JPH04345085A - Fluororesin multilayer laminated board - Google Patents
Fluororesin multilayer laminated boardInfo
- Publication number
- JPH04345085A JPH04345085A JP11813591A JP11813591A JPH04345085A JP H04345085 A JPH04345085 A JP H04345085A JP 11813591 A JP11813591 A JP 11813591A JP 11813591 A JP11813591 A JP 11813591A JP H04345085 A JPH04345085 A JP H04345085A
- Authority
- JP
- Japan
- Prior art keywords
- fluororesin
- laminated board
- plating
- resin
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 230000003197 catalytic effect Effects 0.000 claims abstract description 14
- 239000000945 filler Substances 0.000 claims abstract description 14
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 229920006351 engineering plastic Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 12
- 229920000647 polyepoxide Polymers 0.000 abstract description 12
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract description 8
- 229910052708 sodium Inorganic materials 0.000 abstract description 8
- 239000011734 sodium Substances 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 abstract description 6
- 239000011521 glass Substances 0.000 abstract description 6
- 239000005995 Aluminium silicate Substances 0.000 abstract description 4
- 235000012211 aluminium silicate Nutrition 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract description 4
- 239000010419 fine particle Substances 0.000 abstract description 4
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052763 palladium Inorganic materials 0.000 abstract description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 4
- -1 palladium ions Chemical class 0.000 abstract description 4
- 239000003054 catalyst Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000005553 drilling Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 description 1
- 229920006361 Polyflon Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、経済的かつスルーホー
ルめっき性の良いフッ素樹脂多層積層板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fluororesin multilayer laminate that is economical and has good through-hole plating properties.
【0002】0002
【従来の技術】従来、プリント配線板用基板には、ガラ
ス、紙基材にポリイミド、エポキシ樹脂、不飽和ポリエ
ステル樹脂、フェノール樹脂等の熱硬化性樹脂を含浸し
加熱加圧成形した積層板を使用する。しかし、近年高性
能化が進み、誘電率、誘電正接の小さい積層板が要求さ
れる趨勢となり、従来のように熱硬化性樹脂を用いるだ
けでは対応できない事情となった。そこで誘電率と誘電
正接が小さく、耐熱性に優れたポリフェニレンオキサイ
ド(PPO)、ポリフェニレンサルファイド(PPS)
、ポリエーテルエーテルケトン(PEEK)等のスーパ
ーエンプラと呼ばれる熱可塑性樹脂を使用するようにな
った。特に誘電率及び誘電正接が小さく、その他の電気
特性に優れ、かつ耐熱性に優れたフッ素樹脂が注目され
始めた。[Prior Art] Conventionally, substrates for printed wiring boards are made of laminates made by impregnating glass or paper base materials with thermosetting resins such as polyimide, epoxy resins, unsaturated polyester resins, and phenolic resins and molding them under heat and pressure. use. However, in recent years, with the advancement in performance, there has been a trend to require laminates with low dielectric constants and dielectric loss tangents, and this has become a situation that cannot be met simply by using thermosetting resins as in the past. Therefore, polyphenylene oxide (PPO) and polyphenylene sulfide (PPS) have low dielectric constant and dielectric loss tangent and excellent heat resistance.
, thermoplastic resins called super engineering plastics such as polyetheretherketone (PEEK) have come to be used. In particular, fluororesins have begun to attract attention because of their low dielectric constant and dielectric loss tangent, excellent other electrical properties, and excellent heat resistance.
【0003】フッ素樹脂積層板は、ガラス布にフッ素樹
脂ディスパージョンを含浸乾燥して得たプリプレグを積
層して加熱加圧したもの、或いはガラス短繊維とフッ素
樹脂を含浸して加熱加圧したものがある。しかし、この
従来のフッ素樹脂積層板には、誘電特性、耐熱性に優れ
た特長がある反面、樹脂が不活性であるために他材料と
の密着が悪い。したがって、ドリル加工によって明けた
スルーホールの内壁にめっきを行なうときは、金属ナト
リウム処理等の特殊化学処理をする必要があり、この処
理はフッ素樹脂には有効であるが、他の樹脂からなる積
層板に対しては表面を劣化さす問題がある。[0003] Fluororesin laminates are made by laminating prepregs obtained by impregnating glass cloth with fluororesin dispersion and drying them and then heating and pressing them, or by impregnating short glass fibers and fluororesin and then heating and pressing them. There is. However, although this conventional fluororesin laminate has excellent dielectric properties and heat resistance, it has poor adhesion with other materials because the resin is inert. Therefore, when plating the inner walls of through-holes made by drilling, it is necessary to perform special chemical treatment such as metallic sodium treatment. Although this treatment is effective for fluororesins, For plates, there is a problem of surface deterioration.
