JPH04315930A - Temperature monitoring device - Google Patents

Abstract

PURPOSE:To detect abnormality in temperature inside a power distribution panel and the like automatically in a relatively simple configuration. CONSTITUTION:There are provided a radiation thermometer 1 detecting the temp. of heat emitting body in a remote manner; scanning means letting the thermometer 1 face-scan a measurement range; setting means 7 setting coordinates Px, Py indicating each measurement point in the measurement range and a limit temperature T and radiation in the coordinates Px, Py. There are provided a set data storing means 3 storing the set data set by the setting means 7; a compensation means 2 compensating the temperature measured by the radiation thermometer 1 according to the radiation to be the temperature of the heating body; comparison means 2 comparing the temperatures of heat emitting body and limit to each other; and a judgement means 2 judging the existance of abnormality from the comparison result of the comparison means 2.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention is a temperature monitor that automatically and remotely measures the temperature inside a power distribution board and other parts equipped with a heating element to determine whether there is an abnormality or to monitor abnormal locations. Regarding equipment.

0002

2. Description of the Related Art One possible application of radiation thermometers and thermography is checking for temperature abnormalities inside a switchboard.

[0003] Conventionally, as a technology for automatically measuring temperature, a radiation thermometer scans a power device along the X-axis and Y-axis, and the load state and heat generation temperature of the power device are set as parameters. A method has been proposed that uses a parameter setting device and a power detector to detect an abnormal rise in temperature by taking into account ambient temperature conditions and operating conditions (Japanese Patent Application Laid-Open No. 1983-1999).
162637).

[0004] Furthermore, Japanese Patent Laid-Open No. 59-50322 discloses a device that detects temperature abnormalities by taking an image of the entire board in which electronic components are incorporated using a thermography and comparing it with a pre-stored normal pattern. Are listed. Furthermore, Japanese Patent Publication No. 58-254 discloses that an abnormality is detected by tightening the connection between electronic components with a concave bolt with a black head and detecting infrared light from the bolt head with an infrared detection element. The equipment that does this is described. Also, Jikai Showa 6
0-158299 is equipped with a spiral running rail, an infrared intensity detector, and a data processor, and detects an abnormality by comparing the absolute value of the detection signal or the differential value of the detection signal with a reference value. Equipment monitoring equipment is described.

[0005]

[Problem to be solved by the invention] The above-mentioned Japanese Patent Application Laid-Open No. 62-16
The device described in the No. 2637 publication requires many members in addition to the radiation thermometer, leading to an increase in the size of the device. Furthermore, since the location of the abnormality can only be confirmed from the coordinate data, it is difficult to determine the specific location.

[0006] The apparatus described in Japanese Patent Application Laid-open No. 59-50322 requires a separate configuration for accurately and synchronously comparing the normal pattern and the pattern during measurement. The device described in the publication requires the same number of detection elements as the number of connections, which makes the device complicated and makes it difficult to specifically identify abnormal locations.

[0007] In the device described in Japanese Utility Model Application Publication No. 60-158299, the structure of the traveling section is large-scale, making it inevitable to increase the size of the device and making it difficult to specifically identify abnormal locations.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to automatically and reliably detect temperature and abnormality with a simple configuration, and also to make it possible to specifically identify abnormal locations.

[0009]

[Means for Solving the Problems] The present invention provides a radiation thermometer for remotely measuring the temperature of a heating element, a scanning means for using the radiation thermometer to scan a measurement range, and a radiation thermometer for remotely measuring the temperature of a heating element. A setting means for setting the coordinates indicating each measurement point, a limit temperature and emissivity at the coordinates, a setting data storage means for storing the setting data set by the setting means, and a setting data storage means for storing the setting data set by the setting means, A correction means for correcting the heating element temperature using the emissivity, a comparison means for comparing the heating element temperature and the limit temperature, and a determination means for determining the presence or absence of an abnormality from the comparison result by the comparison means. (Claim 1).

[0010] The present invention also includes a radiation thermometer for remotely measuring the temperature of a heating element, a scanning means for using the radiation thermometer to scan a surface within a measurement range, a thermometer for detecting external temperature, and a thermometer for detecting an external temperature. a setting means for setting coordinates indicating each measurement point in the coordinates, a limit temperature, a limit temperature difference, and an emissivity at the coordinates; a setting data storage means for storing setting data set by the setting means; and the radiation thermometer. correction means for correcting the temperature measured by the emissivity to obtain the heating element temperature;
a first comparison means for comparing the temperature of the heating element and the limit temperature; and a second comparison means for comparing the temperature difference between the temperature of the heating element and the external temperature detected by the thermometer and the limit temperature difference. and a determining means for determining the presence or absence of an abnormality from the comparison results by the first and second comparing means (
Claim 2).

