JPH04318023A - Epoxy resin composition - Google Patents

Abstract

PURPOSE:To provide an epoxy resin composition containing an epoxy resin, a phenol compound (novolak compound) having a specific structure and an inorganic filler as main components, and having excellent soldering heat resistance and adhesivity to substrates. CONSTITUTION:The objective composition useful for semiconductor-sealing materials, adhesives, electrically insulating materials, coatings, etc., contains (A) an epoxy resin, preferably a polyepoxy resin, (B) a phenol compound (e.g. a novolak compound) of the formula (R1, R2 are H, 1-5C alkyl) e.g. obtained by the addition reaction of a monocyclic monoterpene with an alkylphenol compound, and (C) an inorganic filler such as molten silica or titanium oxide as main components.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to an epoxy resin composition containing a phenol having a specific structure or a novolak compound of the phenol as a curing agent, and having excellent soldering heat resistance and adhesion.

0002

BACKGROUND OF THE INVENTION Epoxy resin compositions have excellent heat resistance, mechanical properties, electrical properties, etc., and are therefore widely used in semiconductor encapsulation materials, adhesives, electrical insulation materials, paints, and the like.

[0003] In recent years, semiconductor packages sealed with epoxy resin compositions have been increasing in volume and overwhelmingly over ceramic packages due to their improved moisture resistance, ease of mass production, and relatively low cost. There is. Furthermore, as electronic components become smaller and thinner, the shift from conventional insertion type packages to surface mount type packages is rapidly increasing.

However, when these resin-sealed surface mount semiconductor packages are left in the air, the sealing resin absorbs moisture, and the thermal shock caused by soldering to a printed circuit board causes the resin to bond with the lead frame or resin. The interface between the chip surface and the chip surface peels off, impairing the functionality of the semiconductor element and even causing problems such as package cracks. This phenomenon becomes more common as surface mount technology progresses.
As semiconductor packages become thinner and smaller, this problem becomes even more important. Further, even in the case of an epoxy resin adhesive for fixing a semiconductor chip to a lead frame, problems such as cracks occurring in the epoxy resin itself, which is the adhesive layer, have occurred.

In order to solve these problems, instead of the conventional orthocresol novolac type epoxy resin,
Methods of using biphenyl skeleton epoxy resins, low modulus epoxy resins, multifunctional epoxy resins with high glass transition temperatures, methods of adding fillers at higher concentrations, and methods of reducing stress and improving impact resistance. Various methods of dispersing elastomers such as silicone rubber have been studied. However, even with these improved formulations, it has not been possible to obtain an epoxy resin composition that has excellent solder heat resistance and adhesion as desired.

[0006]

[Problem to be solved by the invention] That is, the present invention
An object of the present invention is to provide an epoxy resin composition that has excellent solder heat resistance and adhesion.

[0007]

[Means for Solving the Problems] As a result of intensive studies to solve the above-mentioned problems, the present inventors have developed an epoxy resin composition containing a phenol having a specific structure or a novolac compound of the phenol as a curing agent. The inventors have discovered that this product has excellent solder heat resistance and adhesion, and have arrived at the present invention.

[0008] That is, the present invention has as main components (A) an epoxy resin, (B) a phenol represented by the following general formula [Chemical formula 2] or a novolak compound of the phenol, and (C) an inorganic filler. This is an epoxy resin composition characterized by the following.

[0009]

[Case 2]

The curing agent used in the epoxy resin composition of the present invention is represented by the following general formulas [Chem. 3] and [Chem. , 4-p-mentadiene), α-phellandrene (1,5-p-mentadiene), terpinolene (1,4
(8)-p-mentadiene), β-terpinene (1,7
(3)-p-mentadiene), β-phalandrene (1
, 7(2)-p-mentadiene), to which phenol or an alkylphenol substituted with an alkyl group having 1 to 5 carbon atoms is added. phenols,
Or a novolak compound of the phenols.

