JPH04346436A - Bump manufacturing method and device - Google Patents

Bump manufacturing method and device

Info

Publication number
JPH04346436A
JPH04346436A JP3119987A JP11998791A JPH04346436A JP H04346436 A JPH04346436 A JP H04346436A JP 3119987 A JP3119987 A JP 3119987A JP 11998791 A JP11998791 A JP 11998791A JP H04346436 A JPH04346436 A JP H04346436A
Authority
JP
Japan
Prior art keywords
bump
fine wire
manufacturing method
metallic
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP3119987A
Inventor
Hiromi Yanagida
Original Assignee
Fujitsu Ltd
Kyushu Fujitsu Electron:Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Kyushu Fujitsu Electron:Kk filed Critical Fujitsu Ltd
Priority to JP3119987A priority Critical patent/JPH04346436A/en
Publication of JPH04346436A publication Critical patent/JPH04346436A/en
Application status is Withdrawn legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods

Abstract

PURPOSE: To provide the bump manufacturing method capable of forming a bump especially having a specific thickness in a bump formation region.
CONSTITUTION: During the bump manufacturing method composed of the three steps mentioned as follows i.e., the first melting down step wherein a metallic fine wire drawn out of the end of a capillary 21 is melted down to form a metallic ball 11a; the second press down step wherein the metallic ball 11a is pressed down on a bump formation region 12a provided on the surface of a substrate 12 through the intermediary of the capillary 21; and the third cutting off step wherein the metallic fine wire 11 is torn off in case of isolating the capillary 21 from the bump formation region 12a, before tearing off the metallic fine wire 11, wedge type notches 11c are cut in the outer periphery of the metallic fine wire 11 at specific distance from the bump.
COPYRIGHT: (C)1992,JPO&Japio
JP3119987A 1991-05-24 1991-05-24 Bump manufacturing method and device Withdrawn JPH04346436A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3119987A JPH04346436A (en) 1991-05-24 1991-05-24 Bump manufacturing method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3119987A JPH04346436A (en) 1991-05-24 1991-05-24 Bump manufacturing method and device

Publications (1)

Publication Number Publication Date
JPH04346436A true JPH04346436A (en) 1992-12-02

Family

ID=14775106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3119987A Withdrawn JPH04346436A (en) 1991-05-24 1991-05-24 Bump manufacturing method and device

Country Status (1)

Country Link
JP (1) JPH04346436A (en)