Further, in the invention according to claim 1 or 2, there is provided a position storage means for storing the measurement point determined to be abnormal by the discrimination means, an instruction means, and the position storage means stores the measurement point according to an instruction from the instruction means. scan control means for operating the scanning means in order to measure the measurement point at which the heating element is being measured (claim 3); and a storage means for storing the material of the heating element and the emissivity in association and a converting means for converting material to emissivity, and it is preferable that the setting means is capable of setting the emissivity using the material (claim 4).

0012

[Operation] According to the invention as claimed in claim 1, the radiation thermometer has the following features:
The measurement range is scanned by the scanning means, and the radiation temperature from the heating element within the measurement range is remotely measured. Coordinates indicating the measurement point to be measured within the measurement range, and setting data for the limit temperature and emissivity at the coordinates are input in advance by the setting means, and these setting data are stored in the setting data storage means. Then, the temperature measured by the radiation thermometer is corrected by taking into account the emissivity of the heating element,
The corrected heating element temperature and the limit temperature are compared by a comparing means. Based on the comparison result by the comparison means, it is determined whether the heat generation temperature at the measurement point is abnormal.

According to the second aspect of the invention, in addition to the comparison between the heating element temperature and the above-mentioned limit temperature by the first comparing means, the temperature difference between the heating element temperature and the external temperature detected by the thermometer is The above-mentioned limit temperature difference is compared by the second comparing means. Then, it is determined from the comparison results by the first comparison means and the second comparison means whether or not the heat generation temperature at the measurement point is abnormal.

[0014] According to the third aspect of the invention, the measurement points determined to be abnormal by the discriminating means are sequentially stored in the position storing means. Then, when an instruction is given by the instruction means, for example, by key operation, the scanning means is operated so that the radiation thermometer measures the measurement point determined to be abnormal.

According to the fourth aspect of the invention, the material set by the setting means is internally converted into emissivity, and the correction means uses the converted emissivity to correct the temperature obtained by the radiation thermometer. I do.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 2 is a diagram showing a temperature monitoring device according to the present invention installed inside a switchboard. In the figure, a power distribution board 20 is equipped with a large number of power devices and is also provided with wiring to connect the devices, and a radiation thermometer 1 remotely measures the temperature of such a portion.
It is arranged at a suitable position on the front side of the camera as will be described later.

That is, on one front side of the switchboard 20, there is a Y
An axis rail 30 is arranged upright, and the Y-axis rail 30 is provided with a horizontally oriented X-axis rail 40. One end of this X-axis rail 40 has the above-mentioned Y-axis rail 3
A structure that is slidable in the axial direction of 0 is formed. The radiation thermometer 1 is mounted so as to be slidable horizontally on the X-axis rail 40. Further, the sensor surface of the radiation thermometer 1 has a required pointing width and is always fixed facing the switchboard. Therefore, the radiation thermometer 1 is capable of scanning the front surface of the switchboard 20 in the X-axis and Y-axis directions, that is, surface scanning.

FIG. 3 shows a specific mechanism for moving the radiation thermometer 1 in the X-axis and Y-axis directions. A movable box 31 has a hole penetrating the Y-axis rail 30 and is slidable in the axial direction of the Y-axis rail 30. Further, pulleys 32 and 33 are attached to both ends of the Y-axis rail 30, and a wire 34 is stretched endlessly between them. When the wire 34 is an endless wire, it is fixed to the moving box 31 at one point, and when it is a single wire, it is fixed to the moving box 31 at both ends. The motor 51 is connected to the rotating shaft of the pulley 33, and when the motor 51 is driven to rotate, the driving force is transmitted to the moving box 31 via the pulley 33 and the wire 34, and the moving box 31 is Axis rail 30
is moved in the axial direction. The moving box 31 has a motor 51
By switching the direction of rotation, it is possible to move in both directions.

One end of the X-axis rail 40 is attached and fixed to the movable box 31 at right angles, ie, in the horizontal direction, so that it can be moved integrally with the movable box 31 in the Y-axis direction. A moving box 41 has a hole penetrating the X-axis rail 40 and is slidable in the axial direction of the X-axis rail 40. Further, pulleys 42 and 43 (however, the pulley 43 is built in the moving box 31 and is not visible) are attached to both ends of the X-axis rail 40, and a wire 44 is stretched endlessly between them. . This wire 44, like the wire 34, is fixed to the moving box 41. Although not shown in the figure, the internal pulley 43 is provided inside the moving box 31.
A motor 52 connected to a rotating shaft of
3. transmitted to the moving box 41 via the wire 44;
The moving box 41 is moved in the axial direction of the X-axis rail 40. The moving box 41 can be moved in both directions by switching the rotation direction of the motor 52.

