JPH0434741U - - Google Patents

Info

Publication number
JPH0434741U
JPH0434741U JP1990076378U JP7637890U JPH0434741U JP H0434741 U JPH0434741 U JP H0434741U JP 1990076378 U JP1990076378 U JP 1990076378U JP 7637890 U JP7637890 U JP 7637890U JP H0434741 U JPH0434741 U JP H0434741U
Authority
JP
Japan
Prior art keywords
semiconductor device
mounting board
mounting
metallized part
pattern portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990076378U
Other languages
English (en)
Japanese (ja)
Other versions
JP2526566Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990076378U priority Critical patent/JP2526566Y2/ja
Publication of JPH0434741U publication Critical patent/JPH0434741U/ja
Application granted granted Critical
Publication of JP2526566Y2 publication Critical patent/JP2526566Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/5445—
    • H10W90/754—

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1990076378U 1990-07-18 1990-07-18 半導体装置の実装基板 Expired - Lifetime JP2526566Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990076378U JP2526566Y2 (ja) 1990-07-18 1990-07-18 半導体装置の実装基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990076378U JP2526566Y2 (ja) 1990-07-18 1990-07-18 半導体装置の実装基板

Publications (2)

Publication Number Publication Date
JPH0434741U true JPH0434741U (enExample) 1992-03-23
JP2526566Y2 JP2526566Y2 (ja) 1997-02-19

Family

ID=31617794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990076378U Expired - Lifetime JP2526566Y2 (ja) 1990-07-18 1990-07-18 半導体装置の実装基板

Country Status (1)

Country Link
JP (1) JP2526566Y2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007329502A (ja) * 2007-08-16 2007-12-20 Toshiba Corp 発光装置
JP2009065199A (ja) * 2008-11-17 2009-03-26 Toshiba Corp 発光装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63198341A (ja) * 1987-02-13 1988-08-17 Nec Corp 半導体装置
JPH0260237U (enExample) * 1988-10-26 1990-05-02

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63198341A (ja) * 1987-02-13 1988-08-17 Nec Corp 半導体装置
JPH0260237U (enExample) * 1988-10-26 1990-05-02

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007329502A (ja) * 2007-08-16 2007-12-20 Toshiba Corp 発光装置
JP2009065199A (ja) * 2008-11-17 2009-03-26 Toshiba Corp 発光装置

Also Published As

Publication number Publication date
JP2526566Y2 (ja) 1997-02-19

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term