JPH0625384A - Epoxy resin composition and semiconductor device - Google Patents
Epoxy resin composition and semiconductor deviceInfo
- Publication number
- JPH0625384A JPH0625384A JP4201937A JP20193792A JPH0625384A JP H0625384 A JPH0625384 A JP H0625384A JP 4201937 A JP4201937 A JP 4201937A JP 20193792 A JP20193792 A JP 20193792A JP H0625384 A JPH0625384 A JP H0625384A
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- epoxy resin
- formula
- composition
- resin
- resin composition
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、エポキシ樹脂としてビ
フェニル型エポキシ樹脂を主成分として用いたエポキシ
樹脂組成物及びその硬化物で封止された半導体装置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition containing a biphenyl type epoxy resin as an epoxy resin as a main component and a semiconductor device sealed with a cured product thereof.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】現在、
半導体産業の中では樹脂封止型のダイオード、トランジ
スター、ＩＣ、ＬＳＩ、超ＬＳＩが主流となっており、
中でもエポキシ樹脂は、一般に他の熱硬化性樹脂に比べ
成形性、接着性、電気特性、機械特性、耐湿性等に優れ
ているため、エポキシ樹脂組成物で半導体装置を封止す
ることが多く行われているが、最近においてこれらの半
導体装置は集積度が益々大きくなり、これに応じてチッ
プ寸法も大きくなりつつある。一方、これに対しパッケ
ージ外形寸法は電子機器の小型化、軽量化の要求にとも
ない、小型化、薄型化が進んでいる。更に、半導体部品
を回路基板へ取り付ける方法も、基板上の部品の高密度
化や基板の薄型化のため、半導体部品の表面実装が幅広
く行われるようになってきた。2. Description of the Related Art Currently,
In the semiconductor industry, resin-sealed diodes, transistors, ICs, LSIs, VLSIs are the mainstream,
Of these, epoxy resins are generally superior to other thermosetting resins in terms of moldability, adhesiveness, electrical properties, mechanical properties, moisture resistance, etc. Therefore, epoxy resin compositions are often used to seal semiconductor devices. However, in recent years, the integration degree of these semiconductor devices has been increasing, and the chip size has been increasing accordingly. On the other hand, the external dimensions of the package are becoming smaller and thinner along with the demand for smaller and lighter electronic devices. Further, also in the method of attaching a semiconductor component to a circuit board, surface mounting of the semiconductor component has been widely performed due to the high density of components on the substrate and the thinning of the substrate.
【０００３】しかしながら、半導体装置を表面実装する
場合、半導体装置全体を半田槽に浸漬するか又は半田が
溶融する高温ゾーンを通過させる方法が一般的である
が、その際の熱衝撃により封止樹脂層にクラックが発生
したり、リードフレームやチップと封止樹脂との界面に
剥離が生じてしまう。このようなクラックや剥離は、表
面実装時の熱衝撃以前に半導体装置の封止樹脂層が吸湿
していると更に顕著なものとなるが、実際の作業工程に
おいては、封止樹脂層の吸湿は避けられず、このため実
装後のエポキシ樹脂組成物で封止した半導体装置の信頼
性が大きく損なわれる場合がある。However, when the semiconductor device is surface-mounted, it is common to immerse the entire semiconductor device in a solder bath or pass through a high temperature zone where the solder melts. A crack may occur in the layer, or peeling may occur at the interface between the lead frame or chip and the sealing resin. Such cracks and peeling become more noticeable if the sealing resin layer of the semiconductor device absorbs moisture before the thermal shock during surface mounting, but in the actual working process, the moisture absorption of the sealing resin layer This is unavoidable, and therefore the reliability of the semiconductor device sealed with the epoxy resin composition after mounting may be greatly impaired.
【０００４】特に最近においては、エポキシ樹脂として
ビフェニル型エポキシ樹脂を用いることが注目されてい
るが、ビフェニル型エポキシ樹脂を用いたエポキシ樹脂
組成物における上記問題点の解決が要望されている。Particularly, recently, attention has been paid to using a biphenyl type epoxy resin as an epoxy resin, and there is a demand for solving the above-mentioned problems in an epoxy resin composition using a biphenyl type epoxy resin.
【０００５】本発明は、上記事情に鑑みなされたもの
で、流動性が良好であり、成形性に優れていると共に、
内部ボイド等の発生が少なく、ガラス転移温度が高い上
に伸びが大きく、しかも接着性が良好でかつ低吸湿性の
硬化物を与える、ビフェニル型エポキシ樹脂を主成分と
したエポキシ樹脂組成物及びこのエポキシ樹脂組成物の
硬化物で封止された表面実装時の熱衝撃後においても高
い信頼性を有する半導体装置を提供することを目的とす
る。The present invention has been made in view of the above circumstances and has good fluidity and excellent moldability.
An epoxy resin composition containing a biphenyl type epoxy resin as a main component, which gives a cured product with little occurrence of internal voids, high glass transition temperature, large elongation, good adhesion and low hygroscopicity, and the like. An object of the present invention is to provide a semiconductor device which is sealed with a cured product of an epoxy resin composition and has high reliability even after thermal shock during surface mounting.