FIG. 4 shows a type in which the radiation thermometer 1 can measure temperature by moving other members, instead of the type in which the radiation thermometer 1 itself moves.

That is, in FIG. 4, the X-axis rail 40
The moving box 41, which can be moved on the axis of
A rotationally tilted mirror 45 is fixedly arranged, while Y
Another X-axis rail 46 is attached and fixed to the upper end of the axis rail 30 in parallel with the X-axis rail 40. 47 has a hole penetrating through this X-axis rail 46.
This is a movable box that can be slid in the axial direction of 6. A mirror 48 is fixedly arranged in the moving box 47 and rotated and tilted by 45 degrees on the normal axis of the XY plane to reflect the light from the lower mirror 45 and guide it horizontally in the direction of the Y-axis rail 30. The moving boxes 41 and 47 have an interlocking structure so that they have the same coordinates in the X-axis direction. For example, a drive source that is integrally connected to the movable box 41 by a mechanism not shown or that is driven synchronously with the movable box 41 may be built into or externally provided in the movable box 47. Also,
The radiation thermometer 1 is placed at a rest position on an extension of the X-axis rail 46. By adopting such a configuration, thermal radiation from each measurement point in the switchboard 20 is transmitted to the mirrors 45 and 4.
8 and is accurately guided to the radiation thermometer 1. Also,
By arranging the radiation thermometer 1 at a corner of the switchboard 20 in this manner, it is not affected by heat radiation from locations other than the measurement point, and measurement accuracy can be improved.

By the way, when the radiation thermometer 1 is of the type that moves on the X and Y axes, the cables for power supply and signal transmission to the radiation thermometer 1 are complicatedly intertwined, making it difficult to properly move the moving boxes 31 and 41. It is conceivable that this may cause the drive to be inhibited. FIGS. 5 and 6 show configurations adopted to solve this problem.

In FIG. 5, the cable 300 is connected to the Y-axis rail 3.
0, a required number of cables 400 are wound around the X-axis rail 40, and the cables 400 are made to be freely expandable and contractable in the axial direction according to the movement of each moving box 31, 41.

In FIG. 6, an electrode 401 and a contact piece 411 are placed at appropriate positions where the X-axis rail 40 and the moving box 41 make sliding contact.
A plurality of contacts are formed so as to be in contact with each other, and power supply and signal transmission are performed through this contact structure. Note that the electrode 401 is formed to extend in the axial direction.

Furthermore, FIG. 7 shows a configuration for preventing electrical noise from being mixed into the signal obtained by the radiation thermometer 1. FIG. 7 shows the configuration of FIG. 3 with other members described later added. That is, a light emitting element 49 such as an LED is provided on the rear side of the radiation thermometer 1, and the signal obtained by the radiation thermometer 1 is internally optically modulated and the light is projected directly below. There is. Further, another X-axis rail 461 is attached and fixed to the lower end of the Y-axis rail 30 in parallel with the X-axis rail 40. A moving box 471 has a hole penetrating through the X-axis rail 46 and is slidable in the axial direction of the X-axis rail 461. The moving boxes 41 and 471 are moved so that they have the same coordinates in the X-axis direction.
It has the interlocking structure described above. This moving box 47
In order to reflect the light from the light emitting element 49 directly above and guide it horizontally in the direction of the Y-axis rail 30, there is a
A mirror 481 rotated and tilted by 5 degrees is fixedly arranged. Reference numeral 50 denotes a light receiving block disposed at a stationary position on the extension of the X-axis rail 461, which receives light from the mirror 481 and demodulates the received optical signal. By adopting such a configuration, measurement accuracy can be improved without being affected by electrical noise.

FIG. 1 is a block diagram of a temperature monitoring device according to the present invention. The radiation thermometer 1 is configured to have a predetermined directivity width, and receives infrared light radiated within the above-mentioned directivity width among the infrared light radiated by the heating element, and receives the infrared light radiated within the above-mentioned directivity width, and It converts into an electrical signal and outputs it. The converted electrical signal is processed by the central processing unit (hereinafter referred to as CPU)
It is designed to be guided by 2.

[0027] This CPU 2 controls the entire device in an integrated manner, takes in signals obtained from each part, and outputs control signals to required parts.

