JPH04333363A - Iron type automatic soldering device - Google Patents

Abstract

PURPOSE:To prevent damage and defective soldering even if the soldering position is slightly shifted by fitting a soldering iron to a mobile mechanism via a parallel spring means formed so as to make parallel movement freely restorably relatively with respect to other parts. CONSTITUTION:Since the soldering iron 3 is fitted to the mobile mechanism such as an articulated robot via the parallel spring means 5, the iron tip is moved in the parallel direction to displacement of the parallel spring means 5 and brought into contact with a work 7, by which even if the mobile mechanism further continues operation, the movement of the iron tip stops, soldering is performed in this state and soldering can be always performed under the proper contact pressure. Accordingly, even when a printed wiring board is not properly fixed and held, excessive force is not acted on the iron tip and the work, the occurrence of damage of each part can be reduced and the occurrence of defective soldering also can be reduced by setting the teaching position deeply in the progressing direction of the iron tip.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering iron type automatic soldering device.

[0002] An iron-type automatic soldering device is constructed by attaching a soldering iron to a moving mechanism such as an articulated robot, and solders and fixes components on a printed wiring board according to conditions taught in advance using a teaching playback method or the like. It is a device that does

[0003] When soldering is carried out using this type of trowel-type automatic soldering device, the printed wiring board may be deformed or the printed wiring board may not be precisely positioned relative to the trowel-type automatic soldering device. This may result in a difference between the teaching conditions and the actual soldering position, which may cause poor soldering and damage to the soldering iron. On the other hand, the soldering iron is heated to a predetermined temperature by a heater, but if this heat is transferred to the moving mechanism, not only will the thermal efficiency be poor, but it may also have an adverse effect on the moving mechanism and cause it to malfunction.

[0004] Therefore, even if there is a slight deviation between the teaching conditions and the actual soldering position, damage and soldering defects will not occur, and the heat from the soldering iron will not be easily transmitted to the moving mechanism. It is desired to provide a simple structure.

[0005]

2. Description of the Related Art FIGS. 5 and 6 are explanatory diagrams of a conventional iron-type automatic soldering device. FIG. 5 is an overall configuration diagram, and FIG. 6 is an enlarged view of the main parts.

Referring to FIG. 5, reference numeral 21 is a multi-joint robot, and a soldering iron 23 heated by a heater is attached to the tip (robot end) 22 of the arm of the multi-joint robot 21. When the robot 21 is operated, the soldering iron 23 is spatially moved.

Although not shown in the drawings, this iron-type automatic soldering device uses a soldering iron 2 by an articulated robot 21.
3 movement control, the temperature of the iron tip during soldering, and the solder feed amount and speed, etc., the jig is moved according to the position and other conditions taught in advance by the teaching playback method etc. Components are soldered and fixed onto a printed wiring board that is fixedly held on a board.

Referring to FIG. 6, a soldering iron 23 is detachably held in a holder 25 having a flange 24.
The holder 25 is the robot end 22 of the articulated robot 21
a plurality of screws 27 through a plurality of cylindrical collars 26;
is fixedly attached. 28 is soldering iron 23
This is a lead wire for energizing the heater that heats the. The reason why the flange 24 is attached to the robot end 22 via the collar 26 is to reduce the transfer of heat from the soldering iron 23 to the articulated robot 21.

[0009]

[Problems to be Solved by the Invention] However, according to the conventional configuration, the soldering iron is fixedly attached to the articulated robot, so the printed wiring board is fixedly held in a deformed state, or If the wiring board is held fixed in a state that does not align with the coordinate system of the articulated robot, the taught position and the actual soldering position will differ, and the tip of the iron will not make sufficient contact with the soldering position. If a soldering defect occurs and the iron tip contacts the soldering position with strong pressure, it may damage the printed wiring board, components, the jig that holds the printed wiring board, the soldering iron, or the articulated robot. The problem is that this may occur.

[0010] Furthermore, the structure uses a plurality of collars for the sole purpose of preventing the heat of the soldering iron from being transmitted to the articulated robot, and there is also the problem that the structure is complicated due to the large number of parts. be.

The present invention has been made in view of these points, and its purpose is to prevent damage and soldering defects even if there is a slight deviation between the teaching conditions and the actual soldering position. It is an object of the present invention to provide a simple structure that is less likely to occur and that makes it difficult for heat from a soldering iron to be transmitted to a moving mechanism.

0012

[Means for Solving the Problem] In order to achieve the above-mentioned object, a soldering iron having a heater for heating the tip of the soldering iron and a moving mechanism for spatially moving the soldering iron are provided, and the soldering iron is printed according to the conditions taught. An iron-type automatic soldering device for soldering and fixing components onto a wiring board is configured as follows.

That is, both ends of each of the pair of relative members are supported by a pair of leaf spring members, and when a force is applied to one of the relative members, the leaf spring member is bent in one axial direction, and the other end is supported by a pair of leaf spring members. The soldering iron is attached to the moving mechanism via at least one parallel spring means configured to be reversibly translated in parallel relative to the relative member.