【０００６】[0006]
【課題を解決するための手段及び作用】本発明者は上記
目的を達成するため鋭意検討を重ねた結果、エポキシ樹
脂、フェノール樹脂、無機質充填剤等を配合してなるエ
ポキシ樹脂組成物において、エポキシ樹脂として、
（ａ）下記一般式（１）で示されるナフタレン環含有エ
ポキシ樹脂と（ｂ）下記一般式（２）で示されるビフェ
ニル型エポキシ樹脂とを重量比で（ａ）／（ｂ）＝０．
１〜１の割合で併用してなるエポキシ樹脂を使用すると
共に、フェノール樹脂として（ｃ）下記一般式（３）で
示される多官能型フェノール樹脂と（ｄ）下記一般式
（４）で示されるアラルキル型フェノール樹脂とを重量
比で（ｃ）／（ｄ）＝０．５〜４の割合で併用してなる
フェノール樹脂を併用した場合、優れた特性を有するエ
ポキシ樹脂組成物が得られることを見出した。Means and Actions for Solving the Problems As a result of intensive studies conducted by the present inventor in order to achieve the above object, as a result, in an epoxy resin composition containing an epoxy resin, a phenol resin, an inorganic filler, etc. As a resin
A weight ratio of (a) a naphthalene ring-containing epoxy resin represented by the following general formula (1) to (b) a biphenyl type epoxy resin represented by the following general formula (2) is (a) / (b) = 0.
An epoxy resin used in combination at a ratio of 1 to 1 is used, and as a phenol resin, (c) a polyfunctional phenol resin represented by the following general formula (3) and (d) a general formula (4) below. When a phenol resin which is used in combination with an aralkyl type phenol resin in a weight ratio of (c) / (d) = 0.5 to 4 is used in combination, an epoxy resin composition having excellent properties is obtained. I found it.
【０００７】即ち、従来のビフェニル型エポキシ樹脂を
主成分とするエポキシ樹脂組成物は成形性、内部ボイド
等の不良発生率の点で満足できるものではなかったが、
これに比べて本発明のエポキシ樹脂組成物は流動性が良
好で成形性に優れ、内部ボイド等の不良発生率が著しく
少ない上、ガラス転移温度が高い上にガラス転移温度以
上の領域で弾性率が低下して伸びが大きくなり、低応力
性に優れ、しかも接着性が良好でかつ低吸湿性の硬化物
を与えることを知見し、本発明をなすに至ったものであ
る。That is, conventional epoxy resin compositions containing a biphenyl type epoxy resin as a main component have not been satisfactory in terms of moldability and the occurrence rate of defects such as internal voids.
In contrast, the epoxy resin composition of the present invention has good flowability and excellent moldability, the incidence of defects such as internal voids is extremely low, the glass transition temperature is high, and the elastic modulus is in the region of the glass transition temperature or higher. The present invention has led to the present invention by finding out that a cured product having a low viscosity and a large elongation, excellent low stress property, good adhesiveness and low hygroscopicity can be obtained.
【０００８】[0008]
【化３】 [Chemical 3]
【０００９】[0009]
【化４】 [Chemical 4]
【００１０】従って、本発明は、 （Ｉ）（ａ）上記一般式（１）で示されるナフタレン環
含有エポキシ樹脂と（ｂ）上記一般式（２）で示される
ビフェニル型エポキシ樹脂とを重量比で（ａ）／（ｂ）
＝０．１〜１の割合で併用してなるエポキシ樹脂、 （ＩＩ）（ｃ）上記一般式（３）で示される多官能型フ
ェノール樹脂と（ｄ）上記一般式（４）で示されるアラ
ルキル型フェノール樹脂とを重量比で（ｃ）／（ｄ）＝
０．５〜４の割合で併用してなるフェノール樹脂、 （ＩＩＩ）無機質充填剤を配合してなるエポキシ樹脂組
成物、及びこのエポキシ樹脂組成物の硬化物で封止され
た半導体装置を提供する。Therefore, according to the present invention, the weight ratio of (I) (a) the naphthalene ring-containing epoxy resin represented by the general formula (1) to (b) the biphenyl type epoxy resin represented by the general formula (2) is used. And (a) / (b)
= II to (1) (c) a polyfunctional phenol resin represented by the general formula (3) and (d) an aralkyl represented by the general formula (4). Type phenolic resin in weight ratio (c) / (d) =
Provided are a phenol resin used together at a ratio of 0.5 to 4, an epoxy resin composition containing (III) an inorganic filler, and a semiconductor device sealed with a cured product of the epoxy resin composition. .
【００１１】以下、本発明につき更に詳細に説明する
と、本発明のエポキシ樹脂組成物は、上述したようにナ
フタレン環含有エポキシ樹脂、ビフェニル型エポキシ樹
脂、特定の構造を有する多官能型フェノール樹脂、アラ
ルキル型フェノール樹脂、無機質充填剤を配合してなる
ものである。The present invention will be described in more detail below. The epoxy resin composition of the present invention comprises a naphthalene ring-containing epoxy resin, a biphenyl type epoxy resin, a polyfunctional phenol resin having a specific structure, and an aralkyl as described above. A type phenol resin and an inorganic filler are blended.