4 is a motor drive circuit, and 5 is a motor section. The motor drive circuit 4 drives the motor 5 in response to a control signal from the CPU 2, and performs surface scanning to direct the radiation thermometer 1 to a measurement point on the X-axis and Y-axis coordinates. The motor unit 5 includes both the motors 51 and 52, and the selection and drive amount of the motor to be driven is specified by the CPU 2. 6 is an ambient temperature detector that measures the temperature outside the switchboard 20, and the measured temperature is taken into the CPU 2. Reference numeral 7 denotes a various setting key section which includes various keys shown in FIG. 9 and is used to input and set various setting data to be described later.

The storage circuit 3 stores the captured signals, the various setting data, and the results of the arithmetic processing performed by the CPU 2, and also has a program to be executed by the CPU 2 written therein in advance. The display device 8 is composed of an LCD, LED, CRT, etc., and displays a screen for setting the above-mentioned setting data and a measured temperature state as required, as shown in FIG. The alarm 9 issues a warning by means of a buzzer, lighting, or other means when an abnormal temperature is detected.

The signal converter 10 performs signal conversion so that necessary data such as measurement results can be transmitted over a telephone line.
The converted signal is transmitted to a display 11 in a remote central monitoring room and displayed.

Next, regarding the details of the various setting key section 7,
This will be explained using FIG. 9. Various setting keys 7 are DOWN.
key, UP key, MODE key, SELECT key, S
It consists of a TART/STOP key and an abnormality detection key.

The DOWN key and UP key are keys used to change numerical values, etc. When the DOWN key is pressed, the numerical value displayed on the display 8 is changed to a smaller value, as will be described later, and conversely, the UP key is pressed. When a key is pressed, the value changes in the larger direction. The MODE key is used to change the display mode, the SELECT key is used to set changed values, etc., and the START/STOP key is used to start or stop scanning by the radiation thermometer 1 in this device. This is a toggle operation key. Further, the abnormal point detection key is a key for directing the radiation thermometer 1 to the abnormal point when there is an abnormal point, and when the abnormal point detection key is pressed, the abnormal point is specifically indicated.

FIG. 10 shows the display contents of the display 9, and FIGS. 10A to 10E show each display mode.

[0034] Figure (A) shows a basic mode screen, which is displayed on the display screen of the display 8 when the power of this device is turned on. In this basic mode, the scan (surface scanning) interval is displayed, and the interval can be set to an appropriate time interval using the DOWN key and UP key. In the example shown in the figure, the setting is such that the surface scan within the measurement range by the radiation thermometer 1 is repeated every two hours.

When the MODE key is pressed in the state shown in Figure (A), the screen moves to the screen shown in Figure (B).

Figure (B) shows a setting mode in which various conditions for detecting temperature abnormalities are set, including measurement points (positions PX, PY) for temperature detection, limit temperature value T for abnormal temperature detection, The critical temperature difference ΔT with respect to the ambient temperature and the material of the heating element to be measured existing at the measurement point are D
It is set using the OWN key and UP key.

Normally, as shown in Figure (B), PX indicating the position on the
It is driven in reverse and moved until the X coordinate of the radiation thermometer 1 matches the X coordinate of the desired measurement point. In the type shown in FIG. 4, the mirrors 45 and 48 are moved by the motor 52 to direct the radiation thermometer 1 to a predetermined measurement point, but for convenience of explanation, the type in which the radiation thermometer 1 moves will be used hereinafter. explain.

Then, the radiation thermometer 1 is placed at the measurement point X.
By matching the coordinates and pressing the SELECT key, the X-axis position is determined, its value is displayed, and then the next input item, PY, flashes. The Y-axis position is set in the same way as the X-axis. The coordinates PX and PY may be displayed in specific centimeters (cm). The X and Y coordinates of the measurement point thus set are stored in the memory circuit 5.
is memorized. When the above SELECT key is pressed, the limit temperature value T flashes and the DOWN key is pressed.
The limit temperature value is changed using the key, and when the predetermined value is displayed, the limit temperature value is set by pressing the SELECT key. By pressing this SELECT key, the part of the limit temperature difference ΔT blinks and D
The limit temperature difference ΔT is changed using the OWN key and the UP key, and when a predetermined value is displayed, the limit temperature difference ΔT is set by pressing the SELECT key.

The meaning of setting the limit temperature value T and the limit temperature difference ΔT will now be described. An electronic device may be judged to be abnormal when the temperature of its components rises above a certain level, or when the temperature difference from the ambient temperature exceeds a certain value. For example, overload of electronic equipment or materials or overheating due to poor contact can be detected by detecting an abnormal temperature rise relative to the ambient temperature. On the other hand, when parts deteriorate, the temperature rise of the parts itself may become a problem rather than the difference from the ambient temperature. Therefore, it is practical to make a determination on each of the above-mentioned judgment contents, and to judge that an abnormality occurs when any one of them is abnormal. However, it is also possible to perform abnormality determination on one side.
It has significance as described above.

