JPH04321260A - Electronic-circuit module - Google Patents

Abstract

PURPOSE:To lower an interconnection density on a board around a chip and to easily and simply design a conductor circuit pattern or constitute the conductor circuit pattern at an electronic-circuit module in which a semiconductor bare chip is sealed with an insulating resin filled into a dam frame. CONSTITUTION:A dam frame 7 in which a second conductor circuit pattern 6 is formed on its outer circumferential face is bonded and arranged so as to surround a semiconductor bare chip 3 mounted on the face of a circuit board 2; the end part of the conductor circuit pattern 6 of the dam frame 7 is connected electrically to a connecting pad 9 on the face of the circuit board 2. An insulating resin 11 is injected and filled into said dam frame 7; the semiconductor bare chip 3 is sealed airtightly with the resin 11. That is to say, one part (the second conductor circuit pattern 6) of a conductor circuit pattern 1 at the peripheral part of the mounted semiconductor bare chip 3 is formed on the face of the dam frame 7 forming an airtightly sealed region. Thereby, the main point is that an interconnection density on the face of the circuit board 2 is reduced and that the degree of freedom of an interconnection is enhanced.

Description

[Detailed description of the invention]

[Object of the invention]

0002

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic circuit modules, and particularly to electronic circuit modules with high wiring density such as COB (Chip on Board) type and COG (Chip on Glass) type.

0003

2. Description of the Related Art Conventionally, COB or COG type electronic circuit modules configured as follows have been developed and put into practical use. That is, as shown in expanded perspective in FIG. 4, a semiconductor bare chip 3 is die-bonded to a predetermined position on a circuit board 2 having a conductive circuit pattern 1 formed on its main surface, and mounted by wire bonding or the like.
Further, on the circuit board 2, a dam frame 4 made of, for example, synthetic resin is placed.
are arranged and bonded to surround the semiconductor chip 3. In order to protect the semiconductor chip 3, an insulating resin (not shown) is injected into the dam frame 4, and the semiconductor An electronic circuit module having a structure in which a chip 3 is hermetically sealed is known.

0004

However, the electronic circuit module having the above structure has the following practical problems. That is, the peripheral area of the semiconductor chip 3 mounted and mounted on the circuit board 2 surface is particularly exposed to the conductor circuit pattern 1.
Since the arrangement density of the conductor circuits increases, it takes a great deal of time and effort to design conductor circuit patterns. Also, if the circuit board 2
Since the required conductor circuit pattern 1 cannot be formed on only one surface, multi-layer wiring may be required, and there is a problem in that the number of conductor circuit pattern layers must be increased. The present invention has been made to solve these problems, and is an electronic circuit module in which the design of a conductor circuit pattern is easy, the time and labor required for the design is reduced, and the number of layers of the conductor circuit pattern is not increased. The purpose is to provide.

[Configuration of the invention]

[0006]

[Means for Solving the Problems] An electronic circuit module according to the present invention includes a circuit board on which a conductive circuit pattern is formed on the main surface, a semiconductor chip mounted/mounted on the surface of the circuit board, and a semiconductor chip mounted/mounted on the surface of the circuit board. An electronic circuit module comprising a dam frame adhesively arranged on a circuit board surface so as to surround a mounted semiconductor chip, and an insulating resin layer filling the inside of the dam frame and sealing the semiconductor chip, A second conductive circuit pattern is formed on the outer peripheral surface of the dam frame and is electrically connected to connection pads provided on the circuit board surface.

[0007]

[Function] In the electronic circuit module of the present invention configured as described above, a required conductive circuit pattern is formed on the outer peripheral surface of the dam frame that surrounds the semiconductor chip and is placed on the circuit board surface, and Electrically connected to connection pads on the surface of the circuit board. In other words, since a part of the predetermined conductive circuit pattern is formed on the dam frame, the structure of the conductor circuit pattern around the semiconductor chip on the circuit board is changed by the amount of wiring formed on the dam frame surface. It becomes possible to simplify the arrangement, and it is possible to reduce the arrangement density in that area. Therefore, the wiring pattern can be easily designed, the time and labor required for the design can be reduced, and it is also possible to suppress an increase in the number of conductive circuit pattern layers.

[0008]

Embodiments An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.