【００１２】ここで、第一必須成分のナフタレン環含有
エポキシ樹脂としては下記一般式（１）で示されるもの
を使用する。The naphthalene ring-containing epoxy resin as the first essential component is represented by the following general formula (1).
【００１３】[0013]
【化５】 [Chemical 5]
【００１４】このようなナフタレン環含有エポキシ樹脂
の具体例としては、下記の化合物を挙げることができ
る。。The following compounds may be mentioned as specific examples of such naphthalene ring-containing epoxy resin. .
【００１５】[0015]
【化６】 [Chemical 6]
【００１６】[0016]
【化７】 [Chemical 7]
【００１７】また、第二必須成分のビフェニル型エポキ
シ樹脂としては、下記一般式（２）で示されるものを使
用するもので、このビフェニル型エポキシ樹脂を上述し
たナフタレン環含有エポキシ樹脂と併用することによ
り、得られる硬化物の接着性を大幅に改善することがで
きる。As the second essential component, a biphenyl type epoxy resin, one represented by the following general formula (2) is used, and this biphenyl type epoxy resin is used in combination with the above-mentioned naphthalene ring-containing epoxy resin. Thereby, the adhesiveness of the obtained cured product can be significantly improved.
【００１８】[0018]
【化８】 [Chemical 8]
【００１９】このようなビフェニル型エポキシ樹脂とし
て具体的には、下記化合物を挙げることができる。Specific examples of such a biphenyl type epoxy resin include the following compounds.
【００２０】[0020]
【化９】 [Chemical 9]
【００２１】なお、上記したビフェニル型エポキシ樹脂
の中でも特に上記式（５）の化合物が、組成物を低粘度
化し得、かつ組成物中の全塩素量を５００ｐｐｍ以下に
することが可能であるという点から好適に使用される。Among the above-mentioned biphenyl type epoxy resins, the compound of the above formula (5) can lower the viscosity of the composition and can reduce the total chlorine content in the composition to 500 ppm or less. It is preferably used from the point.
【００２２】本発明では、エポキシ樹脂として上述した
式（１）のナフタレン環含有エポキシ樹脂（ａ）と式
（２）のビフェニル型エポキシ樹脂（ｂ）とを重量比で
（ａ）／（ｂ）＝０．１〜１、好ましくは０．２〜０．
８の割合で併用する。（ａ）／（ｂ）が０．１に満たな
いと粘度が低くなりすぎて内部ボイドが発生し過ぎる
上、ガラス転移温度も低くなってしまい、（ａ）／
（ｂ）が１を超えると接着性が発現しにくくなると共
に、エポキシ樹脂の溶融粘度が高くなりすぎて多ピンの
パッケージや薄型のパッケージを封止する場合、成形性
に問題が生じて封止後の信頼性が低下してしまう。In the present invention, the naphthalene ring-containing epoxy resin (a) of the formula (1) and the biphenyl type epoxy resin (b) of the formula (2) are used as the epoxy resin in a weight ratio of (a) / (b). = 0.1-1, preferably 0.2-0.
Used together at a ratio of 8. If (a) / (b) is less than 0.1, the viscosity will be too low and internal voids will be generated too much, and the glass transition temperature will also be low, resulting in (a) /
When (b) is more than 1, adhesiveness becomes difficult to develop, and when the epoxy resin has too high a melt viscosity to seal a multi-pin package or a thin package, a problem occurs in moldability and sealing. Later reliability will be reduced.
【００２３】本発明組成物には、上記エポキシ樹脂に加
えてその他のエポキシ樹脂を併用することができ、その
他のエポキシ樹脂として代表的には、１分子中にエポキ
シ基を少なくとも２個以上有するエポキシ樹脂、具体的
には、ビスフェノ−ルＡ型エポキシ樹脂、フェノ−ルノ
ボラック型エポキシ樹脂、トリフェノ−ルアルカン型エ
ポキシ樹脂及びその重合体、ジシクロペンタジエン型エ
ポキシ樹脂、フェノ−ルアラルキル型エポキシ樹脂、グ
リシジルエステル型エポキシ樹脂、脂環式エポキシ樹
脂、複素環式エポキシ樹脂、ハロゲン化エポキシ樹脂等
が例示される。In the composition of the present invention, in addition to the above epoxy resin, other epoxy resin can be used in combination, and the other epoxy resin is typically an epoxy having at least two epoxy groups in one molecule. Resin, specifically, bisphenol A type epoxy resin, phenol novolak type epoxy resin, triphenol alkane type epoxy resin and its polymer, dicyclopentadiene type epoxy resin, phenol aralkyl type epoxy resin, glycidyl ester type Examples thereof include epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, halogenated epoxy resin and the like.