Finally, the material of the heating element present at the measurement point is set using the DOWN and UP keys. Various materials are displayed on the display 8, and the DOWN key, U
Change the material as appropriate by pressing the P key, and when the appropriate material is displayed, press the SELECT key.
The material is set.

[0041] Here, the meaning of setting the material will be described. In non-contact temperature measurement, it is necessary to consider the emissivity of the object to be measured. In other words, objects do not radiate 100% of their own heat generation temperature, but radiate heat with a proportion of radiant energy depending on the surface characteristics of the object, so the temperature measured with an infrared radiation thermometer is It is lower than the actual temperature of the object. Therefore, it is necessary to input the emissivity of the heating element and correct the temperature obtained by the radiation thermometer using the emissivity. Each material has its own emissivity, which is mostly known. Therefore, the emissivity of the heating element at the measurement point is input in advance.

The interior of power equipment is composed of cables, plastics, copper, aluminum, etc. In the case of indoor wiring, there are many types of electric wires, but the surface material is a vinyl resin mixture. The emissivity of each of the above is approximately 0.9 for plastic, approximately 0.3 for copper and aluminum although it varies somewhat depending on the surface condition, and approximately 0.9 for vinyl resin mixture.

In this case, the emissivity itself may be numerically inputted, or instead of this method, each material is displayed on the display surface by the above D.
It is also possible to display them cyclically by pressing the OWN key and the UP key, and select the desired one from among them by pressing the SELECT key. In the latter method, the setting operation is easy and quick, but the following configuration is required inside the device. That is, a storage means in which the material of the heating element and the emissivity are stored in advance in association with each other, and a conversion means for converting the material into the emissivity are provided.

[0044] Thereafter, by repeating the setting operations similar to those described above, the first measurement point, second measurement point,
... are set sequentially. Note that the return to the basic mode shown in Figure (A) is performed by using MOD during the scanning suspension period of the radiation thermometer 1.
This can be done by pressing the E key, which allows the scanning interval and various setting values to be changed.

Next, when the MODE key is pressed, the
) to display the measurement display mode screen. Here, the maximum value m in the past of the temperature value measured by the radiation thermometer 1 is
ax and the latest measurement value T are displayed in comparison for each measurement point. Further, at the bottom of the display screen, the number of abnormalities detected in accordance with the abnormality detection conditions set in the setting mode shown in FIG. 3(B) is displayed. The radiation thermometer 1 is scanned and the CPU 2 determines whether or not there is an abnormality in the measured values obtained at each measurement point. The X and Y coordinates are stored in the storage circuit 5. Number of abnormalities is 0
Otherwise, by pressing the abnormal point detection key, the radiation thermometer 1 can be moved to the measurement point, thereby allowing the specific abnormal point to be confirmed. When the number of abnormalities is two or more, the radiation thermometer 1 can be moved to the measurement point of the next abnormality by subsequently pressing the abnormality detection key. In addition, when the switchboard 20 has a double lid structure as shown in FIG. 8, the corresponding abnormal location can be easily confirmed from the position where the radiation thermometer 1 moves and stops.

In addition, in the type shown in FIG. 4 in which the mirrors 45 and 48 move, a light source such as an LED is placed at the location of the radiation thermometer 1, and X,
When the mirror is moved to the Y coordinate and the light source is turned on in this state, light is guided to the abnormal location in a spot-like manner through the mirrors 48 and 45, and the abnormal location is accurately indicated.

[0047] In the above, the change over time of the measurement points may be displayed graphically. Figure 10(D)
is the graph display mode screen, and in the state shown in figure (C), the DO
After selecting the measurement point to be displayed using the WN key and the UP key, the mode is shifted to by pressing the SELECT key. In Figure (D), measurement point 1 is selected. In this graph display mode, the time axis can be expanded or reduced by pressing the DOWN key or UP key. Figure (E) is a display example in which the time axis is expanded to days. In addition, when you press the SELECT key, the
It is designed to return to the measurement display mode.

Furthermore, when an abnormality is detected, the alarm 9 may be used to notify the abnormality, and/or the signal converter 10 may notify the central monitoring room of the abnormality via a telephone line or the like. It is also possible to transmit the information to the central monitoring room and display it on the display 11.

Next, the operation of this apparatus will be explained using the flowcharts shown in FIGS. 11 and 12.