[0011] The phenols of the general formula [Formula 1] include, for example, α-terpinene (1,3-p-mentadiene), γ-
Terpinene (1,4-p-mentadiene), α-phellandrene (1,5-p-mentadiene), terpinolene (1,4(8)-p-mentadiene), β-terpinene (1,7(3)- at least one monocyclic monoterpene selected from p-menthadene), β-phalandrene (1,7(2)-p-menthadene), and alkylphenols substituted with phenol or an alkyl group having 1 to 5 carbon atoms. Produced by addition reaction. Number of carbons is 1
Examples of the alkylphenols substituted with an alkyl group of 5 to 5 include cresol, ethylphenol, propylphenol, butylphenol, pentylphenol, etc., and may be used in combination with phenol. Among them, it is preferable to use cresol or butylphenol in combination with phenol. This reaction is a commonly known alkylation reaction of phenols, and can be easily obtained, for example, by Friedel-Crafts reaction in the presence of anhydrous aluminum chloride. Furthermore, the phenol can also be obtained by isomerization reaction of the product.

For example, a Friedel-Crafts reaction of α-terpinene and phenol yields a product containing phenols of the formula [Image Omitted]. Similarly, from α-phellandrene, phenol and cresol, [chemical formula 4]
A product containing phenols of the formula is obtained. Although a by-product with a similar structure may be obtained depending on the reaction conditions, the present invention is characterized by containing a phenol of the general formula [Chemical formula 1] or a novolac compound of the phenol, and It is preferable to isolate and extract only the phenols of the general formula [Formula 1]. Alternatively, if the phenols of general formula [Chemical formula 1] are present in large quantities, extraction may not be necessary.

[0013]

[Chemical formula 3]

[0014]

[C4]

[0015] The novolak compound of the phenol represented by the general formula [Formula 1] can be synthesized by a known method of condensing the phenol represented by the general formula [Formula 1] and formaldehyde under an acidic catalyst.

The epoxy resin composition of the present invention is characterized in that it contains a phenol represented by the above-mentioned general formula [Formula 1] or a novolak compound of the phenol as a curing agent. The amount of these specific phenols or the novolak compound of the phenols added is preferably in the range of 1:0.1 to 1.5 in terms of the ratio of phenolic hydroxyl group equivalent, when the epoxy equivalent of the epoxy resin is 1. . If the amount added is less than 0.1, the soldering heat resistance and the adhesion to the base material will decrease. Moreover, if it exceeds 1.5, the releasability from the mold may deteriorate and fluidity may also be affected. When the total amount of the curing agent in the epoxy resin composition is 100%, it is preferable that the curing agent of the present invention contains 10% or more. If it is less than 10%, the effect of improving the solder heat resistance and adhesion of the resulting epoxy resin composition is insufficient. Additionally, depending on the intended use, if the amount of these specific phenols or novolac compounds of these phenols is too large, it may become difficult to release from the mold or cause problems with fluidity during molding. Therefore, a more preferable amount of the phenol or the novolac compound of the phenol is in the range of 20 to 100%, assuming that the total curing agent in the epoxy resin composition is 100%.

[0017] When a curing agent is used in combination, examples of the curing agent include other phenols, polyhydric phenols, acid anhydrides, amines, dicyandiamide, polysulfide, and the like. More specific phenols include phenol novolac resin, cresol novolac resin,
Examples include novolak type phenols such as tert-butylphenol novolak resin, resol type phenols, and bisphenol A. Examples of the acid anhydride include phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, pyromellitic anhydride, dodecylsuccinic anhydride, and the like. Examples of the amines include metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, diethylenetriamine, triethylenetriamine, diethylaminopropylamine, N-aminoethylpyrelazine, metaxylenediamine, and the like.

