70wt.%.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention (Industrial Application Field) The present invention relates to a phenolic resin composition for lamination, which has excellent tracking resistance, low-temperature punching workability, etc.

(Prior Art) The development of electronic devices in recent years has been remarkable and diversified, and various strict conditions have been imposed on the component materials used in these devices. Currently, the characteristics required for paper-based phenolic resin @ tensioned laminates include good low-temperature punching processability for high-density printed wiring boards, and dimensional stability against heat during processing and moisture absorption during storage. The good news is that there is little change in electrical characteristics due to heating and moisture absorption, and that soldering
Excellent heat resistance in reflow soldering (including reflow soldering, etc.)
In addition to being free from warping, there is also an increasing demand for improved tracking resistance as a countermeasure against fire accidents in high voltage applications such as televisions.

In order to satisfy these demands, phenolic resins are modified in various ways, such as epoxy modification to improve heat resistance and moisture resistance, and melamine modification to improve tracking resistance. ing.

(Problems to be Solved by the Invention) However, although epoxy modification of phenolic resin has excellent effects on heat resistance and moisture resistance, it has the opposite effect on low-temperature punching workability, which is another required property. The disadvantage is that the punching temperature does not drop. Further, although melamine modification is effective in improving tracking resistance, it has the disadvantage that cracks are likely to occur due to brittleness during punching.

The present invention has been made in order to eliminate the above-mentioned drawbacks, and has excellent l-7 kinging resistance and low-temperature punching workability, as well as good sharpness, moisture resistance, electrical properties, and flammability. 6 [Summary of the Invention 1 (Means for Solving the Problems) As a result of extensive research aimed at achieving the above object, the present inventor has developed a melamine resin composition. The present invention has been completed based on the discovery that the above object can be achieved by modifying a phenolic resin with a specific polyamide resin.

That is, the present invention includes (A,) a phenolic resin (B) a melamine resin (C) a polyamide resin in which a polyamine and a polymerized fatty acid are reacted as an essential component, and the melamine resin of the above (B) and the above ( The total amount of C) polyamide resin is 10
This is a phenolic resin composition for lamination, characterized in that it contains ~70% by weight.

The (A) phenolic resin used in the present invention is usually
Contains all phenolic resins used for low-temperature punching that do not inhibit low-temperature punching processability. Further, the phenol resin may be modified, and oil-modified phenol resin can be particularly preferably used. These phenolic resins can be used alone or in a mixture of two or more.

The melamine resin (B) used in the present invention is a melamine resin containing a methylol group by condensing melamine or a guanamine such as formuguanamine, acetoguanamine, or benzoguanamine with an aldehyde, and etherifying the methylol group with methanol, butanol, etc. Examples include methylated melamine resins, butylated melamine resins, etc., and these can be used alone or in combination of two or more kinds.

The blending ratio of melamine resin is 5 to 5 to the resin composition.
It is desirable to blend 30% by weight; if the proportion is 5% by weight, it has no effect on tracking resistance, and
If it exceeds % by weight, the low-temperature punching processability will be poor, which is not preferable.

It is also possible to use one portion of melamine-modified phenol resin in place of (A> and (B)), which is obtained by modifying (A>phenol resin) and (B) melamine resin in the same ratio of 5 to 30% by weight.

The polyamide resin (C) used in the present invention is a polyamide resin obtained by a condensation reaction of a polyamine and a polymerized fatty acid, and specific examples include SUNMID.
Examples include E305, 310, 330°325 (manufactured by Sanwa Kagaku Kogyo Co., Ltd., trade name), and these can be used alone or in a mixture of two or more. It is desirable that the blending ratio of the polyamide resin is 5 to 40% by weight based on the resin composition.If this ratio is 5% by weight without grooves, it will have no effect on low-temperature punching property, If it exceeds the amount, impregnating properties into the paper base material will decrease, and heat resistance, moisture resistance, etc. will decrease, which is not preferable.

The total blending ratio of melamine resin and polyamide resin is
It is desirable to blend it in a proportion of 10 to 70% by weight based on the resin composition. If the proportion is less than 10% by weight, it will have no effect on tracking resistance and punching processability, and
This is because if it exceeds 0% by weight, impregnating properties and low-temperature punching workability become low F, which is not preferable.

The phenolic resin composition for the M layer of the present invention contains a phenol resin, a melamine resin, and a polyamide resin as essential components.
Flame retardants and other components may be added and blended within limits that do not contradict the purpose of the present invention. By blending these essential components and other optional components, a phenol VtI fat composition for lamination can be easily produced.