First, when the power is turned on, a basic mode screen for setting the scan interval shown in FIG. 10(A) is displayed on the display 8 (#1). In this state, MODE
It is checked whether a key has been pressed (#2). M
If the ODE key is not pressed, press the UP key, DOWN
It is checked whether a key has been pressed (#3). Here, if the UP key and DOWN key are not pressed,
Return to #1. When the UP key or DOWN key is pressed, the display changes cyclically until the value to be set for the scan interval appears on the screen, and when the desired value is displayed, the operation ends (#4). Return to #1.

[0051] If the MODE key is pressed in #2,
The setting mode screen shown in Figure 10(B) is displayed (#
5). Then, in order to indicate the item to be changed in the setting screen, a specific character is blinked according to the value of the flag DSP-L in the memory circuit 5 (#6).

In this state, it is checked whether the MODE key has been pressed (#7). If the MODE key has been pressed, the process proceeds to #19; if the MODE key has not been pressed, the process proceeds to #8. At #8, it is checked whether the UP key or the DOWN key has been pressed, and if so, it is checked whether the value of the flag DSP-L is 1 or 2 (#9). If the value of the flag DSP-L is 1, the motor 52 is driven to rotate according to the operation of pressing the UP key or the DOWN key, and the radiation thermometer 1 is set to a predetermined value of X.
If the value of the flag DSP-L is 2, the motor 51 is driven to rotate according to the operation of pressing the UP key or the DOWN key, and the radiation thermometer 1 is moved to a predetermined Y-axis position. (#10). After this, return to #5.

If the value of the flag DSP-L is 3 (#1
1 (YES), the limit temperature value T is changed using the UP key and DOWN key (#12). If the value of flag DSP-L is 4 (YES in #15), UP key, DOW
The limit temperature difference ΔT is changed using the N key (#16
). If the value of the flag DSP-L is 5 (YE in #17)
S), the UP key, and the DOWN key are used to change the material, that is, the emissivity (#18). In addition, if the UP key and DOWN key are not pressed in #8, the SELE
It is checked whether the CT key has been pressed (#13
). If the SELECT key is not pressed, it is determined that the setting data for a certain item is being changed and the process returns to #5. If the SELECT key is pressed, the setting data is confirmed and the next setting item is changed. flag ds for
Change the value of PL and return to #5. By the above operations,
The process of setting and changing setting values for all items or desired items shown in FIG. 10(B) is completed.

On the other hand, when the MODE key is pressed in #7, the measurement display mode screen shown in FIG. 10(C) is displayed (#19). In this state, interrupt 1 and interrupt 2 are permitted (#20). Interrupt 1 is UP key, DO
This occurs when the WN key and the SELECT key are pressed, and interrupt 2 occurs when the abnormality detection key is pressed.

Then, it is checked whether the MODE key has been pressed (#21), and if the MODE key has been pressed, interrupts 1 and 2 are prohibited (#22), and the process returns to #1. If the MODE key is not pressed (NO in #21)
, it is checked whether the START/STOP key has been pressed (#23). Here, if the STOP key is pressed, the process returns to #21, and if the START key is pressed, it is checked whether to start surface scanning with the radiation thermometer 1 according to the set scan interval (# 2
4). If you do not want to start area scanning, return to #21 and check the status of the MODE key. If you want to start area scanning, move radiation thermometer 1 to the first position according to the X, Y coordinates set on the setting mode screen. Move to and set the measurement point (#25). Then, measure the temperature at this measurement point and further measure the ambient temperature at this time (#26
, #27). Both of the obtained measurement data are taken into the memory circuit 3, and then subjected to calculations for abnormality determination. That is, first, the temperature measured by the radiation thermometer 1 is corrected by the emissivity, and the ambient temperature is subtracted from the corrected measured temperature. Further, the set limit temperature difference ΔT is subtracted from this subtraction value to obtain a value a, and the set limit temperature value T is subtracted from the corrected measured temperature to obtain a value b. When this calculation is completed, the measured value and the subtracted value a
, b to the signal converter 10 for transmission over the telephone line (#29). Further, the CPU 2 checks whether the subtraction values a and b are positive or negative, and determines whether the temperature is abnormal (#30). That is, if either value a or b is positive, it is determined to be abnormal. The coordinates of the measurement point determined to be abnormal (in this case, the first measurement point) are stored as an abnormal location, and the number of abnormalities is incremented (#31). Then, the alarm 9 is activated (#
32). On the other hand, if the subtraction values a and b are both negative (#30
(NO), it is checked whether the measurement at the final measurement point is completed (#33). If it is not the final measurement point, return to #25 and proceed to #25 for the next measurement point (in this case, the second measurement point).
~#33 are executed. Thereafter, steps #25 to #33 are repeated until the final measurement point is reached. Then, when the measurement at the final measurement point is completed (YES in #33), the process shifts to a standby state for the scan interval (#24).

