WO2020090359A1 - Panel temperature detecting device and method for detecting temperature of detection region of panel - Google Patents

Panel temperature detecting device and method for detecting temperature of detection region of panel Download PDF

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Publication number
WO2020090359A1
WO2020090359A1 PCT/JP2019/039478 JP2019039478W WO2020090359A1 WO 2020090359 A1 WO2020090359 A1 WO 2020090359A1 JP 2019039478 W JP2019039478 W JP 2019039478W WO 2020090359 A1 WO2020090359 A1 WO 2020090359A1
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temperature
detection
temperature sensor
light irradiation
detecting
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PCT/JP2019/039478
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French (fr)
Japanese (ja)
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伊彦 小川
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オムロン株式会社
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02BBOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B3/00Apparatus specially adapted for the manufacture, assembly, or maintenance of boards or switchgear

Definitions

  • the present disclosure relates to a panel temperature detection device and a method for detecting the temperature of a detection region provided in a panel device.
  • Patent Document 1 discloses a switchboard provided with a board housing and a storage device housed inside the board housing.
  • the temperature sensor is positioned by a camera capable of photographing the inside of the switchboard, and It is conceivable to monitor the temperature of a predetermined area of the.
  • the camera is usually expensive, which may increase the manufacturing cost.
  • An example of the board temperature detection device of the present disclosure is A housing having an opening, a lid capable of opening and closing the opening, and a device provided inside the housing of a detection area provided on a surface of the device facing the lid of the device.
  • a board temperature detecting device for detecting a temperature A temperature sensor capable of detecting the temperature of the detection region, A light irradiation device capable of irradiating the opposite surface with light, In a state in which one of the temperature sensor and the light irradiation device is held, a position determining member that is movably attached to the lid along the extending direction of the facing surface, The temperature sensor is held by the position determining member arranged at a detection position where the irradiation area of the light emitted from the light irradiation device to the facing surface and the detection area overlap, and the temperature of the detection area is detected.
  • a housing having an opening, a lid capable of opening and closing the opening, and a device provided inside the housing of a detection area provided on a surface of the device facing the lid of the device.
  • a method of detecting temperature The position determining member movably attached to the lid along the extending direction of the facing surface holds a light irradiation device capable of irradiating the facing surface with light, The position determining member is moved and fixed to a detection position where the irradiation region of the light irradiated to the facing surface from the light irradiation device and the detection region overlap, While removing the light irradiating device from the position determining member, a temperature sensor capable of detecting the temperature of the detection region is held by the position determining member, The temperature of the detection area is detected by the temperature sensor.
  • the temperature sensor capable of detecting the temperature of the detection region
  • the light irradiation device capable of irradiating the device with light
  • the movable state while holding either the temperature sensor or the light irradiation device And a position determining member attached to the.
  • the position determining member movably attached to the lid holds the light irradiation device, and the detection region in which the light irradiation region of the light emitted from the light irradiation device overlaps the detection region is detected.
  • the position determining member is moved and fixed to the position, the light irradiation device is removed from the position determining member, the temperature sensor is held by the position determining member, and the temperature of the detection region is detected by the temperature sensor.
  • the front view of the board which shows the example of application of the board temperature detecting device of one embodiment of this indication.
  • Sectional drawing which followed the II-II line of FIG.
  • 6 is a flowchart for explaining a method of detecting the temperature of a detection region using the board temperature detection device according to the embodiment of the present disclosure.