[0014] In addition to the above-mentioned configuration, a preload means is provided to apply a predetermined deflection to the parallel spring means in an adjustable manner in advance.

[0015]

[Operation] According to the present invention, since the soldering iron is attached to a moving mechanism such as an articulated robot via the parallel spring means, the tip of the soldering iron can be moved in a direction parallel to the direction of displacement of the parallel spring means. By contacting the workpiece (component lead, printed wiring board, etc.), the movement of the iron tip will stop even if the movement mechanism continues to operate, and soldering will be performed in this state, ensuring proper soldering at all times. Soldering can be performed using contact pressure.

[0016] Therefore, by setting the teaching position deep relative to the direction in which the iron tip advances, even if the printed wiring board is not properly held, excessive force will not be applied to the iron tip or the workpiece. Therefore, the occurrence of damage to each part can be reduced, and the occurrence of soldering defects can also be reduced.

Furthermore, when the preload means is provided, it is possible to give a predetermined deflection to the parallel spring means, so it is possible to reduce vibrations generated in the soldering iron due to acceleration and deceleration during spatial movement, and also to reduce vibrations. The settling time can be shortened.

On the other hand, since the pair of leaf spring members constituting the parallel spring means have a small cross-sectional area, less heat is transferred from the soldering iron to the moving mechanism, resulting in good thermal efficiency and the transfer of heat to the moving mechanism by the heat. can reduce the negative effects of Therefore, by employing the configuration of the present invention, there is no need to employ a special heat-insulating configuration such as a conventional collar, and the configuration is simple.

[0019]

Embodiments Hereinafter, embodiments of the present invention will be explained based on the drawings.

FIG. 1 is an enlarged view of essential parts of an embodiment of the present invention. In the figure, 2 is the tip (robot end) of the arm of an articulated robot, and 3 is a soldering iron heated by a heater. Although the soldering iron 3 is not shown, it is shown in FIG.
It is removably held in a holder having a flange 4 similar to the above.

A parallel spring 5 is attached to the robot end 2 with a plurality of screws, and a flange 4 of a holder for fixing and holding the soldering iron 3 is attached to the parallel spring 5 with a plurality of screws.

The parallel spring 5 has a pair of relative members 5a and 5b.
are supported by a pair of leaf springs 5c, 5d, and when a force is applied to one of the relative members 5a, 5b, the leaf spring members 5c, 5d are bent in the uniaxial direction, and the relative members 5a, 5d are bent in the uniaxial direction. 5b is configured to be relatively movable in parallel in a restorable manner. In this embodiment, the parallel spring 5 is constructed by cutting out the central portion of a rectangular parallelepiped-shaped elastic metal material using a wire-cut electrical discharge machine or the like. Note that the parallel spring 5 can also be constructed by forming the relative members 5a, 5b and the plate springs 5c, 5d separately and then assembling them by screws, welding, or the like. The leaf springs 5c and 5d (including the relative members 5a and 5b when the parallel spring 5 is integrally formed) are made of a material having desired elasticity and low thermal conductivity.

Although not shown in the drawings, the articulated robot has the same configuration as shown in FIG. It is equipped with a control unit that controls the temperature of the tip of the iron, as well as the solder feed amount and speed, etc., and prints that are fixedly held on a jig, etc. according to the position and other conditions taught in advance by the teaching playback method etc. A component (work) 7 is soldered and fixed onto a wiring board 6. Note that 8 is a lead wire for supplying electricity to a heater that heats the soldering iron 3.

In this embodiment, as shown in FIG. 2, the positions of five spatial points P1 to P5 are taught for one soldering point. P1 is a set position, P2 and P3 are passing points, P4 is a virtual soldering point, and P5 is a soldering end point. Here, P3 and P4 are printed wiring board 6
The variable position is set wider than the predicted variable position when the robot is deformed or there is some deviation from the coordinate system of the articulated robot. Soldering conditions include preheating,
The temperature and time of main heating and post-heating, feed amount and feeding speed of primary solder and secondary solder are taught respectively.

[0025] The soldering iron 3 is moved to P1,
It is moved towards P4 via P2 and P3. P
While being moved from 3 to P4, P'4
The tip of the iron comes into contact with the workpiece 7, but the operation of the articulated robot continues, and the tip of the iron moves to the position P4 where it would be if the tip did not come into contact with the workpiece 7.

The state at this time is shown in FIG. 3, and as shown in the figure, when force is applied to the tip of the iron due to contact with the workpiece 7, the leaf springs 5c and 5d of the parallel spring 5 are bent. By displacing the relative member 5b with respect to the robot end 22, excessive force is prevented from acting on the workpiece 7 and the soldering iron 3.

In this case, the force Fc acting on the workpiece 7 can be expressed as Fc =ΔS·k=ΔS·24EI/l3. Here, ΔS is the displacement amount of the parallel spring, k is the spring constant, E is Young's modulus, I is the cross-sectional quadratic coefficient, and l is the spring length.

In this state, a predetermined soldering operation is carried out, and after the soldering operation is completed, it is moved toward P5.