【００２４】この場合、上記式（１）のナフタレン環含
有エポキシ樹脂及び式（２）のビフェニル型エポキシ樹
脂（ｂ）の配合割合は、組成物中のエポキシ樹脂全体の
５０％（重量％、以下同様）以上、特に７０〜８５％と
することが低吸水率、高接着力、高ガラス転移温度を維
持する点から好ましい。In this case, the blending ratio of the naphthalene ring-containing epoxy resin of the above formula (1) and the biphenyl type epoxy resin (b) of the above formula (2) is 50% (wt%, below) of the whole epoxy resin in the composition. The same) or more, especially 70 to 85% is preferable from the viewpoint of maintaining low water absorption, high adhesive strength and high glass transition temperature.
【００２５】次に、本発明組成物には、上記エポキシ樹
脂の硬化剤として作用するフェノ−ル樹脂として、下記
一般式（３）で示される多官能型フェノール樹脂と
（ｄ）下記一般式（４）で示されるアラルキル型フェノ
ール樹脂とを併用して使用する。このように式（１）及
び（２）のエポキシ樹脂の硬化剤として式（３）及び
（４）のフェノール樹脂を併用することにより、１５０
℃以上のガラス転移温度を示すにもかかわらず、ガラス
転移温度以上の領域で顕著な低弾性化を図ることができ
る。Next, in the composition of the present invention, as a phenol resin which acts as a curing agent for the above epoxy resin, a polyfunctional phenol resin represented by the following general formula (3) and (d) the following general formula ( It is used in combination with the aralkyl type phenol resin represented by 4). Thus, by using the phenol resins of the formulas (3) and (4) together as a curing agent for the epoxy resins of the formulas (1) and (2), 150
Despite exhibiting a glass transition temperature of 0 ° C. or higher, it is possible to achieve a remarkable low elasticity in the region of the glass transition temperature or higher.
【００２６】[0026]
【化１０】 [Chemical 10]
【００２７】ここで、上記式（３）の多官能型フェノー
ル樹脂として具体的には、下記化合物を例示することが
できる。Specific examples of the polyfunctional phenol resin represented by the above formula (3) include the following compounds.
【００２８】[0028]
【化１１】 [Chemical 11]
【００２９】なお、これらの多官能型フェノール樹脂の
中では特に上記式（６）の化合物が組成物を低粘度化
し、かつ安定した成形性、硬化性を付与できるという点
から好適に使用される。Among these polyfunctional phenolic resins, the compound of the above formula (6) is particularly preferably used from the viewpoint of lowering the viscosity of the composition and imparting stable moldability and curability. .
【００３０】また、上記式（４）のアルケニル型フェノ
ール樹脂として具体的には、下記化合物を例示すること
ができる。Specific examples of the alkenyl type phenol resin of the above formula (4) include the following compounds.
【００３１】[0031]
【化１２】 [Chemical 12]
【００３２】本発明では、フェノール樹脂として上述し
た式（３）の多官能型フェノール樹脂（ｃ）と式（４）
のアルケニル型フェノール樹脂（ｄ）とを重量比で
（ｃ）／（ｄ）＝０．５〜４、好ましくは１〜３の割合
で併用する。（ｃ）／（ｄ）が０．５に満たないとガラ
ス転移温度が低くなりすぎ、（ｃ）／（ｄ）が４を超え
ると吸水率が増大し、また良好な接着力も得られなくな
る場合が生じる。In the present invention, the polyfunctional phenolic resin (c) of the formula (3) and the formula (4) are used as the phenolic resin.
The alkenyl-type phenol resin (d) is used in a weight ratio of (c) / (d) = 0.5 to 4, preferably 1 to 3. When (c) / (d) is less than 0.5, the glass transition temperature becomes too low, and when (c) / (d) exceeds 4, the water absorption rate increases and good adhesive strength cannot be obtained. Occurs.
【００３３】また、フェノール樹脂として、上記フェノ
ール樹脂（ｃ），（ｄ）に加え、従来から公知のフェノ
ール樹脂、例えばノボラック型フェノ−ル樹脂、レゾ−
ル型フェノ−ル樹脂、トリフェノ−ルアルカン型樹脂、
ナフタレン環含有フェノ−ル樹脂、ジシクロペンタジエ
ン型フェノール樹脂等を添加することができる。なお、
これらの中でもナフタレン環含有フェノ−ル樹脂、ジシ
クロペンタジエン型フェノール樹脂が好適に使用され
る。As the phenolic resin, in addition to the above-mentioned phenolic resins (c) and (d), conventionally known phenolic resins such as novolac type phenolic resin and resor
Type phenol resin, triphenol alkane type resin,
A naphthalene ring-containing phenol resin, a dicyclopentadiene type phenol resin, or the like can be added. In addition,
Among these, naphthalene ring-containing phenol resin and dicyclopentadiene type phenol resin are preferably used.
【００３４】なお、上記式（３）の多官能型フェノール
樹脂及び式（４）のアルケニル型フェノール樹脂の配合
割合は、組成物中のフェノール樹脂全体の１０％以上、
特に３０〜１００％となるようにすることが高ガラス転
移温度、高接着、低吸湿化を図る点で好ましい。The compounding ratio of the polyfunctional phenolic resin of the formula (3) and the alkenylic phenolic resin of the formula (4) is 10% or more of the total phenolic resin in the composition,
In particular, it is preferably set to 30 to 100% from the viewpoint of achieving high glass transition temperature, high adhesion and low moisture absorption.
