JPH0432521B2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a chip resistor manufacturing substrate and a chip resistor trimming method.

[Conventional technology]

Chip resistor C as shown in FIG. 9 is manufactured through the following steps. First, the electrode coating 3 is printed all at once on both ends of each rectangular area surrounded by the grooves on the upper surface of the fired ceramic substrate 1 while forming the grooves in a lattice pattern. A shaped resistive film 2 is formed by printing at once. As a result, each rectangular area constitutes the basic part of each unit chip resistor C, which consists of an electrode coating 3 and resistive coatings 2 disposed at both ends so as to conduct the electrode coating 3. At this point, a measuring probe (not shown) is brought into contact with both electrodes 3 of each unit chip resistor C... in order to measure the resistance value, and the resistance value of the resistance coating 2 of each chip resistor C... is a predetermined value. Trimming is performed to remove a predetermined amount so that This trimming is usually performed by burning off a predetermined amount of the resistive film 2 from its edge in the width direction of the resistor using a laser beam, for example, as shown in FIG. Trimming patterns include an I-type as shown in Figure 6, an L-type as shown in Figure 7, and a double-L type as shown in Figure 8. In short, the trimming pattern changes the cross-sectional area and length of the current-carrying part of the resistive film 2. By doing so, a predetermined resistance value is obtained. After the resistance value of each unit value resistor C is set to a predetermined value in this way, the surface is coated with a protective coating, and then the ceramic substrate 1 is divided along its longitudinal grooves and arranged in a row. A bar-shaped substrate piece is obtained, an electrode coating is applied and fired on the side edge surface or the back surface near the side edge, and finally it is divided into each unit chip resistor along the horizontal dividing groove. By the way, the positioning of the ceramic substrate 1 during the above-mentioned trimming is done by the external shape reference, which is done by bringing the edge of the substrate 1 into contact with the guide pin 5 protruding from the support table 4, as shown in FIG. Ta. That is, with respect to the thus positioned ceramic substrate 1, measurements are made by sequentially contacting the electrode (electrode coating) of each unit chip resistor with a measurement probe that moves relative to the ceramic substrate with reference to the support table. The above-mentioned trimming was performed using a laser light generator that moved relative to the ceramic substrate as a reference.

[Problems to be solved by the invention]

However, as described above, when the ceramic substrate is positioned based on the external shape and the measurement probe and laser beam generator are moved relative to the support table (i.e., the support table side moves relative to the measurement probe or laser beam generator), (Ceramic substrates may be sent.) When trimming, there may be burrs on the edges of the ceramic substrate, making it difficult to position the ceramic substrate 1 correctly, or even if the ceramic substrate 1 is positioned correctly, the electrode coating 3 may be damaged. Also, if there is a printing misalignment of the resistive coating 2, the measurement probe will not be able to
There are problems in that the trimming start position indicated by the symbol s in FIG. 6 is shifted and the trimming cannot be done correctly. Furthermore, if the electrode coating 3 is misaligned in the X direction in FIG. 7, for example, the electrode coating 3 may be trimmed, resulting in a defective chip resistor itself. Furthermore, if the ceramic substrate 1 is not positioned correctly or there is printing misalignment as described above, all the chip resistors on the same ceramic substrate 1 will be defective, so the above problem is serious. This invention was devised under the above circumstances, and is a new method for manufacturing chip resistors that has a simple structure that allows correct trimming to be performed at all times regardless of the external shape of the ceramic substrate. The object is to provide a substrate and a method for trimming a chip resistor using the substrate.

[Means to solve the problem]

In order to solve the above problem, the present invention takes the following technical measures. That is, the substrate for manufacturing chip resistors according to the present invention is a substrate for manufacturing chip resistors in which unit chip resistors are collectively formed in multiple columns and multiple rows by collectively printing an electrode coating and a resistive coating on each unit area. In this case, each of the above unit areas is coated with an electrode coating or/and a predetermined shape.
When simultaneously printing and forming resistive coatings,
The present invention is characterized in that at least two recognition marks in a fixed positional relationship with the pattern of the electrode coating or the resistive coating are printed on the blank space on the substrate using ink for the electrode coating and/or ink for the resistive coating. The method for trimming a chip resistor of the present invention is to apply the resistive film to a substrate on which a plurality of unit chip resistors are collectively formed in a plurality of rows by collectively printing an electrode film and a resistive film in each unit area. In a trimming method in which a predetermined amount is removed by burning out with a laser beam, each unit area is coated with an electrode coating or/and a predetermined shape.
When simultaneously printing and forming resistive coatings,
At least two recognition marks having a certain positional relationship with the pattern of the electrode coating or the resistive coating are printed on the margins of the substrate using ink for the electrode coating and/or ink for the resistive coating, and are used for trimming in the trimming process. By optically recognizing the recognition mark, the position of the laser beam generator in the surface direction with respect to the substrate and the rotational position around the axis perpendicular to the surface, the electrode coating or/and
and the pattern of the resistive coating as a reference.