【0004】一方、フッ素樹脂積層板の多層化の必要が
大きくなるに伴って、フッ素樹脂積層板のみの多層化は
高価であるために、フッ素樹脂積層板とその他の樹脂積
層板との多層化が考えられる。しかし、この多層板にス
ルーホールを明けて内壁をめっきするために金属ナトリ
ウム処理をすると、その他の樹脂を劣化させるため適当
でなく、多層化効果を充分に発揮てきない事情にあった
。On the other hand, as the need for multilayering of fluororesin laminates increases, multilayering of fluororesin laminates alone is expensive, so multilayering of fluororesin laminates and other resin laminates is becoming more important. is possible. However, when through-holes are formed in this multilayer board and metal sodium treatment is applied to plate the inner wall, it is not appropriate because it degrades other resins, and the multilayer effect cannot be fully exhibited.
【0005】特公昭50−31276に開示されている
が、フッ素樹脂以外の樹脂例えばエポキシ樹脂、不飽和
ポリエステル樹脂等の熱硬化性樹脂を用いる積層板のス
ルーホール内壁のめっき性を良くするために、上記熱硬
化性樹脂にめっき触媒性充填剤を添加する報告がある。
この添加によって、スルーホールの内壁のめっきに際し
てめっきが析出しやすい効果がある。これらの報告には
、フッ素樹脂積層板の製造にめっき触媒性充填剤を適用
したとの記載はない。[0005] As disclosed in Japanese Patent Publication No. 50-31276, in order to improve the plating properties of the inner walls of through-holes in laminates using resins other than fluororesin, such as thermosetting resins such as epoxy resins and unsaturated polyester resins, There is a report that a plating catalytic filler is added to the above thermosetting resin. This addition has the effect of making it easier for the plating to precipitate when plating the inner walls of the through holes. These reports do not mention that a plating catalytic filler was applied to the production of fluororesin laminates.
【0006】[0006]
【発明が解決しようとする課題】解決しようとする問題
点は、フッ素樹脂積層板とその他の樹脂積層板の組合わ
せになる多層板の製造において、両樹脂のめっき性を良
くし、しかもその他の樹脂面を劣化することがない方法
を開発するにある。本発明は、従来の金属ナトリウム処
理に代えて、フッ素樹脂積層板面のめっき性を良くし、
その他の樹脂積層板面を劣化することのない方法を提供
することを目的とする。[Problems to be Solved by the Invention] The problem to be solved is to improve the plating properties of both resins, and to improve the plating properties of both resins while manufacturing a multilayer board that is a combination of a fluororesin laminate and other resin laminates. The objective is to develop a method that does not deteriorate the resin surface. The present invention improves the plating properties of the fluororesin laminate surface in place of the conventional metal sodium treatment,
It is an object of the present invention to provide a method that does not cause deterioration of other resin laminate surfaces.
【0007】[0007]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明は、めっき触媒性充填剤を添加したフッ素
樹脂からなるフッ素樹脂積層板とその他の樹脂からなる
積層板との組合わせによるフッ素樹脂多層積層板である
。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a combination of a fluororesin laminate made of a fluororesin containing a plating catalytic filler and a laminate made of other resins. This is a multilayer laminate made of fluororesin.
【0008】本発明に使用するめっき触媒性充填剤は、
従来技術の項で述べたことがあるが、従来のフッ素樹脂
以外の樹脂積層板に関する報告はある。しかし、フッ素
樹脂に関する光行技術及び報告は皆無である。[0008] The plating catalytic filler used in the present invention is
As mentioned in the prior art section, there have been reports regarding conventional resin laminates other than fluororesin. However, there are no optical technology or reports regarding fluororesin.