The epoxy resins used in the epoxy resin composition of the present invention include orthocresol novolac type epoxy resins, phenol novolac type epoxy resins, bisphenol type epoxy resins, bisphenol A type epoxy resins, 4,4'-bis(2 Epoxy resins with a biphenyl skeleton such as ",3"-epoxypropoxy)-3,3',5,5'-biphenyl, epoxy resins with a naphthalene skeleton, glycidyl ester type epoxy resins, glycidylamine type epoxy resins, chain aliphatic Examples include epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, trifunctional epoxy resins, tetrafunctional epoxy resins, and epoxy resins into which halogens such as bromine are introduced to impart flame retardancy. In the present invention, although the types and structures of these epoxy resins are not particularly limited, from the viewpoint of the desired soldering heat resistance and adhesion, orthocresol novolac type epoxy resins, epoxy resins with a biphenyl skeleton, and epoxy resins with a naphthalene skeleton are used. , polyfunctional epoxy resins, and combination systems thereof are suitable.

Fillers can be added to the epoxy resin composition of the present invention depending on the purpose. Fillers include fused silica, crystalline silica, titanium oxide, silica titania, talc, alumina, zirconia, beryllia, calcium sulfate,
Examples include powders such as calcium carbonate, barium carbonate, silicon nitride, and aluminum nitride, fibers, and whiskers. The type, particle size, blending amount, etc. of these fillers are determined depending on the use and are not particularly limited. Further, the average particle size is preferably 10 to 20 μm or less, and the shape may be selected from any combination of spherical, crushed, or corner-shaped.

Furthermore, in the present invention, a stress reducing agent may be used to impart low stress properties. Stress reducing agents include rubbery substances such as silicone rubber, polysulfide rubber, butadiene rubber, styrene block copolymers and saturated elastomers, various thermoplastic resins, resinous substances such as silicone resins, and epoxy resins. Examples include resins in which part or all of a phenol resin is modified with amino silicone, epoxy silicone, alkoxy silicone, etc. The content of these stress reducing agents is preferably 0.1 to 10% by weight, more preferably 0.3 to 5% by weight, based on the entire epoxy resin composition.
A species or a combination of two or more species may be used.

Furthermore, in the present invention, a curing accelerator can be used to accelerate the curing reaction. As curing accelerators, imidazoles such as 2-methylimidazole, 2,4-dimethylimidazole, and 2-phenylimidazole, 1,8-diazabicyclo(5,4,0
) - Tertiary amines such as undecene and benzyldimethylamine, tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate
2-ethyl-4-methylimidazole tetraphenylborate, tetraphenylboron salts such as N-methylmorpholinetetraphenylborate, triphenylphosphine, triethylphosphine, tri(p-methylphenyl)phosphine, etc. Examples include organic phosphines. These curing accelerators are preferably used in an amount of 0.1 to 10 parts by weight per 100 parts by weight of the epoxy resin, and one type or two or more types can usually be used in combination.

[0022] As the coupling agent, a silane coupling agent such as γ-aminopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, a titanium coupling agent, etc. may be used as appropriate. can be used.

Furthermore, in the case of semiconductor encapsulation applications, it is preferable to add a small amount of a mold release agent, a coloring agent, and a flame retardant. As mold release agents, natural waxes, synthetic waxes,
Examples include straight chain fatty acids and their metal salts, acid amides, esters, paraffins, and silicone compounds. Examples of the colorant include carbon black, and examples of the flame retardant include antimony trioxide, antimony pentoxide, chlorinated paraffin, halogenated epoxy, and phosphorus compounds. Further, for the purpose of improving heat resistance, an imide compound such as bismaleimide may be appropriately blended. Note that in the case of paint or adhesive applications, it is not necessary to incorporate a mold release agent.

The epoxy resin composition of the present invention is produced by mixing the above-mentioned necessary components in a blender or mixer, and then melt-kneading the mixture by a known method using equipment such as rolls, various extruders, and Banbury mixers. It can be manufactured by A pulverization step may be added in the middle to facilitate mixing of the powder mixture.