【００３５】本発明においては、エポキシ樹脂とフェノ
−ル樹脂とをエポキシ樹脂中のエポキシ基の量とフェノ
−ル樹脂中のフェノ−ル性水酸基の量との比が０．５〜
２、特に０．８〜１．５の範囲にあるように配合するこ
とが好ましく、配合比が上記範囲外になると未反応のエ
ポキシ樹脂もしくはフェノール樹脂が残り、十分な強度
が得られなかったり、耐湿性を低下させる場合がある。In the present invention, the ratio of the amount of the epoxy groups in the epoxy resin to the amount of the phenolic hydroxyl group in the phenol resin is 0.5 to 5 in the epoxy resin and the phenol resin.
2, especially it is preferable to mix so as to be in the range of 0.8 to 1.5. If the mixing ratio is out of the above range, unreacted epoxy resin or phenol resin remains, and sufficient strength may not be obtained, Moisture resistance may be reduced.
【００３６】なお、本発明では上記フェノ−ル樹脂と共
にアミン系硬化剤、酸無水物系硬化剤等のその他の硬化
剤を本発明の目的を妨げない範囲で併用することもでき
る。In the present invention, other curing agents such as amine-based curing agents and acid anhydride-based curing agents may be used in combination with the above-mentioned phenol resin within the range not impairing the object of the present invention.
【００３７】本発明において、無機質充填剤としては、
通常エポキシ樹脂組成物に配合されるものを使用するこ
とができる。具体的には、溶融シリカ、結晶性シリカ等
のシリカ類、アルミナ、窒化珪素、窒化アルミ、ボロン
ナイトライド、酸化チタン、ガラス繊維等が挙げられ、
中でも溶融シリカが好適である。In the present invention, as the inorganic filler,
What is normally mix | blended with an epoxy resin composition can be used. Specific examples thereof include fused silica, silicas such as crystalline silica, alumina, silicon nitride, aluminum nitride, boron nitride, titanium oxide, and glass fiber.
Of these, fused silica is preferable.
【００３８】これら無機質充填剤の平均粒径や形状は特
に限定されないが、溶融シリカとしては、平均粒径が３
〜１５μｍであるものが好ましく、また高充填化やチッ
プ表面に対する応力を小さくするため球状のものが好ま
しく使用される。なお、無機質充填剤は樹脂とその表面
の結合強度を強くするため、予めシランカップリング剤
などで表面処理したものを使用することが好ましい。更
に微細シリカ（平均粒径０．５〜３μｍ）を少量添加す
ると樹脂強度を更に向上させることもできる。The average particle size and shape of these inorganic fillers are not particularly limited, but as fused silica, the average particle size is 3
The thickness is preferably about 15 μm, and the spherical shape is preferably used in order to increase the packing density and reduce the stress on the chip surface. The inorganic filler is preferably surface-treated with a silane coupling agent or the like in advance in order to increase the bond strength between the resin and its surface. Furthermore, the resin strength can be further improved by adding a small amount of fine silica (average particle size 0.5 to 3 μm).
【００３９】上記無機質充填剤は１種類を単独で使用し
ても２種類以上を併用してもよく、その配合量は特に制
限されないが、エポキシ樹脂及びフェノール樹脂の合計
量１００部に対して１００〜１０００部、特に２００〜
７００部の範囲とすることが好ましい。The above-mentioned inorganic fillers may be used alone or in combination of two or more, and the compounding amount thereof is not particularly limited, but is 100 per 100 parts of the total amount of the epoxy resin and the phenol resin. ~ 1000 parts, especially 200 ~
The range of 700 parts is preferable.
【００４０】更に、本発明組成物には、硬化触媒を配合
することができる。硬化触媒としては、例えばイミダゾ
−ル化合物、三級アミン化合物、リン系化合物等が挙げ
られ、その配合量は特に制限されないが、エポキシ樹脂
及びフェノール樹脂の合計量１００部に対して０．１〜
２部、特に０．４〜１．５部とすることが好ましい。Further, a curing catalyst may be added to the composition of the present invention. Examples of the curing catalyst include imidazole compounds, tertiary amine compounds, phosphorus compounds, and the like, and the compounding amount thereof is not particularly limited, but is 0.1 to 100 parts by total amount of the epoxy resin and the phenol resin.
It is preferably 2 parts, especially 0.4 to 1.5 parts.