  • the 1st sectional view for explaining the detecting method of the temperature of the detection field which uses the board temperature detecting device of one embodiment of this indication.
  • the 2nd sectional view for explaining the detecting method of the temperature of the detection field which uses the board temperature detecting device of one embodiment of this indication.
  • the board temperature detection device 10 can be applied to the board 1 shown in FIG. 1, for example.
  • the board 1 includes a housing 2 having an opening 5, a lid 3 capable of opening and closing the opening 5, and a device 4 arranged inside the housing 2.
  • the lid 3 is omitted in FIG. 1.
  • the housing 2 has, for example, a substantially rectangular parallelepiped shape, and the opening 5 has a substantially rectangular shape. As shown in FIG. 2, a gap 6 is formed between the device 4 and the lid 3 housed inside the housing 2. A board temperature detecting device 10 is arranged in the gap 6.
  • the housing 2 and the lid 3 are made of a magnetic material, for example.
  • the board temperature detection device 10 can hold a temperature sensor 11, a light irradiation device 12 (shown in FIGS. 6 and 7), or one of the temperature sensor 11 and the light irradiation device 12.
  • the position determining member 20 is provided.
  • the temperature sensor 11 is, for example, a thermal image sensor, and is arranged to be able to detect the temperature of the detection region 30 provided on the facing surface 7 facing the lid 3 of the device 4, as shown in FIG.
  • the detection area 30 is, for example, a substantially circular area on the facing surface 7 that is predetermined according to the design of the device 4 or the like, and includes an area on the facing surface 7 where the temperature is desired to be detected (for example, the temperature is detected).
  • the size is set to be approximately the same as the area on the facing surface 7 that is desired.
  • the number of the detection areas 30 is not limited to one, and a plurality of detection areas may be provided.
  • the light irradiator 12 has a light emitting element (not shown) such as an LED capable of irradiating visible light, and is arranged so as to irradiate light on the facing surface 7 of the device 4, as shown in FIGS. 6 and 7. ing.
  • the light emitted from the light irradiation device 12 to the facing surface 7 forms an irradiation area 50 (see FIGS. 6 and 7).
  • the irradiation area 50 has, for example, a substantially circular shape having substantially the same size as the detection area 30.
  • each of the temperature sensor 11 and the light irradiation device 12 is provided with an engaging portion 40 capable of engaging with a pair of rail portions 221 and 222 of the position determining member 20 described later. ..
  • four engaging portions 40 are respectively arranged at four corners on one surface of the substantially rectangular parallelepiped housings 111 and 121 in each of the temperature sensor 11 and the light irradiation device 12.
  • Each of the engaging portions 40 has a substantially L-shape when viewed from the thickness direction of the housings 111 and 121 (that is, the paper penetration direction of FIG. 3), and has a temperature that is engaged with the pair of rail portions 221 and 222.
  • Each of the sensor 11 and the light irradiation device 12 is configured to be locked in the thickness direction of the housings 111 and 121.
  • the position determining member 20 is movable along the extending direction of the facing surface 7 with respect to the lid body 3, while holding either one of the temperature sensor 11 and the light irradiation device 12. It is installed.
  • the position determining member 20 holds a fixing portion 21 that is detachably fixed to the lid body 3 and a holding portion that detachably holds one of the light irradiation device 12 and the temperature sensor 11. It has a portion 22 and a connecting portion 23 that is connected to the fixed portion 21 and the holding portion 22 and is capable of moving the holding portion 22 along the facing surface 7.
  • the fixed portion 21 has, for example, a substantially rectangular plate shape, and a permanent magnet (not shown) is provided inside thereof. That is, the fixed portion 21 is fixed to the magnetic lid 3 via the permanent magnet.
  • the holding portion 22 has a pair of rail portions 221 and 222 extending in parallel.
  • the pair of rail portions 221 and 222 are configured such that either the temperature sensor 11 or the light irradiation device 12 is engaged with the engagement portion 40 to hold either the temperature sensor 11 or the light irradiation device 12. Has been done.
  • the connecting portion 23 is, for example, in a substantially columnar shape, and both ends in the extending direction are connected to the fixing portion 21 and the holding portion 22 via ball joints. With this connecting portion 23, the holding portion 22 can be moved without moving the entire position determining member 20 within a certain range.