[0025]

[Examples] The epoxy resin composition of the present invention will be specifically explained below with reference to Examples. [Preparation of phenols and novolac compounds] α-terpinene or α-
From the products obtained by reacting phellandrene with phenol or phenol and cresol (orthocresol), each phenol (P-1 to P-2), which is a phenol represented by the general formula [Chemical formula 1] The isolated products are shown in Table 1.

[0026]

[Table 1]

Table 2 shows the novolak compounds (PN-1 to PN-2) prepared by a condensation reaction between the obtained phenols and formaldehyde under an acidic hydrochloric acid catalyst.

[0028]

[Table 2]

Examples 1 to 6, Comparative Examples 1 to 3 The raw materials shown in Tables 3 and 4 were blended in their respective compositions, kneaded with heated rolls, cooled and ground to produce epoxy resin compositions. Next 9.
A 0 mm square silicon chip for evaluation was mounted on a 42 alloy lead frame and transfer-sealed with an epoxy resin composition having each of the above compositions to form an 80-pin QFP molded body (
package). After the after-cure, it was allowed to absorb moisture for 80 hours at 85°C and 85% relative humidity, and then passed through an IR reflow bath with a maximum temperature of 235°C, assuming soldering.
The solder heat resistance of the package and the adhesion between the epoxy resin composition and the lead frame were evaluated. The evaluation method is shown below.

[1] Packages encapsulated with solder heat resistance epoxy resin compositions
The crack occurrence rate was determined from the number of packages in which external cracks were observed among the 10 packages, and the soldering heat resistance was evaluated.

[2] Adhesion The adhesion between the resin and the back side of the stage of the lead frame of the package encapsulated with each epoxy resin composition was observed using an ultrasonic imaging device, and compared and evaluated using the following criteria. . The entire surface is in close contact
．． ．． ．． ．． ．． ．． The central part of A is adhered and the surrounding area is peeled off. ．． ．． ．． ．． ．． B The entire surface has peeled off.
．． ．． ．． ．． ．． ．． C

0032
]

[Table 3]

[0033]

[Table 4]

[0034] The sources and product names of the materials used in Tables 3 and 4 are as follows. 1) Cresol novolac type epoxy: Nippon Kayaku Co., Ltd.
2) Biphenyl type epoxy: Yuka Shell Epoxy Co., Ltd.
3) Brominated epoxy: manufactured by Dainippon Ink & Chemicals Co., Ltd., product name: YX4000H.
Product name: EP-153 4) Phenol novolac: manufactured by Gunei Chemical Industry Co., Ltd., product name: PSM-4261 5) Styrenic block copolymer: Shell Chemical Co., Ltd.
Manufactured by Shin-Etsu Chemical Co., Ltd., trade name: Kraton G-1652 6) Silicone powder: manufactured by Shin-Etsu Chemical Co., Ltd., trade name:
52-594

[0035]

[Effects of the Invention] As described above, it can be seen that the epoxy resin composition of the present invention has excellent soldering heat resistance and adhesion. Therefore, it is very useful for semiconductor encapsulation materials, paints, and adhesives.

[Table 4]

[Table 4]

Claims (5)

[Claims] Claim 1: (A) an epoxy resin; (B) a phenol represented by the following general formula [Chem. 1] or a novolak compound of the phenol; (C) an epoxy resin whose main component is an inorganic filler; Resin composition. [Chemical formula 1] 2. The epoxy resin composition according to claim 1, wherein the epoxy resin is a polyfunctional epoxy resin. 3. The inorganic filler accounts for 10 to 10% of the total resin composition.
The epoxy resin composition according to claim 1, which is 90% by weight. 4. The inorganic filler accounts for 70 to 70% of the total resin composition.
The epoxy resin composition according to claim 1, which is 90% by weight. 5. The epoxy resin composition according to claim 1, wherein the epoxy resin composition is used for semiconductor encapsulation.