[Effect]

For example, the recognition mark printed on the margin of the ceramic substrate at the same time as printing the resistive coating is
Since the positional relationship with the resistive coating pattern is determined, by recognizing the recognition mark, the absolute position of the resistive coating pattern on the printed surface and the rotational posture around the vertical axis can be measured. That is, the ceramic substrate is placed on a table that can be driven in the X, Y directions and the θ direction, and the table is moved in the X and Y directions based on the measurement result of one of the at least two recognition marks. By moving a predetermined amount in the Y direction, the relative position of the laser beam generator in the printed surface direction with respect to the printed pattern of the resistive coating can be determined. Next, in addition to the measurement result of one recognition mark mentioned above, it is also possible to know the inclination in the θ direction of the printed pattern of the resistive coating according to the measurement result of the other recognition mark, and the ceramic By rotating the substrate in the θ direction, it is possible to determine the rotational relative position of the laser beam generator in the θ direction with respect to the printed pattern of the resistive film, that is, around the orthogonal axis with respect to the printed surface. As a result, the laser light generator can be driven based on the printed pattern of the resistive film, rather than based on the outer shape of the ceramic substrate. Similarly, the laser light generator can also be driven based on the printed pattern of the electrode coating.

【effect】

As described above, in the present invention, the position of the laser beam generator to be trimmed is determined based on the printing pattern of the electrode coating and/or the printing pattern of the resistive coating printed on the ceramic substrate. Since the rotational position around the orthogonal axis is determined and driven, even if the printing of the resistive coating with respect to the ceramic substrate is misaligned, a predetermined portion on the resistive coating can be accurately trimmed regardless of this. In the first place, trimming is to adjust the cross-sectional area and length of the conductive part of the resistive coating, so according to the method of the present invention, which trims using the printed pattern of the resistive coating as a reference, the ceramic substrate can be trimmed according to the external shape. Compared to the conventional method of trimming the resistive coating while positioning it, extremely accurate trimming can be performed. Furthermore, since trimming can be performed based on the printed pattern of the electrode coating, it is possible to avoid the inconvenience of trimming the electrode coating due to misalignment of the ceramic substrate itself.

[Explanation of Examples]

Embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a plan view of a ceramic substrate 1 before trimming by the method of the present invention. This ceramic substrate 1 is similar to the conventional one except that recognition marks 6, 6, 7, and 7 are printed on the surrounding margins. That is, a lattice-like groove consisting of a plurality of equally spaced horizontal grooves 8... and a plurality of equally spaced vertical grooves 9... is formed on the ceramic surface, and is surrounded by each groove 8..., 9... A plurality of rectangular unit areas A are formed adjacent to each other in a plurality of columns and a plurality of rows. Then, in each unit area A, as shown in an enlarged view in FIG. 2, the electrode coatings 3... are printed all at once, and then the resistive coatings 2... are printed all at once. These printings are usually performed by screen printing using a paste for forming a resistive film or a paste for forming an electrode film as an ink. Each mask for electrode coating printing and resistive coating printing includes electrode coating 3... or resistive coating 2 shown in Fig. 2.
A punching pattern is formed in which ... are arranged in a plurality of rows and in a plurality of columns. And ceramic substrate 1
Place the above printing mask on top while positioning it,
By rubbing the mask with the ink on it with a squeegee, the ink is transferred onto the ceramic in correspondence with the above-mentioned punching pattern, thereby forming the above-mentioned resistive coatings 2 and electrode coatings 3. In the method of the present invention, by adding a new punching pattern to a predetermined portion on the printing mask, the first
At least two or more recognition marks 6, 6, 7, 7 as shown in FIG.
Print in the margins of Among these, the recognition marks indicated by numerals 7 and 7 are the recognition marks printed at the same time as printing the electrode coating, and the recognition marks indicated by numerals 6 and 6 are the recognition marks printed at the same time when printing the resistive coating, and in this example, they are respectively printed. Printed in two places. Therefore, each of the recognition marks 7, 7, 6, 6 is always positioned with respect to the printed pattern of the electrode coating 3 or the printed pattern of the resistive coating 2. Next, in the trimming step, the printed ceramic substrate 1 is placed on the support stand 10 while being positioned using guide pins 5 and the like. This support stand 10, as shown in FIG.
A rotary table 11 and an X/Y table 12 are supported by a combined drive device 13, and rotate in the X direction.
It is designed to move in the Y direction and the θ direction. An optical recognition device 1 is provided above the support stand 10.
4 is placed. When the ceramic substrate 1 is placed on the support stand 10, first, the optical recognition device 14, for example,
Recognize each coordinate of the recognition marks 6, 6 above. This allows the recognition marks 6, 6 to be
Since the deviations in the direction, the Y direction and the θ direction can be measured, the rotary table 11 and the X/Y table 12 are controlled based on this to
is moved to correct the positions of the recognition marks 6, 6 so that they are at the desired positions in relation to the laser beam generator (not shown). As mentioned above, the relationship between the recognition marks 6, 6 and the printed pattern of the resistive coating 2... is determined, so as mentioned above, the two recognition marks 6,
By adjusting the position of 6, it is possible to correctly determine the position of the printed pattern of the resistive coating 2 in relation to the laser light generator. That is, since the position of the printed pattern is corrected using two recognition marks, the position of the printed pattern can be corrected not only in the X and Y directions but also in the θ direction. After the position of the printed pattern of the resistive coating 2 has been corrected in this way, as shown in FIG. The electrode coatings 3 and 3 of A are scanned. Then, as shown in FIG. 5, the resistive film 3 is burnt with a laser beam so as to correspond to the cross-sectional area and length of the conductive part of the resistive film 3, which is determined based on the relationship between this measurement result and the resistance value to be obtained. Trimming by cutting and deleting is performed sequentially. For example, when performing I-shaped trimming as shown in FIG. Starting point s
can be determined accurately in relation to the printed pattern of the resistive coating 2..., completely avoiding the possibility that the trimming starting point will enter inside the resistive coating 3 or touch the neighboring resistive coating. can do. And the trimming length l is
The measurement result by the measurement probe described above is made to be a desired value. In addition, when performing L-shaped trimming as shown in Figure 7, the trimming starting point s must be located close to the electrode coating 3, so the printing of the electrode coating 3... may be shifted in the X direction in the figure. In order to prevent the electrode coating 3 of the lever from being trimmed, it is better to trim using the printed pattern of the electrode coating 3 as a reference. In this case, instead of adjusting the printing pattern of the resistive coating 2 in the above explanation, the recognition marks 7, 7 can be used to adjust the printing pattern of the electrode coating 3.
After adjusting the relative position of the printed pattern with respect to the laser beam generator, trimming may be performed. Of course, the scope of the invention is not limited to the above embodiments. In the embodiment, the support base on which the ceramic substrate 1 is placed can be moved in the X, Y, and θ directions to adjust the position of each printing pattern in relation to the laser beam generator. The reference position of the generator may be moved to adjust the relative position of each printed pattern to the laser light generator.

[Brief explanation of drawings]

FIG. 1 is a plan view of the ceramic substrate of the present invention, FIG. 2 is an enlarged plan view of the main parts of the ceramic substrate shown in FIG. 1, and FIG. 3 is a perspective view of the overall schematic configuration of the ceramic substrate positioning device. , Fig. 4 is an explanatory diagram of the resistance measurement process prior to the trimming process, Figs. 5 to 8 are explanatory diagrams of the trimming process, Fig. 9 is an enlarged perspective view of the entire chip resistor, and Fig. 10 is an illustration of the conventional example. It is an explanatory diagram. 1... Ceramic substrate, 2... Resistive coating, 3...
...electrode coating, 6...recognition mark, 7...recognition mark, 8,
9... Division groove, A... unit area, C... unit chip resistor.

Claims (1)

[Scope of Claims] 1. A chip resistor manufacturing substrate in which unit chip resistors are collectively formed in multiple columns and multiple rows by collectively printing an electrode coating and a resistive coating in each unit area, wherein each of the above units An electrode coating of a predetermined shape or/
At the same time, when printing and forming resistive coatings at once,
A chip resistor, characterized in that at least two recognition marks in a certain positional relationship with the pattern of the electrode coating or the resistive coating are printed on a blank space on a substrate using ink for the electrode coating and/or ink for the resistive coating. Substrate for vessel manufacturing. 2. A trimming method in which a predetermined amount of the resistive film is removed by burning off the resistive film with a laser beam from a substrate on which multiple unit chip resistors are formed in multiple rows by printing an electrode film and a resistive film in each unit area at once. In each of the above unit areas, an electrode coating of a predetermined shape or/
At the same time, when printing and forming resistive coatings at once,
At least two recognition marks having a certain positional relationship with the pattern of the electrode coating or the resistive coating are printed on the margins of the substrate using ink for the electrode coating and/or ink for the resistive coating, and are used for trimming in the trimming process. By optically recognizing the recognition mark, the position of the laser beam generator in the surface direction with respect to the substrate and the rotational position around the axis perpendicular to the surface, the electrode coating or/and
and a method for trimming a chip resistor, characterized in that the determination is made based on the pattern of the resistive film.