【0009】上記のめっき触媒性充填剤は、周期率表第
8属の金属の陽イオンを表面吸着性かつ不活性の微粒子
を吸着したものである。フッ素樹脂積層板の製造におい
ては、400℃の高温で加熱加圧する必要があるため、
めっき触媒性充填剤には特に耐熱性を要するからパラジ
ゥムイオンが適している。又、これを吸着させる微粒子
担体としては、例えばカオリンが適している。[0009] The above-mentioned plating catalytic filler has inert fine particles adsorbed on its surface to adsorb cations of metals belonging to group 8 of the periodic table. In manufacturing fluororesin laminates, it is necessary to heat and press at a high temperature of 400°C.
Palladium ions are suitable for plating catalytic fillers because they particularly require heat resistance. Kaolin, for example, is suitable as a particulate carrier for adsorbing this.
【0010】使用するフッ素樹脂は、4フッ化エチレン
樹脂、4フッ化エチレン−パーフルオロアルキビニルエ
ーテル共重合樹脂及び4フッ化エチレン−6フッ化プロ
ピレン共重合体樹脂あるいはこれらの混合物である。The fluororesin used is a tetrafluoroethylene resin, a tetrafluoroethylene-perfluoroalkvinyl ether copolymer resin, a tetrafluoroethylene-hexafluoropropylene copolymer resin, or a mixture thereof.
【0011】フッ素樹脂へのめっき性触媒の添加方法は
、フッ素樹脂微粉末のディスパージョン液にパラシゥム
イオンを吸着したカオリン微粒子を混和する。得た混液
をガラス繊維基材に含浸して約400℃で乾燥した得た
プリプレグの複数枚とその両面に銅箔を重ねて加熱加圧
したフッ素樹脂積層板とする。別に、フッ素樹脂以外の
樹脂による積層板を作り、これとフッ素樹脂積層板と組
合わせて一体成形してフッ素樹脂多層積層板とする。[0011] A method for adding a plating catalyst to a fluororesin is to mix fine kaolin particles adsorbed with palladium ions into a dispersion liquid of fine powder of a fluororesin. A glass fiber base material is impregnated with the obtained mixed solution and dried at about 400° C., and a plurality of sheets of the obtained prepreg are laminated with copper foil on both sides to form a fluororesin laminate. Separately, a laminate made of a resin other than fluororesin is made, and this and a fluororesin laminate are combined and integrally molded to form a fluororesin multilayer laminate.
【0012】組合わせ積層板に用いる樹脂は、熱硬化性
樹脂あるいはスーパーエンプラと呼ばれる耐熱性の熱可
塑性樹脂が好適である。両積層板の一体化には、フッ素
樹脂以外の融点または軟化点以下の温度で接着すること
ができる接着剤層を設けて加熱加圧する方法による。The resin used for the combination laminate is preferably a thermosetting resin or a heat-resistant thermoplastic resin called super engineering plastic. The two laminates are integrated by a method of providing an adhesive layer other than a fluororesin that can be bonded at a temperature below the melting point or softening point and applying heat and pressure.
【0013】[0013]
【作用】本発明によって、めっき触媒性充填剤を添加し
たフッ素樹脂をガラス繊維基材に含浸した積層し加熱加
圧して得たフッ素樹脂積層板とフッ素樹脂以外の樹脂に
よる積層板とを重ね一体化して多層フッ素樹脂積層板を
得る。この多層板に明けたスルーホールの内壁を通常の
方法でめっきすると、従来フッ素樹脂積層板に対して行
なうナトリウム処理を行なう必要がなく、めっきの付着
の全内壁に対して良い。[Operation] According to the present invention, a fluororesin laminate obtained by laminating a glass fiber base material impregnated with a fluororesin containing a plating catalytic filler and heating and pressurizing the fluororesin laminate and a laminate made of a resin other than the fluororesin are laminated and integrated. to obtain a multilayer fluororesin laminate. If the inner walls of the through-holes in this multilayer board are plated by the usual method, there is no need for the sodium treatment that is conventionally applied to fluororesin laminates, and the plating can be applied to all the inner walls.
【0014】フッ素樹脂のなかに混在してフッ素樹脂層
と結合するパラジゥムイオンの担体微粒子をめっき析出
の核としてめっき層を形成することになる。したがって
、フッ素樹脂が不活性であるためにめっき不能であり、
フッ素樹脂を活性化するためにナトリウム処理を行なう
必要がなくなったと説明することができる。[0014] A plating layer is formed by using palladium ion carrier fine particles mixed in the fluororesin and bonded to the fluororesin layer as nuclei for plating precipitation. Therefore, since the fluororesin is inert, it cannot be plated,
This can be explained as the need for sodium treatment to activate the fluororesin.