According to this embodiment, since the soldering iron 3 is attached to the articulated robot (robot end 2) via the parallel spring 5, the soldering iron tip can be moved in a direction parallel to the direction of displacement of the parallel spring 5. By bringing it into contact with the workpiece 7, even if there is some deviation in the position of the workpiece 7, no excessive force will be applied upon contact, and the occurrence of soldering defects will be reduced.

Furthermore, since the thermal conductivity of the leaf springs 5c and 5d of the parallel spring 5 is small, the heat transfer from the soldering iron 3 to the multi-joint robot is small, and the heat transfer from the soldering iron 3 to the multi-joint robot is small. There is no need to take any special measures to prevent the transmission of data, and the configuration is very simple.

FIG. 4 is a block diagram of another embodiment of the present invention. A preload means is provided in the structure shown in FIG. 1, and only the structure of the preload means will be explained, and since the other parts are the same as those in FIG. 1, the same numbers will be given and the explanation thereof will be omitted.

The preloading means 11 includes a plate-like fixing member 12 formed in a substantially L-shape, and an adjusting screw 13 having a rubber member 13a made of rubber with a low coefficient of restitution integrally fixed to the tip thereof.
It consists of The fixing member 12 is fixed to the robot end 2 by a screw 14 near one side of the parallel spring 5 in the displacement direction, and an adjusting screw 13 is screwed into a screw hole formed near the tip of the fixing member 12. ing. By rotating the adjustment screw 13, the rubber member 13a at the tip of the adjustment screw 13 comes into contact with the relative member 5b of the parallel spring 5, and by further rotation, a preload is applied to the parallel spring 5.

With the configuration of the embodiment shown in FIG. 1, depending on the elasticity of the plate springs 5c and 5d of the parallel spring 5, the weight of the soldering iron 3 etc. attached to the relative member 5b, the attitude of the soldering iron 3, etc. The soldering iron 3 and the like may vibrate due to acceleration and deceleration associated with the operation of the articulated robot. The preload means 11 is provided to prevent the occurrence of such vibrations or to quickly attenuate the vibrations. That is, the parallel spring 5 cannot be displaced toward the preloading means 11 side, and when vibration occurs, the rubber member 13a fixed to the tip of the adjustment screw 13 has a low coefficient of repulsion, so the soldering iron cannot be used. The vibration of No. 3 is quickly damped and comes to a standstill.

In the configuration of the above embodiment, the soldering iron 3 is attached to the articulated robot via one parallel spring 5, but the present invention is not limited to this, and the soldering iron 3 is attached to the articulated robot via one parallel spring 5. The soldering iron can be configured by connecting three parallel springs so that their displacement directions are perpendicular to each other, and attaching the soldering iron to an articulated robot via these parallel springs.

[0035]

[Effects of the Invention] As described in detail above, the present invention is constructed by attaching the soldering iron to a moving mechanism such as an articulated robot via a parallel spring means. Even if there is a misalignment, damage and poor soldering are less likely to occur, and the transfer of heat from the soldering iron to the transfer mechanism can be reduced with a simple configuration.

[Brief explanation of drawings]

FIG. 1 is an enlarged view of main parts of an embodiment of the present invention.

FIG. 2 is an explanatory diagram of teaching conditions regarding movement of the iron tip in the embodiment of the present invention.

FIG. 3 is a diagram showing a state when the soldering iron in the embodiment of the present invention comes into contact with a workpiece.

FIG. 4 is an enlarged view of main parts of another embodiment of the present invention.

FIG. 5 is an overall configuration diagram of the prior art.

FIG. 6 is an enlarged view of the main parts of the prior art.

[Explanation of symbols]

2 Robot end (articulated robot) 3 Soldering iron 4 Flange 5 Parallel spring 5a, 5b Relative member 5c, 5d　Plate spring 6 Printed wiring board 7 Parts (work) 11 Preload means 13 Adjustment screw

Claims (3)

[Claims] 1. A soldering iron (3) having a heater for heating the tip of the soldering iron (3), and a movement mechanism (2) for spatially moving the soldering iron (3), according to the conditions taught. 6) In an iron-type automatic soldering device for soldering and fixing a component (7) on a pair of relative members (5a, 5).
b) Each end of the plate spring member (5c, 5
d) supported by one of said relative members (5b
), the leaf spring members (5c, 5d)
The soldering iron (3) is connected to the soldering iron (3) via at least one parallel spring means (5) which is configured to be deflected in one axis direction and translated in a restorable manner relative to the other relative member (5a). An iron-type automatic soldering device, characterized in that it is attached to the moving mechanism (2). 2. The iron-type automatic soldering apparatus according to claim 1, further comprising a preload means (11) that adjustably applies a predetermined deflection to the parallel spring means (5). Automatic soldering device. 3. In the iron-type automatic soldering device according to claim 1, three of the parallel spring means (5) are connected so that their displacement directions are substantially orthogonal to each other, and the force acting on the iron tip is reduced. An iron-type automatic soldering device characterized in that the soldering iron (3) responds to the direction.