FIG. 13 shows a flowchart of interrupts,
Figure (a) shows the processing of interrupt 1, and Figure (b) shows the processing of interrupt 2.

In the measurement display mode, press the UP key, D
When the OWN key and SELECT key are pressed, the process shifts to interrupt 1. In interrupt 1, first, the characters indicating the measurement point whose number is stored in advance in the memory circuit 3 flash (
(See character "1" in FIG. 10(C)) (#34). Next, it is checked whether the UP key or DOWN key has been pressed, and if they have been pressed (YES in #35), the blinking position is increased or decreased by 1 (#36), and #3
Return to 4. Then, when the SELECT key is pressed (#
35), the screen moves to the graph display mode shown in FIG. 10(D), and the change over time of the measurement point specified in #36 is displayed (#37). In this state, when the UP key is pressed, the graph changes to a graph with an expanded time axis as shown in Figure 10 (E), and when the DOWN key is pressed, a graph with a reduced time axis is displayed. (#37, #38
loop). Next, it is checked whether the SELECT key has been pressed (#39). If the SELECT key is not pressed, return to #37; if it is pressed,
Proceeding to #40, the screen moves to the measurement display mode shown in FIG. 10(C), and the interrupt 1 processing ends.

Interruption 2 occurs in the measurement display mode as described above, and when the abnormality detection key is pressed, the number of abnormalities is first checked (#41). If the number of abnormalities is 0, interrupt 2 is immediately terminated. If the number of abnormalities is not 0, the motor unit 5 is driven according to the X and Y coordinates stored as the abnormal location, and the radiation thermometer 1 is moved to the corresponding measurement point (#
42). Then, the number of abnormalities is decremented by 1 (#43), and the process returns to #41. After this, when the number of abnormalities becomes 0 (YES in #41), interrupt 2 is ended.

In the above embodiment, the temperature inside the switchboard is monitored to check for abnormalities, but a current detector or power detector is also provided to detect the operating status of the switchboard, and these detection results are sent to the CPU 2. It is also possible to input this information to detect abnormalities. That is, an abnormality is determined when either the amount of current or the amount of electric power exceeds a preset value, or when the aforementioned temperature abnormality occurs. By doing so, it becomes possible to detect an abnormality in the power distribution board earlier.

[0060] Furthermore, although this device scans a predetermined measurement point at predetermined scan intervals as described above, abnormalities in scanning may occur due to the automatic control of surface scanning. Alternatively, there may be a case where the malfunction of the radiation thermometer 1 cannot be immediately known. For this purpose, the following configuration can also be adopted in the present invention. That is, a reference heat source is placed at a suitable location within the switchboard 20, and the radiation thermometer 1 is controlled to be moved to measure the temperature of the reference heat source, for example, during a rest period in which the radiation thermometer 1 does not perform surface scanning. Then, the obtained temperature is compared with the temperature of the reference heat source, and if the two are not equal, it is determined that there is a malfunction in the X- and Y-axis scanning system including the motor section 5, or the radiation thermometer 1 itself, and an alarm is activated. 9, or the malfunction can be notified to a remote central monitoring room or the like via a telephone line.

Alternatively, instead of using a reference heat source, a contact thermometer such as a thermocouple is placed on the heating element at a predetermined measurement point, and the heating point of the thermocouple is placed at a suitable location different from the measurement point. For example, during a rest period when the radiation thermometer 1 does not perform surface scanning, the radiation thermometer 1 is moved to the heat generating point and the radiation temperature of the heat generating point is measured. and,
The CPU 2 compares the measured temperature at the measurement point obtained during the surface scanning period with the temperature obtained from the heat generation point of the thermocouple, and if the two are different, the X and Y axis scanning system including the motor section 5 , or it is determined that the radiation thermometer 1 itself is malfunctioning. On the other hand, if there is no significant temperature difference between the two temperatures, it can be assumed that there is a deviation in the indication of the radiation thermometer 1 or a deviation in calibration, and the measured value at the measurement point can be corrected using the temperature difference as a correction amount. becomes. By adding the self-check function as described above, the reliability of the device can be improved. Note that the measurement of the reference heat source may be performed during the scanning period.

Furthermore, in this embodiment, the radiation thermometer directly measures the temperature of electronic components etc. built into the switchboard 20, but some switchboards may have a restroom located inside. In this case, by conducting a preliminary experiment to determine the relationship between the actual temperature of the electronic components and the temperature measured in the restroom with a radiation thermometer, it is possible to estimate the actual temperature inside the restroom from the temperature of the restroom. It becomes possible.

Further, in this embodiment, the value being measured is shown on the display 8, but the measured value may be read out and displayed using a read-only device.