【0015】[0015]
実施例1
本発明の実施例1を図1に基づいて説明する。ガラス布
(日東紡社、WE116−104)にパラジゥムイオン
を化学吸着させたカオリン微粒子を5重量%添加したフ
ッ素樹脂ディスパージョン(三井デュポンフロロケミカ
ル社、ポリフロンTFE)を含浸し燒成してプリプレグ
を得た。これを重ねた両面に36μmの銅箔3を重ね合
わせ、380℃、20Kg/cm2で加熱加圧して0.
6mm厚のめっき触媒入りフッ素樹脂積層板1を得た。Example 1 Example 1 of the present invention will be described based on FIG. 1. Glass cloth (Nittobosha, WE116-104) was impregnated with a fluororesin dispersion (Mitsui DuPont Fluorochemical Co., Ltd., Polyflon TFE) to which 5% by weight of kaolin fine particles with palladium ions chemically adsorbed was added and sintered to obtain a prepreg. Ta. Copper foil 3 of 36 μm is layered on both sides of this stack, and heated and pressurized at 380° C. and 20 kg/cm2 to achieve a
A 6 mm thick fluororesin laminate 1 containing a plating catalyst was obtained.
【0016】別に、上記と同様のガラス布にエポキシ樹
脂を含浸乾燥して得たプリプレグを上記のフッ素樹脂積
層板1の両面に重ね、さらにその両外側に銅箔3を重ね
て180℃、20Kg/cm2で加熱加圧し、両面に0
.2mmのエポキシ樹脂積層板2を配したフッ素樹脂多
層積層板とした。Separately, a prepreg obtained by impregnating and drying the same glass cloth with epoxy resin as above was layered on both sides of the fluororesin laminate 1, and then copper foil 3 was layered on both outer sides of the prepreg, and heated at 180° C. and weighed 20 kg. / cm2 and apply heat and pressure to both sides.
.. A fluororesin multilayer laminate was prepared with a 2 mm epoxy resin laminate 2 arranged thereon.
【0017】実施例2
実施例2を図2に基づいて説明する。実施例1と同様に
て得ためっき触媒性充填剤入りフッ素樹脂積層板1に所
定パターンの回路を設ける。その両面に実施例1と同様
にして得たエポキシ樹脂積層板2を配し一体化してフッ
素樹脂多層積層板とした。これにドリル加工でスルーホ
ールを明け、めっき処理液に順次浸漬してスルーホール
めっき層4を析出した。Example 2 Example 2 will be explained based on FIG. 2. A predetermined pattern of circuits is provided on a plated catalytic filler-containing fluororesin laminate 1 obtained in the same manner as in Example 1. Epoxy resin laminates 2 obtained in the same manner as in Example 1 were placed on both sides of the epoxy resin laminate 2 and integrated to form a fluororesin multilayer laminate. A through hole was formed in this by drilling, and the through hole plating layer 4 was deposited by sequentially immersing it in a plating treatment solution.
【0018】比較例
比較例1
比較例1として行なった従来法を図3に基づいて説明す
る。めっき触媒性充填剤を添加しない他は、実施例2と
同様にしてフッ素樹脂多層積層板を得た。さらにドリル
加工でスルーホールを明けてめっきを行なった。Comparative Example Comparative Example 1 A conventional method carried out as Comparative Example 1 will be explained based on FIG. 3. A fluororesin multilayer laminate was obtained in the same manner as in Example 2, except that no plating catalytic filler was added. Furthermore, through-holes were made by drilling and plating was performed.
【0019】比較例2
比較例2として行なった方法を図4に示す。めっき触媒
性充填剤を添加しない他は、実施例2と同様にしてフッ
素樹脂多層積層板を作り、これにスルーホールを明けた
。これを金属ナトリウム液(潤工社、テトラエッチ)に
浸漬してスルーホール内壁の粗化を行ない、次いで比較
例1と同様にめっき処理をした。Comparative Example 2 The method carried out as Comparative Example 2 is shown in FIG. A fluororesin multilayer laminate was produced in the same manner as in Example 2, except that no plating catalytic filler was added, and through holes were formed in it. This was immersed in a metal sodium solution (Junkosha, Tetra Etch) to roughen the inner wall of the through hole, and then plated in the same manner as in Comparative Example 1.