【００４１】本発明の組成物には、更に必要に応じてそ
の他の各種添加剤を配合することができる。例えば熱可
塑性樹脂、熱可塑性エラストマー、有機合成ゴム、シリ
コーン系等の低応力剤、カルナバワックス等のワックス
類、ステアリン酸等の脂肪酸及びその金属塩、カーボン
ブラック、コバルトブルー、ベンガラ等の顔料、酸化ア
ンチモン、ハロゲン化合物等の難燃化剤、グリシドキシ
プロピルトリメトキシシラン等のシランカップリング
剤、アルキルチタネート類等の表面処理剤、老化防止
剤、ハロゲントラップ剤等の添加剤を配合することがで
きる。特に本発明組成物には、添加剤としてシリコーン
変性のエポキシ樹脂やフェノール樹脂を加えると低応力
化を図ることができ、また熱可塑性樹脂、例えばスチレ
ン−ブタジエン−メタクリル酸メチル共重合体等の添加
により高接着性、耐衝撃性を得ることができる。The composition of the present invention may further contain various other additives, if desired. For example, thermoplastic resins, thermoplastic elastomers, organic synthetic rubbers, low stress agents such as silicones, waxes such as carnauba wax, fatty acids such as stearic acid and metal salts thereof, pigments such as carbon black, cobalt blue and red iron oxide, oxidation. Flame retardants such as antimony and halogen compounds, silane coupling agents such as glycidoxypropyltrimethoxysilane, surface treatment agents such as alkyl titanates, antiaging agents, and additives such as halogen trapping agents may be added. it can. In particular, when a silicone-modified epoxy resin or phenol resin is added as an additive to the composition of the present invention, stress can be reduced, and a thermoplastic resin such as a styrene-butadiene-methyl methacrylate copolymer is added. Thus, high adhesiveness and impact resistance can be obtained.
【００４２】本発明のエポキシ樹脂組成物は、その製造
に際して上述した成分の所定量を均一に撹拌、混合し、
予め７０〜９５℃に加熱してあるニーダー、ロール、エ
クストルーダーなどにより混練、冷却し、粉砕するなど
の方法で得ることができる。ここで、成分の配合順序に
特に制限はない。The epoxy resin composition of the present invention is prepared by uniformly stirring and mixing predetermined amounts of the above-mentioned components during the production.
It can be obtained by a method of kneading with a kneader, roll, extruder or the like which has been heated to 70 to 95 ° C. in advance, cooling and pulverizing. Here, there is no particular limitation on the order of mixing the components.
【００４３】このようにして得られる本発明のエポキシ
樹脂組成物はＳＯＰ、ＳＯＪ、ＴＳＯＰ、ＴＱＦＰなど
の半導体装置の封止用に有効に使用でき、この場合、成
形は従来より採用されている成形法、例えばトランスフ
ァー成形、インジェクション成形、注型法などを採用し
て行うことができる。なお、本発明のエポキシ樹脂組成
物の成形温度は１５０〜１８０℃で３０〜１８０秒、ポ
ストキュアーは１５０〜１８０℃で２〜１６時間行うこ
とが望ましい。The thus obtained epoxy resin composition of the present invention can be effectively used for sealing semiconductor devices such as SOP, SOJ, TSOP and TQFP. In this case, molding which has been conventionally adopted is used. For example, transfer molding, injection molding, casting method or the like can be adopted. The molding temperature of the epoxy resin composition of the present invention is preferably 150 to 180 ° C. for 30 to 180 seconds, and the post cure is preferably 150 to 180 ° C. for 2 to 16 hours.
【００４４】[0044]
【発明の効果】本発明のエポキシ樹脂組成物は、流動性
が良好で成形性に優れ、また内部ボイド等の発生が少な
く、ガラス転移温度が高い上に伸びが大きく、しかも接
着性が良好でかつ低吸湿性の硬化物を与える。それ故、
本発明組成物でパワ−トランジスタ−、パワ−ＩＣ等の
フルモ−ルドパッケ−ジを封止しすると未充填などの不
具合がなく、熱放散性に優れた信頼性の高い半導体製品
を生産性良く製造することができる。The epoxy resin composition of the present invention has good fluidity and excellent moldability, has few internal voids, has a high glass transition temperature, has a large elongation, and has good adhesiveness. It also gives a cured product with low hygroscopicity. Therefore,
When the composition of the present invention is used to seal a full-mold package such as a power transistor or a power IC, there is no problem such as unfilling, and a highly reliable semiconductor product excellent in heat dissipation is produced with high productivity. can do.
【００４５】[0045]
【実施例】以下、実施例及び比較例を示して本発明を具
体的に説明するが、本発明は下記実施例に制限されるも
のではない。なお、各例中の部はいずれも重量部であ
る。EXAMPLES The present invention will be specifically described below with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples. All parts in each example are parts by weight.
