JPH04330892A - Manufacture of solid-state color image pickup device - Google Patents

Abstract

PURPOSE:To bond-between the prisms of a solid-state color image pick-up device and between a prism and a solid-state image pick-up device with highly accurate positioning and desired thickness. CONSTITUTION:A micro ball 1 coated with ultraviolet ray hardening type adhesives 2a is sandwiched between prisms 5a and 5b, the desired clearance is formed and fixed while the prisms 5a and 5b are slid, and by the ultraviolet ray irradiation, the ultraviolet ray hardening adhesives 2a are hardened and temporarily tightened. As adhesives 3, each type of adhesives such as the thermohardening type and the room temperature hardening type can be used. By this constitution, the occurrence of the bubble due to the extremely thinning of the bonding layer is prevented, the detaining of the sliding due to the abutting of the prisms 5a and 5b is eliminated, the sliding can be smoothed by the rotation of the micro ball 1 and the highly accurate position adjustment can be performed.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a solid-state color imaging device, in which imaging light is separated into a plurality of color components by a color separation prism, and a subject image of each color component is captured by a respective solid-state imaging device. .

0002

[Prior Art] Conventionally, in general solid-state color imaging devices,
Imaging light is separated into a plurality of color components by a prism system, and a subject image of each color component is captured by a solid-state imaging device. Then, it is configured to form and output a standard color television signal such as the NTSC system from each image pickup output. In a solid-state color imaging device using a plurality of solid-state imaging devices, it is necessary to accurately superimpose subject images of each color component captured by each solid-state imaging device, that is, perform relative position adjustment (optical path length, pixels).

A conventional solid-state color imaging device will be explained below with reference to the drawings. FIG. 2 shows the configuration of a conventional solid-state color imaging device. As shown in the figure, 5a, 5b
, 5c is a prism that separates the imaging light into multiple color components, 7
a, 7b, and 7c are solid-state imaging devices that capture subject images of each color component. Figure 3 shows a prism 5 of a conventional solid-state imaging device.
The adhesion state of a and 5b is shown. As shown in the figure, the adhesive surface of each prism is fixed with an ultraviolet curing adhesive 2b, and the prisms with the adhesive surface ridges chamfered 4b are slid and adhered, but when the adhesive layer becomes extremely thin, air bubbles form. 6 may occur.

A method of assembling the solid-state color imaging device constructed as described above will be explained below. The relative positions of the solid-state imaging devices 7a, 7b, and 7c are adjusted between the prisms 5a, 5b, and 5c facing each other, and between the prisms 5a, 5b, and
5c and the solid-state imaging devices 7a, 7b, 7c and sandwiched between them, first, each prism 5a,
Using the fluidity of the ultraviolet curing adhesive 2b sandwiched between the solid-state imaging devices 7a, 7b, 7b, the solid-state imaging devices 7a, 7b, 7
Adjust the optical path length of c. Next, prisms 5a, 5b, 5c
and solid-state imaging devices 7a, 7b, and 7c in the same manner several times to adjust the pixel position of each solid-state imaging device. The UV-curable adhesive 2b was then irradiated with ultraviolet rays, and the area near the outer periphery of the adhesive surface that was strongly exposed to the ultraviolet rays was first temporarily cured, and then the internal adhesive was fully cured over time for assembly. .

[0005]

[Problems to be Solved by the Invention] However, in the conventional configuration as described above, in order to adjust the relative position of each solid-state imaging device, the fluidity of the adhesive held between the prisms is used to connect the prisms. It was slid several times. In this case, especially when sliding is performed using a low-viscosity adhesive, the adhesive layer becomes extremely thin as the sliding is repeated, and eventually the adhesive layer is divided and bubbles are generated, causing the prisms to come into direct contact with each other. If they touch each other, they will not slide smoothly. Furthermore, when a room temperature curing adhesive which takes a longer curing time than an ultraviolet curable adhesive is used, the fixing time is long, resulting in poor workability and difficulty in use. In particular, when bonding high refractive index prism materials, the ultraviolet light is absorbed by the prism and cannot reach the ultraviolet curing adhesive layer, allowing the curing of the light curing adhesive with high temporary bonding strength to occur in a short period of time. There were some issues, such as it being difficult to do so.

[0006] The present invention solves these problems, and it is possible to accurately align the prism and the solid-state imaging device, and to cure an adhesive with high temporary bonding strength in a short time. It is an object of the present invention to provide a method for manufacturing a solid-state color imaging device.

[0007]

[Means for Solving the Problems] In order to achieve this object, the present invention provides adhesive between microspheres whose outer peripheries are coated with an ultraviolet curable adhesive and between the prisms facing each other and between the prisms and the solid-state imaging device. The UV-curable adhesive is temporarily cured by irradiating it with ultraviolet light, and then the adhesive is cured.

[0008] Furthermore, microspheres having the same refractive index as the adhesive bonding between the opposing prisms and between the prisms and the solid-state imaging device are dispersed in the adhesive, and the adhesive is photocured. It is something.

[0009] Furthermore, the chamfering of the ridgeline of the adhesive surface between the opposing prisms and between the prism and the solid-state imaging device is chamfered to a size that is larger than the chamfering of other ridgelines and does not block the ultraviolet light flux that cures the adhesive. It was designed to do so.