  • the position determining member 20 holds the light irradiation device 12, and the light irradiation device 12 irradiates the opposing surface 7 of the device 4 with light to form an irradiation region 50 (see FIG. 6). Then, (step S1), it is determined whether or not the formed irradiation area 50 and the detection area 30 overlap (step S2). Whether or not the irradiation area 50 and the detection area 30 overlap with each other can be determined by, for example, visually confirming that the irradiation area 50 and the detection area 30 substantially overlap with each other. Overlap. ”
  • the light irradiation device 12 is moved by moving the entire position determining member 20 or only the holding unit 22 (step S3), and the irradiation region 50 Steps S2 and S3 are repeated until it is determined that the detection area 30 overlaps.
  • the movement of the position determining member 20 is manually performed by the user, for example.
  • Step S4 When it is determined that the irradiation area 50 and the detection area 30 overlap, the position determining member 20 is fixed to the detection position P (see FIG. 7) where it is determined that the irradiation area 50 and the detection area 30 overlap.
  • Step S4 the light irradiation device 12 is removed from the position determining member 20, and the temperature sensor 11 is held by the position determining member 20 (step S5). As a result, the temperature sensor 11 detects the temperature of the detection area 30 (step S6). Note that steps S4 and S6 are manually performed by the user, for example.
  • the temperature sensor 11 capable of detecting the temperature of the detection region 30, the light irradiation device 12 capable of irradiating the device 4 with light, and the temperature sensor 11 and the light irradiation device 12 are provided.
  • the position determining member 20 is movably attached while holding one of them. With such a configuration, it is possible to realize the board temperature detection device 10 that can detect the temperature of the detection region 30 without using an expensive device such as a camera.
  • the board temperature detection device 10 it is possible to detect the temperature of the detection region 30 provided in the device 4 of the board 1 without using an expensive device such as a camera. That is, it is possible to realize a method capable of detecting the temperature of the detection region 30 provided in the device 4 of the panel 1 while suppressing the manufacturing cost.
  • the position determining member 20 includes a fixing portion 21 that is detachably fixed to the lid body 3, a holding portion 22 that detachably holds one of the light irradiation device 12 and the temperature sensor 11, and the fixing portion 21 and It has a connecting portion 23 that is connected to the holding portion 22 and that can move the holding portion 22 along the facing surface 7 of the device 4.
  • the holding portion 22 has a pair of rail portions 221 and 222 extending in parallel, and each of the light irradiation device 12 and the temperature sensor 11 has an engaging portion 40 that can be engaged with the pair of rail portions 221 and 222.
  • each of the temperature sensor 11 and the light irradiation device 12 can be easily held by the position determining member 20 with a simple configuration.
  • the position determining member 20 is movably attached to the lid 3 along the extending direction of the facing surface 7 of the device 4 while holding either the temperature sensor 11 or the light irradiation device 12.
  • it is not limited to the above embodiment.
  • the fixing portion 21 may be fixed to the lid body 3 by using a reusable adhesive or a double-sided tape.
  • the holding unit 22 may be configured to hold either one of the temperature sensor 11 and the light irradiation device 12 by using a magnet or a platform.
  • the connecting portion 23 may be configured to connect the holding portion 22 to the fixed portion 21 immovably.
  • the board temperature detection device 10 includes a position shift detection sensor that detects a position shift of the temperature sensor 11 with respect to the detection position P, and a display unit that displays that the position shift of the temperature sensor 11 with respect to the detection position P is detected.
  • the display device may further include a positional deviation display device having the same. With such a configuration, the temperature of the detection region 30 can be detected more accurately.
  • the board temperature detection device 10 is Opposed to the lid 3 of the device 4 of the board 1 including the casing 2 having the opening 5, the lid 3 capable of opening and closing the opening 5, and the device 4 arranged inside the casing 2.
  • a temperature sensor 11 capable of detecting the temperature of the detection region 30,
  • a light irradiation device 12 capable of irradiating the facing surface 7 with light;