【００４６】また、各例については次の諸試験を行っ
た。 （イ）スパイラルフロー ＥＭＭＩ規格に準じた金型を使用して１７５℃、７０ｋ
ｇ／ｃｍ2の条件で測定した。 （ロ）曲げ強さ及び曲げ弾性率 ＪＩＳ−Ｋ６９１１に準じて１７５℃、７０ｋｇ／ｃｍ
2、成形時間２分の条件で１０×４×１００ｍｍの曲げ
試験片を成形し、１８０℃で４時間ポストキュアーした
ものについて２１５℃で測定した。 （ハ）膨張係数、ガラス転移温度 直径４ｍｍ、長さ１５ｍｍの試験片を用いて、ＴＭＡ法
により毎分５℃の速さで昇温したときの値を測定した。 （ニ）吸湿後の耐半田クラック性 ８０ピンＱＦＰをエポキシ樹脂組成物で１７５℃、７０
ｋｇ／ｃｍ2、成形時間２分の条件で成形し、１８０℃
で４時間ポストキュアーした。これを８５℃／８５％Ｒ
Ｈの雰囲気に１６８時間放置した後、ＩＲリフローを３
０秒間行いパッケージクラック数を測定した。 （ホ）吸水率 成形時間１７５℃、７０ｋｇ／ｃｍ2、成形時間２分の
条件で成形し、１８０℃で４時間ポストキュアーした直
径５０ｍｍ、厚さ２ｍｍの円板を１２１℃／１００％Ｒ
Ｈの雰囲気に２４時間放置し、吸水率を測定した。 （ヘ）接着性 ４２アロイ板に直径５ｍｍの円筒成形品を１７５℃、７
０ｋｇ／ｃｍ2、成形時間２分の条件で成形し、１８０
℃で４時間ポストキュアーした後、成形物と４２アロイ
との接着力を測定した。The following tests were carried out for each example. (A) Spiral flow 175 ° C, 70k using a mold conforming to EMMI standard
It was measured under the condition of g / cm 2 . (B) Flexural strength and flexural modulus 175 ° C, 70 kg / cm according to JIS-K6911
2. A bending test piece of 10 × 4 × 100 mm was molded under the condition of molding time of 2 minutes, and post-cured at 180 ° C. for 4 hours, and the measurement was performed at 215 ° C. (C) Expansion coefficient, glass transition temperature Using a test piece having a diameter of 4 mm and a length of 15 mm, the value when the temperature was raised at a rate of 5 ° C. per minute by the TMA method was measured. (D) Solder crack resistance after moisture absorption 80-pin QFP was cured with an epoxy resin composition at 175 ° C. and 70
Molded under conditions of kg / cm 2 and molding time of 2 minutes, 180 ℃
I did post cure for 4 hours. This is 85 ℃ / 85% R
After leaving in H atmosphere for 168 hours, IR reflow is performed for 3 hours.
The number of package cracks was measured for 0 seconds. (E) Water absorption rate Molded under the conditions of molding time of 175 ° C, 70 kg / cm 2 , molding time of 2 minutes, and post-cured at 180 ° C for 4 hours.
The sample was left in an H 2 atmosphere for 24 hours, and the water absorption rate was measured. (F) Adhesiveness A cylindrical molded product having a diameter of 5 mm was formed on a 42 alloy plate at 175 ° C. for 7 days.
Molded under the conditions of 0 kg / cm 2 and molding time of 2 minutes, 180
After post-curing at 4 ° C. for 4 hours, the adhesive strength between the molded product and 42 alloy was measured.
【００４７】〔実施例、比較例〕下記に示すエポキシ樹
脂及びフェノ−ル樹脂を表１に示す割合で使用し、硬化
触媒として１，８−ジアザビシクロ（５．４．０）ウン
デセン−７を０．６部、トリフェニルホスフィン０．５
部、下記に示す溶融シリカ（Ｉ）２５０部、溶融シリカ
（ＩＩ）２５０部、溶融シリカ（ＩＩＩ）５０部、三酸
化アンチモン８部、カ−ボンブラック１．５部、カルナ
バワックス１部及びγーグリシドキシプロピルトリメト
キシシラン３部を熱２本ロ−ルで均一に溶融混合し、冷
却、粉砕して９種のエポキシ樹脂組成物（実施例１〜
５、比較例１〜４）を得た。[Examples and Comparative Examples] The following epoxy resins and phenolic resins were used in the proportions shown in Table 1, and 1,8-diazabicyclo (5.4.0) undecene-7 was used as a curing catalyst. .6 parts, triphenylphosphine 0.5
Parts, 250 parts of fused silica (I), 250 parts of fused silica (II), 50 parts of fused silica (III), 8 parts of antimony trioxide, 1.5 parts of carbon black, 1 part of carnauba wax and γ -Glycidoxypropyltrimethoxysilane (3 parts) was uniformly melt-mixed with two heat rolls, cooled and pulverized to obtain 9 kinds of epoxy resin compositions (Examples 1 to 1).
5, Comparative Examples 1 to 4) were obtained.
【００４８】得られたエポキシ樹脂組成物について上記
諸試験を行った。結果を表１に示す。The above-mentioned tests were conducted on the obtained epoxy resin composition. The results are shown in Table 1.