(Function) Since the phenol core is easily carbonized and the tracking resistance decreases, a melamine core that improves the tracking resistance is introduced. Introducing melamine cores deteriorates punching workability. To prevent this, Wamide resin was added in Step 1 to obtain a good balance of tracking resistance, punching workability, and other properties. .

(Examples) Next, the present invention will be specifically explained by examples, but the present invention is not limited by the following examples.

(1) Production of phenolic resin (a) Production of oil-modified phenol 161 fat solution In a fourth flask with a condenser, 250 g of phenol, 3409 cresol, 300 g of nonylphenol, and 350 g of paulownia extract.
and 37% formalin 720Q, and after adding monomethylamine and adjusting to pH=6, 100%
The reaction was carried out at ℃ for 3 hours. It was dehydrated under reduced pressure and diluted with a toluene/methanol-7/3 mixed solvent, with a resin solid content of 55% by weight, a viscosity of 2.3 poise (25°C), and a gelation time of 2 minutes and 10 seconds (150'C). An oil-modified phenolic resin solution was produced.

(b) Production of melamine-modified phenolic resin Melamine 3859, phenol 50
0g, 75g of nonylphenol and 1050g of 37% formalin, added monoethylamine and heated to 0H.
After adjusting the temperature to 7, the reaction mixture was stirred and heated to 9°C for 4 hours. Thereafter, the resin was dehydrated under reduced pressure and diluted with methanol, resulting in a resin solid content of 55% by weight and a viscosity of 1.2 poise (25°C).
), a melamine-modified phenol resin solution with a gelation time of 2 minutes and 20 seconds (150°C) was produced.

(II) Production of melamine resin Condenser 7f 4-hole flask, melamine 3+Of
J and 37% formalin 12001J were added, monoethylamine was added to adjust p 1-(-7, and the mixture was heated to 80°C with stirring and reacted for 4 hours.
Thereafter, the mixture was dehydrated under reduced pressure and diluted with methanol to produce a melamine resin solution having a resin solid content of 55% by weight, a viscosity of 1.0 poise (25°C), and a gelation time of 1 minute and 50 seconds (150°C).

Examples 1-2 A phenol resin composition for the 8F layer was manufactured by blending a phenol resin, a melamine resin, and a polyamide resin into the composition shown in Table 1.

Comparative Examples 1 to 2 A phenolic resin composition for lamination was manufactured in the same manner as in the example using the composition shown in Table 1.

The phenolic resin compositions for lamination produced in Examples 1 and 2 and Comparative Examples 1 and 2 were coated and impregnated on 10 mils 7971 paper, with a resin content of 50% by weight and a range of 70-8%.
prepreg was made. Next, 8 sheets of this prepreg were layered with a 35 μm thick adhesive-coated copper foil, and heated at 170°C for 1 hour.
A @ tension laminate with a thickness of 1.6111 mm was manufactured by integrally heat-pressing molding under the conditions of 00 kg/c12 for 75 minutes.

The copper-clad laminate was tested for water absorption, insulation resistance, fire resistance, flame resistance, tracking resistance, and punching workability. The results are shown in Table 1, and the present invention was excellent in tracking resistance and punching workability, and the effects of the present invention were confirmed.

*1: Manufactured by Sanwa Chemical Industry Co., Ltd., product name.

*2: Manufactured by Tobu Kasei Co., Ltd., product name.

*3: Tetrabromodiphenyl ether manufactured by Daiichi Kogyo Seiyaku Co., Ltd., trade name.

*4 Cresyl diphenyl phosphate.

*5: Water absorption rate, insulation resistance, and heat resistance are in accordance with JIS C6
48 (measured by.

*6: Measured by UL94.

*7: Pattern spacing is 0.511, other conditions are IE
Measure according to CPU Publication 112.

*8: The surface temperature of a laminate plate that can be punched at an IC pitch of 1.78 nm without generating defects such as cracks was measured.

[Effect of the invention] As is clear from the above explanation and Table 1, the $
Phenol resin composition for IN has excellent tracking resistance and low-temperature punching workability, and other properties are also excellent without being impaired, and the properties are well balanced.

Claims (1)

[Scope of Claims] 1 (A) Phenol resin (B) Melamine resin (C) A polyamide resin obtained by reacting a polyamine with a polymerized fatty acid is an essential component, and the melamine resin of (B) and the ( The total amount of polyamide resin in C) is 10~
A phenolic resin composition for lamination, characterized in that it contains 70% by weight.