0010

[Operation] With this manufacturing method, after adjusting the relative position of the prism or solid-state imaging device that constitutes the solid-state imaging device, ultraviolet light is irradiated, and the ultraviolet-curing adhesive coated on the microspheres dispersed in the adhesive is exposed to the ultraviolet light. After curing, the contact area with the microspheres sandwiched between the prisms or between the prism and the solid-state imaging device is temporarily fixed by curing the ultraviolet curable adhesive, and then the adhesive for dispersing the microspheres is hardened. let In this case, the ultraviolet curable adhesive and the microspheres have the same refractive index, so
Ultraviolet rays pass through without being scattered. Due to this temporary curing,
Any adhesive other than an ultraviolet curable adhesive can be used to disperse the microspheres. and,
By using an adhesive in which microspheres are dispersed, even if the prism or solid-state imaging device is slid several times, a gap of the desired thickness formed by the microspheres is formed between the adhesive surfaces, and the adhesive layer remains intact. No air bubbles are generated, and the prisms do not come into contact with each other and get caught. Moreover, smooth sliding between the prisms is possible due to the rolling of the microspheres. In addition, the large chamfer on the ridgeline of the adhesive surface improves the transmission of ultraviolet rays and provides strong temporary adhesion strength, so it only needs to be cured near the outer periphery of the prism, and it can be cured in a short period of time regardless of the ultraviolet ray absorption rate of the prism material. This means that it can be temporarily fixed.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A solid-state color imaging device according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows the adhesion structure between the prisms of the solid-state color imaging device of the present invention and between the prisms and the solid-state imaging device. The microspheres 1, which provide a desired gap and allow smooth sliding, are coated with an ultraviolet curing adhesive 2.
The microsphere 1 is covered with an adhesive 3 that adheres between the prisms and between the prisms and the solid-state imaging device. 4a is a chamfered edge of the bonding surface, and 5a and 5b are prisms to be bonded.

A method of manufacturing the solid-state color imaging device constructed as described above will be explained. First, the adhesive 3 containing the microsphere 1 is applied between the prisms 5a and 5b and held therebetween. Then, the prisms 5a and 5b are slid several times to adjust the optical path length of each solid-state imaging device. At this time, the held microsphere 1 forms a desired gap between each adhesive surface between the prisms 5a and 5b, prevents the generation of air bubbles due to the extremely thin adhesive layer, and allows the microsphere 1 to roll during sliding. , it can slide smoothly and easily perform highly accurate gap adjustment. Pixel adjustment of the solid-state imaging device is also performed in the same manner. In addition, the ultraviolet curing adhesive 2a covering the held microspheres 1 is irradiated with ultraviolet rays and cured to fix the contact surface for temporary fixing, and then the thermosetting adhesive wraps around the microspheres. 3 is fully cured. With the chamfer 4a, the ultraviolet rays can be efficiently irradiated onto the ultraviolet curable adhesive 2a, and the curing time can be shortened. In addition, when the thermosetting adhesive 3 is changed to an ultraviolet curable adhesive, the adhesive strength for temporary fixing can be improved by the chamfering 4a, and by curing the vicinity of the chamfered portion on the outer periphery of the prism, the prisms 5a, 5b Temporary fixing can be performed with strong strength regardless of the absorption of ultraviolet rays.

Although this embodiment describes a solid-state color imaging device, the present invention is not limited to solid-state color imaging devices, and can also be applied to relative positioning and bonding of various members. Can be used effectively.

[0014]

Effects of the Invention As is clear from the above description of the embodiments, according to the present invention, even when sliding between prisms, an adhesive layer of a desired thickness can be formed by the microspheres and the adhesive surrounding the microspheres. This can prevent the prisms from coming into direct contact with each other and prevent them from getting caught when sliding. Furthermore, since smooth sliding is possible due to the rolling of the microspheres, highly accurate position adjustment can be easily performed. Furthermore, by using an ultraviolet curable adhesive coated on the microspheres, the selection range of adhesive can be expanded, and a wide range of bonding conditions can be accommodated. In addition, the large chamfer allows UV rays to be efficiently irradiated onto the UV-curable adhesive, shortening the curing time.The chamfer increases the bonding area and improves the adhesive strength for temporary fixing, allowing precision parts assembly. productivity can be improved.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an adhesive structure between prisms according to an embodiment of the present invention.

[Fig. 2] A perspective view showing the configuration of a solid-state color imaging device.

[Figure 3
】Cross-sectional view showing the conventional adhesive structure between prisms

[Explanation of symbols]

1 Microsphere 2a　UV curing adhesive 3. Adhesive 4 Chamfering 5a, 5b Prism

Claims (3)

[Claims] 1. Microspheres whose outer peripheries are coated with an ultraviolet curable adhesive are dispersed and sandwiched between opposing prisms and between the prisms and the solid-state imaging device, and ultraviolet light is irradiated to A method for manufacturing a solid-state color imaging device, which comprises curing and temporarily curing an ultraviolet curable adhesive, and then curing the adhesive. 2. Microspheres having the same refractive index as an adhesive bonding between opposing prisms and between the prisms and the solid-state imaging device are dispersed in the adhesive, and the adhesive is photocured. A method of manufacturing the solid-state color imaging device described above. 3. The chamfering of the ridgeline of the adhesive surface between the opposing prisms and between the prism and the solid-state imaging device is chamfered to a size that is larger than the chamfering of other ridgelines and does not block the ultraviolet light flux that cures the adhesive. The method of manufacturing a solid-state color imaging device according to claim 1.