【００４９】[0049]
【化１３】 [Chemical 13]
【００５０】[0050]
【化１４】 [Chemical 14]
【００５１】溶融シリカ （Ｉ）比表面積１．４ｍ2／ｇ，平均粒径１５μｍの球
状シリカ （ＩＩ）比表面積２．５ｍ2／ｇ，平均粒径１０μｍの
球状シリカ （ＩＩＩ）比表面積１０ｍ2／ｇ，平均粒径１．０μｍ
の球状シリカFused silica (I) Spherical silica having a specific surface area of 1.4 m 2 / g and average particle size of 15 μm (II) Spherical silica having a specific surface area of 2.5 m 2 / g and average particle size of 10 μm (III) Specific surface area of 10 m 2 / G, average particle size 1.0 μm
Spherical silica
【００５２】[0052]
【表１】 [Table 1]
【００５３】表１の結果より、エポキシ樹脂組成物（実
施例１〜５）は、流動性が良好であると共に内部ボイド
等の発生が少なく成形性に優れ、ガラス転移温度が高い
上に伸びが大きく、しかも接着性が良好でかつ低吸湿性
の硬化物を与えることが確認された。From the results shown in Table 1, the epoxy resin compositions (Examples 1 to 5) have good fluidity, few internal voids, excellent moldability, high glass transition temperature and elongation. It was confirmed that a cured product having a large size, good adhesion, and low hygroscopicity was provided.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０８Ｌ 63/00 ＮＫＴ 8830−4Ｊ Ｈ０１Ｌ 23/29 23/31 (72)発明者 青木 貴之 群馬県碓氷郡松井田町大字人見１番地10 信越化学工業株式会社シリコーン電子材料 技術研究所内 (72)発明者 富吉 和俊 群馬県碓氷郡松井田町大字人見１番地10 信越化学工業株式会社シリコーン電子材料 技術研究所内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number within the agency FI Technical display location C08L 63/00 NKT 8830-4J H01L 23/29 23/31 (72) Inventor Takayuki Aoki Gunma Prefecture Usui Gunji-Matsuida-cho, Oita Hitomi 1 Shin-Etsu Chemical Co., Ltd. Silicone Electronic Materials Research Laboratory (72) Inventor Kazutoshi Tomiyoshi, Gunma Prefecture Usida-Gun, Matsuida-cho Ohito Hitomi 1 Shin-Etsu Chemical Industry Silicone Electronic Materials Research Institute
Claims (2)
るナフタレン環含有エポキシ樹脂と（ｂ）下記一般式
（２）で示されるビフェニル型エポキシ樹脂とを重量比
で（ａ）／（ｂ）＝０．１〜１の割合で併用してなるエ
ポキシ樹脂、 【化１】 （ＩＩ）（ｃ）下記一般式（３）で示される多官能型フ
ェノール樹脂と（ｄ）下記一般式（４）で示されるアラ
ルキル型フェノール樹脂とを重量比で（ｃ）／（ｄ）＝
０．５〜４の割合で併用してなるフェノール樹脂、 【化２】 （ＩＩＩ）無機質充填剤を配合してなることを特徴とす
るエポキシ樹脂組成物。1. A weight ratio of (I) (a) a naphthalene ring-containing epoxy resin represented by the following general formula (1) to (b) a biphenyl type epoxy resin represented by the following general formula (2) (a). / (B) = an epoxy resin used in combination at a ratio of 0.1 to 1, (II) (c) A polyfunctional phenolic resin represented by the following general formula (3) and (d) an aralkyl type phenolic resin represented by the following general formula (4) in a weight ratio of (c) / (d) =
Phenolic resin used in combination at a ratio of 0.5 to 4, (III) An epoxy resin composition comprising an inorganic filler.
物で封止された半導体装置。2. A semiconductor device encapsulated with a cured product of the epoxy resin composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20193792A JP2658752B2 (en) | 1992-07-06 | 1992-07-06 | Epoxy resin composition and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20193792A JP2658752B2 (en) | 1992-07-06 | 1992-07-06 | Epoxy resin composition and semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0625384A true JPH0625384A (en) | 1994-02-01 |
| JP2658752B2 JP2658752B2 (en) | 1997-09-30 |
Family
ID=16449259
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20193792A Expired - Fee Related JP2658752B2 (en) | 1992-07-06 | 1992-07-06 | Epoxy resin composition and semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2658752B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0915118A1 (en) * | 1997-11-10 | 1999-05-12 | Sumitomo Bakelite Company Limited | Epoxy resin composition and semiconductor device encupsulated therewith |
| JP2003176335A (en) * | 2002-10-11 | 2003-06-24 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device using the same |
| JP2006291094A (en) * | 2005-04-13 | 2006-10-26 | Yokohama Rubber Co Ltd:The | Epoxy resin composition for reinforced composite material |
-
1992
- 1992-07-06 JP JP20193792A patent/JP2658752B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0915118A1 (en) * | 1997-11-10 | 1999-05-12 | Sumitomo Bakelite Company Limited | Epoxy resin composition and semiconductor device encupsulated therewith |
| JPH11140277A (en) * | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device produced by using the composition |
| US6242110B1 (en) | 1997-11-10 | 2001-06-05 | Sumitomo Bakelite Company Limited | Epoxy resin composition and semiconductor device using the same |
| JP2003176335A (en) * | 2002-10-11 | 2003-06-24 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device using the same |
| JP2006291094A (en) * | 2005-04-13 | 2006-10-26 | Yokohama Rubber Co Ltd:The | Epoxy resin composition for reinforced composite material |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2658752B2 (en) | 1997-09-30 |
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