Furthermore, in this embodiment, the radiation thermometer and mirror were scanned along the X and Y axes, but the surface scanning method is not limited to this. The same effect can be obtained with a fixed type in which the radiation thermometer is placed opposite the measurement point. Furthermore, the present device is not limited to power distribution panels, but can also be applied to power panels for large computers and the like.

[0065]

[Effects of the Invention] As explained above, according to the present invention,
The radiation thermometer scans the area within the measurement range, and the measured temperature obtained by the area scan is compared with the limit temperature to determine temperature abnormalities, so temperature abnormalities can be detected automatically and relatively easily. It can be detected by the configuration.

Further, in the invention according to claim 2, the measured temperature at the measurement point and the limit temperature are compared, and the temperature difference between the measured temperature at the measurement point and the external temperature and the limit temperature difference are compared, Since temperature abnormality is determined from both comparison results, temperature abnormality can be detected automatically and reliably with a relatively simple configuration.

[0067]Furthermore, the measurement point where the temperature is judged to be abnormal is memorized, and the scanning means is operated to measure the measurement point according to an instruction from the instruction means, so that the abnormal location can be specifically confirmed. This makes it possible to take quicker measures against abnormalities.

Furthermore, since the emissivity can be set using the material instead of the emissivity, there is no need to remember the emissivity of each material one by one, and the setting work can be performed accurately and quickly.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a temperature monitoring device according to the present invention.

FIG. 2 is a diagram showing a temperature monitoring device according to the present invention installed inside a switchboard.

FIG. 3 is a diagram showing a specific mechanism for moving the radiation thermometer in the X-axis and Y-axis directions.

FIG. 4 is a diagram illustrating a type of mechanism in which the radiation thermometer can measure temperature by moving other members, instead of the type in which the radiation thermometer itself moves.

FIG. 5 is a diagram illustrating a configuration adopted to eliminate cable entanglement.

FIG. 6 is a diagram illustrating a configuration adopted to eliminate cable entanglement.

FIG. 7 is a diagram showing a configuration for preventing electrical noise from being mixed into a signal obtained by a radiation thermometer.

FIG. 8 is an external perspective view of a power distribution board having a double lid structure.

9 is a diagram showing details of various setting key sections 7. FIG.

FIG. 10 is a diagram showing the display contents of the display 9, and FIGS.
Figure (E) shows the screen in each display mode.

FIG. 11 is a flowchart showing the operation of the temperature monitoring device.

FIG. 12 is a flowchart showing the operation of the temperature monitoring device.

FIG. 13 is a flowchart showing processing of interrupts 1 and 2.

[Explanation of symbols]

Claims (4)

[Claims] 1. A radiation thermometer for remotely measuring the temperature of a heating element; scanning means for using the radiation thermometer to scan a measurement range; coordinates indicating each measurement point within the measurement range; a setting means for setting the limit temperature and emissivity at the coordinates; a setting data storage means for storing the setting data set by the setting means; and a setting means for correcting the temperature measured by the radiation thermometer with the emissivity to generate heat. The temperature is characterized by comprising a correction means for determining body temperature, a comparison means for comparing the temperature of the heating element and the above-mentioned limit temperature, and a determination means for determining the presence or absence of an abnormality from the comparison result by the comparison means. Monitoring equipment. 2. A radiation thermometer for remotely measuring the temperature of a heating element, a scanning means for causing the radiation thermometer to scan a surface within a measurement range, a thermometer for detecting external temperature, and a thermometer for detecting an external temperature; a setting means for setting coordinates indicating each measurement point within, a limit temperature, a limit temperature difference, and an emissivity at the coordinates;
a setting data storage means for storing setting data set by the setting means; a correction means for correcting the temperature measured by the radiation thermometer using the emissivity to obtain a heating element temperature; a first comparing means for comparing the temperature of the heating element and an external temperature detected by the thermometer, a second comparing means for comparing the temperature difference between the heating element temperature and the external temperature detected by the thermometer, and the first comparing means for comparing the temperature difference between the heating element temperature and the external temperature detected by the thermometer; A temperature monitoring device characterized by comprising: a determining means for determining the presence or absence of an abnormality from the comparison result by the second comparing means. 3. The temperature monitoring device according to claim 1, further comprising: a position storage means for storing the measurement point determined to be abnormal by the discrimination means; an instruction means; scanning control means for operating the scanning means to measure measurement points stored in the temperature monitoring apparatus. 4. The temperature monitoring device according to claim 1, further comprising a storage means for storing the material of the heating element and the emissivity in association with each other, and a conversion means for converting the material into the emissivity. A temperature monitoring device characterized in that the means can be set by a material instead of emissivity.