【0020】[0020]
【発明の効果】図1に示すように、本発明のフッ素樹脂
多層積層板は、フッ素樹脂積層板とエポキシ樹脂積層板
との組合わせによって成るが、フッ素樹脂積層板のみに
よるものと異なり製造原価は安くなって経済的である。Effects of the Invention As shown in Figure 1, the fluororesin multilayer laminate of the present invention is composed of a combination of a fluororesin laminate and an epoxy resin laminate, but unlike a fluororesin laminate made only of fluororesin laminates, the manufacturing cost is lower. is cheaper and more economical.
【0021】しかも、図2に示すように、ドリル加工で
明けたスルーホールの内壁のフッ素樹脂層にも、本発明
の方法によってめっき層4を形成する。これに反して、
フッ素樹脂にめっき触媒性充填剤を添加しない場合は、
図3に示すようにエポキシ樹脂層にはめっき層を形成す
るが、フッ素樹脂層には形成しない。又、従来法によっ
て金属ナトリウム処理をしてめっきすると、図4に示す
ようにフッ素樹脂層にめっき層を形成するが、エポキシ
樹脂積層板の内壁5は劣化してめっきが付着しない。Furthermore, as shown in FIG. 2, a plating layer 4 is also formed on the fluororesin layer on the inner wall of the through hole made by drilling by the method of the present invention. On the contrary,
If plating catalytic filler is not added to fluororesin,
As shown in FIG. 3, a plating layer is formed on the epoxy resin layer, but not on the fluororesin layer. Furthermore, when plating is performed by metal sodium treatment using the conventional method, a plating layer is formed on the fluororesin layer as shown in FIG. 4, but the inner wall 5 of the epoxy resin laminate deteriorates and no plating adheres to it.
【図1】 本発明のフッ素樹脂多層積層板の断面図で
ある。FIG. 1 is a sectional view of a fluororesin multilayer laminate of the present invention.
【図2】 本発明のフッ素樹脂多層積層板のスルーホ
ールめっきの説明図である。FIG. 2 is an explanatory diagram of through-hole plating of the fluororesin multilayer laminate of the present invention.
【図3】 従来法によるスルーホールめっきの説明図
である。FIG. 3 is an explanatory diagram of through-hole plating by a conventional method.
【図4】 比較例をせつめいするための断面図である
。FIG. 4 is a cross-sectional view for identifying comparative examples.
1 めっき触媒性充填剤入りフッ素樹脂積層板2
エポキシ樹脂積層板
3 銅箔
4 スルーホール内壁めっき層1 Fluororesin laminate with plating catalytic filler 2
Epoxy resin laminate 3 Copper foil 4 Through-hole inner wall plating layer
Claims (3)
樹脂から成るフッ素樹脂積層板とフッ素樹脂以外の樹脂
から成る積層板との組合わせによるフッ素樹脂多層積層
板。1. A fluororesin multilayer laminate comprising a fluororesin laminate made of a fluororesin to which a plating catalytic filler has been added and a laminate made of a resin other than the fluororesin.
であることを特徴とする請求項1記載のフッ素樹脂多層
積層板。2. The fluororesin multilayer laminate according to claim 1, wherein the resin other than the fluororesin is a thermosetting resin.
ングプラスチックであることを特徴とする請求項1又は
2記載のフッ素樹脂多層積層板。3. The fluororesin multilayer laminate according to claim 1 or 2, wherein the resin other than the fluororesin is an engineering plastic.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11813591A JPH04345085A (en) | 1991-05-23 | 1991-05-23 | Fluororesin multilayer laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11813591A JPH04345085A (en) | 1991-05-23 | 1991-05-23 | Fluororesin multilayer laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04345085A true JPH04345085A (en) | 1992-12-01 |
Family
ID=14728920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11813591A Pending JPH04345085A (en) | 1991-05-23 | 1991-05-23 | Fluororesin multilayer laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04345085A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002198645A (en) * | 2000-12-25 | 2002-07-12 | Tamagawa Seiki Co Ltd | Printed board and manufacturing method therefor |
-
1991
- 1991-05-23 JP JP11813591A patent/JPH04345085A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002198645A (en) * | 2000-12-25 | 2002-07-12 | Tamagawa Seiki Co Ltd | Printed board and manufacturing method therefor |
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