FIG. 1 is a perspective view showing a main part of an example of the configuration of an electronic circuit module according to the present invention, in which 2 is a circuit board on which a conductor circuit pattern 1 is formed on the main surface, and 3 is the circuit board. It is a semiconductor chip mounted and mounted at predetermined positions on two sides. Thus, the semiconductor chip 3 is electrically connected to the pad portion of the conductor circuit pattern 1 on the circuit board 2 by the bonding wire 5. Reference numeral 7 denotes a rectangular dam frame made of synthetic resin and having a required (desired) second conductor circuit pattern 6 on the outer peripheral surface (top surface and side peripheral surface) on the surface of the circuit board 2; It is arranged and fixed so as to surround the mounted semiconductor chip 3. Describing the mounting structure of the dam frame 7 in detail, the bottom surface of the dam frame 7 is adhered and fixed to the circuit board 2 surface via an adhesive 8, as shown in an enlarged cross-sectional view in FIG. Connection pads 9 are provided at predetermined positions on the surface of the circuit board 2 (ends of the predetermined conductor circuit patterns 6), and each end of the second conductor circuit pattern 6 on the outer peripheral surface of the dam frame 7 is provided with connection pads 9. The portions are respectively bonded to these connection pads 9 by solder 10 and electrically connected. Furthermore, 11 is within the dam frame 7,
This is an insulating resin layer that hermetically seals the mounted semiconductor chip 3, and is formed by, for example, injecting and filling an insulating liquid resin and curing it.

In the above configuration example, the formation of the second conductive circuit pattern 6 disposed on the outer peripheral surface of the dam frame 7 can be easily achieved, for example, by the following means. That is, as shown perspectively in FIG. 3, after forming a required conductive circuit pattern 6 on a predetermined surface of the dam frame 7 using conductive paste or the like, through holes 7a are punched at the ends thereof, and a through hole connection layer is formed. After the (conductor layer) 6a is formed, the end portion is cut and removed along the cutting line indicated by the dashed line, with the center of the through hole 7a as the border. In this way, the conductor layer 6a formed on the inner wall surface of the through hole 7a is used as it is for wiring, and the conductor circuit pattern 6 is formed on the side peripheral surface.

In the electronic circuit module having the above configuration, the second conductor circuit pattern 6 is formed on the outer peripheral surface of the dam frame 7 and is electrically connected to the connection pad 9 provided on the surface of the circuit board 2. It is configured to function as a part of the conductive circuit pattern around the semiconductor chip 3. In other words, in order to achieve a configuration in which the wiring density around the semiconductor chip 3 is substantially increased without using the main surface of the circuit board 2,
The design of the conductive circuit pattern 1 on the surface can be simplified and a large degree of freedom can be provided.

0012

As described above, according to the electronic circuit module of the present invention, the conductor circuit pattern around the semiconductor chip on the substrate can be simplified, and at the same time, the overall wiring density can be increased. Therefore, pattern design on the circuit board becomes easy, the time and labor required for the design can be reduced, and an increase in the number of pattern layers can also be suppressed.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a main part of an example of the configuration of an electronic circuit module according to the present invention.

FIG. 2 is a cross-sectional view showing an enlarged main part of the configuration example shown in FIG. 1;

FIG. 3 is a perspective view schematically showing an example of a method for forming a second conductive circuit pattern on a dam frame surface used in the configuration of an electronic circuit module according to the present invention.

FIG. 4 is an exploded perspective view showing the structure of a conventional electronic circuit module.

[Explanation of symbols]

1... Conductor circuit pattern on the circuit board surface 2... Circuit board 3... Semiconductor chips 4, 7... Dam frame 5... Bonding wire
6... Second conductive circuit pattern 6a... Through hole connection layer 7a... Through hole 8... Adhesive 9... Connection pad 10... Solder 1
1... Sealing resin layer Applicant Toshiba Corporation Agent Patent attorney Suyama
Saichi (1 other person)

Claims (1)

[Claims] Claim 1: A circuit board having a conductor circuit formed on its main surface, a semiconductor chip mounted/mounted on the circuit board, and a semiconductor chip mounted/mounted on the circuit board surface so as to surround the mounted/mounted semiconductor chip. In an electronic circuit module comprising an adhesively arranged dam frame and an insulating resin layer filled in the dam frame and sealing a semiconductor chip, a second conductor circuit is provided on the outer peripheral surface of the dam frame, and a circuit is provided. An electronic circuit module characterized by being electrically connected to connection pads provided on a substrate.