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015508240A (en) * 2012-02-24 2015-03-16 インヴェンサス・コーポレイション Method for package-on-package assembly having a wire bond to the sealing surface
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US9553076B2 (en) 2010-07-19 2017-01-24 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US9570416B2 (en) 2004-11-03 2017-02-14 Tessera, Inc. Stacked packaging improvements
US9570382B2 (en) 2010-07-19 2017-02-14 Tessera, Inc. Stackable molded microelectronic packages
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9615456B2 (en) 2012-12-20 2017-04-04 Invensas Corporation Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US9691731B2 (en) 2011-05-03 2017-06-27 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9728527B2 (en) 2013-11-22 2017-08-08 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US9761558B2 (en) 2011-10-17 2017-09-12 Invensas Corporation Package-on-package assembly with wire bond vias
US9812402B2 (en) 2015-10-12 2017-11-07 Invensas Corporation Wire bond wires for interference shielding
US9842745B2 (en) 2012-02-17 2017-12-12 Invensas Corporation Heat spreading substrate with embedded interconnects
US9852969B2 (en) 2013-11-22 2017-12-26 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US9953914B2 (en) 2012-05-22 2018-04-24 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9984901B2 (en) 2005-12-23 2018-05-29 Tessera, Inc. Method for making a microelectronic assembly having conductive elements
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US10008469B2 (en) 2015-04-30 2018-06-26 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US10008477B2 (en) 2013-09-16 2018-06-26 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US10026717B2 (en) 2013-11-22 2018-07-17 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9570416B2 (en) 2004-11-03 2017-02-14 Tessera, Inc. Stacked packaging improvements
US9984901B2 (en) 2005-12-23 2018-05-29 Tessera, Inc. Method for making a microelectronic assembly having conductive elements
US10128216B2 (en) 2010-07-19 2018-11-13 Tessera, Inc. Stackable molded microelectronic packages
US9570382B2 (en) 2010-07-19 2017-02-14 Tessera, Inc. Stackable molded microelectronic packages
US9553076B2 (en) 2010-07-19 2017-01-24 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US10062661B2 (en) 2011-05-03 2018-08-28 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9691731B2 (en) 2011-05-03 2017-06-27 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9761558B2 (en) 2011-10-17 2017-09-12 Invensas Corporation Package-on-package assembly with wire bond vias
US9842745B2 (en) 2012-02-17 2017-12-12 Invensas Corporation Heat spreading substrate with embedded interconnects
JP2015508240A (en) * 2012-02-24 2015-03-16 インヴェンサス・コーポレイション Method for package-on-package assembly having a wire bond to the sealing surface
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9691679B2 (en) 2012-02-24 2017-06-27 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US10170412B2 (en) 2012-05-22 2019-01-01 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9953914B2 (en) 2012-05-22 2018-04-24 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9917073B2 (en) 2012-07-31 2018-03-13 Invensas Corporation Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US9615456B2 (en) 2012-12-20 2017-04-04 Invensas Corporation Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US10008477B2 (en) 2013-09-16 2018-06-26 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9728527B2 (en) 2013-11-22 2017-08-08 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9852969B2 (en) 2013-11-22 2017-12-26 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US10026717B2 (en) 2013-11-22 2018-07-17 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9837330B2 (en) 2014-01-17 2017-12-05 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9947641B2 (en) 2014-05-30 2018-04-17 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US10008469B2 (en) 2015-04-30 2018-06-26 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US10115678B2 (en) 2015-10-12 2018-10-30 Invensas Corporation Wire bond wires for interference shielding
US9812402B2 (en) 2015-10-12 2017-11-07 Invensas Corporation Wire bond wires for interference shielding
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding

Similar Documents

Publication Publication Date Title
JP3455762B2 (en) Semiconductor device and manufacturing method thereof
US5786266A (en) Multi cut wafer saw process
EP0828288A3 (en) Energy relieving crack stop
TW358992B (en) Semiconductor device and method of fabricating the same
WO2002034437A3 (en) A method of making a composite abrasive compact
EP0862211A3 (en) Semiconductor apparatus and method for fabricating the same
JPS63148646A (en) Semiconductor device
WO1998023424A3 (en) Manufacturing of powdered material
EP1204136A4 (en) Package of semiconductor device and method of manufacture thereof
KR840001386A (en) In the method for bonding integrated circuit chips and devices
EP0772247A4 (en) Semiconductor light-emitting device and production method thereof
TW360957B (en) Method and apparatus for producing integrated circuit devices
EP1134805A3 (en) Solder bump fabrication methods and structure including a titanium barrier layer
EP0769812A3 (en) Method of manufacturing chip-size package-type semiconductor device
JPH0394459A (en) Semiconductor chip module and manufacture thereof
JPH03204954A (en) Semiconductor device and manufacture thereof
TW360961B (en) Method of producing semiconductor device, die for producing semiconductor device, semiconductor device and method of mounting the same
EP0666591A3 (en) Direct wafer bonded structure and method
WO2002017387A3 (en) Conductive material patterning methods
TW428264B (en) Method for forming an integrated circuit
JPH04155835A (en) Manufacture of integrated circuit device
KR19980700682A (en) Bumps of the semiconductor device forming method
KR960039276A (en) Device isolation method of a semiconductor device
TW504766B (en) Method of manufacturing electronic components
JPH04355940A (en) Joining method for tab inner lead and bonding tool for junction

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19980806