  • a position determining member 20 movably attached to the lid body 3 along the extending direction of the facing surface 7 while holding either one of the temperature sensor 11 and the light irradiation device 12.
  • the temperature sensor 11 is held by the position determining member 20 arranged at the detection position P where the irradiation area 50 of the light emitted from the light irradiation device 12 to the facing surface 7 and the detection area 30 overlap, and the detection is performed. The temperature of the area 30 is detected.
  • the board temperature detecting device 10 of the first aspect it is possible to realize the board temperature detecting device 10 capable of detecting the temperature of the detection region 30 without using an expensive device such as a camera.
  • the board temperature detection device 10 is The position determining member 20 is A fixing portion 21 that is detachably fixed to the lid body 3, a holding portion 22 that detachably holds any one of the light irradiation device 12 and the temperature sensor 11, and the fixing portion 21 and the holding portion 22. And a connecting portion 23 that is connected to the holding portion 22 and is movable along the extending direction of the facing surface 7.
  • the irradiation area 50 can be overlapped with the detection area 30 without moving the entire position determining member 20.
  • the position determining member 20 can be easily moved to the detection position P.
  • the board temperature detection device 10 is The holding portion 22 has a pair of rail portions 221, 222 extending in parallel, Each of the light irradiation device 12 and the temperature sensor 11 has an engaging portion 40 engageable with the pair of rail portions 221 and 222, Each of the light irradiation device 12 and the temperature sensor 11 is held by the holding portion 22 by the engagement portion 40 engaging with the pair of rail portions 221, 222.
  • each of the temperature sensor 11 and the light irradiation device 12 can be easily held by the position determining member 20 with a simple configuration.
  • the board temperature detection device 10 is A displacement display device having a displacement detection sensor that detects a displacement of the temperature sensor 11 with respect to the detection position P, and a display unit that displays that the displacement of the temperature sensor 11 with respect to the detection position P is detected. Is further provided.
  • the temperature of the detection region 30 can be detected more accurately.
  • the method of the fifth aspect of the present disclosure is Opposed to the lid 3 of the device 4 of the board 1 including the casing 2 having the opening 5, the lid 3 capable of opening and closing the opening 5, and the device 4 arranged inside the casing 2.
  • a method for detecting the temperature of the detection area 30 provided on the facing surface 7, The position determining member 20 movably attached to the lid body 3 along the extending direction of the facing surface 7 holds the light irradiating device 12 capable of irradiating the facing surface 7 with light.
  • the position determining member 20 is moved and fixed to a detection position P where the irradiation region 50 of the light emitted from the light irradiation device 12 to the facing surface 7 and the detection region 30 overlap, While removing the light irradiation device 12 from the position determining member 20, the position determining member 20 holds a temperature sensor 11 capable of detecting the temperature of the detection region 30, The temperature of the detection area 30 is detected by the temperature sensor 11.
  • the method of the fifth aspect it is possible to detect the temperature of the detection region 30 provided in the device 4 of the panel 1 without using an expensive device such as a camera. That is, it is possible to realize a method capable of detecting the temperature of the detection region 30 provided in the device 4 of the panel 1 while suppressing the manufacturing cost.
  • the panel temperature detection device of the present disclosure can be applied to, for example, a switchboard.
  • the method of the present disclosure can be applied to, for example, temperature detection of a switchboard.

Abstract

This panel temperature detecting device is provided with: a temperature sensor capable of detecting the temperature of a detection region; a light irradiation device capable of irradiating an apparatus with light; and a positioning member movably attached while holding either the temperature sensor or the light irradiation device. The temperature of the detection region is detected by holding the temperature sensor on the positioning member arranged at the detection position at which the region irradiated with light emitted to the apparatus from the light irradiation device and the detection region overlap.

Description

盤温度検出装置および盤の検出領域の温度を検出する方法Board temperature detection device and method for detecting temperature in detection area of board
 本開示は、盤温度検出装置、および、盤の機器に設けられた検出領域の温度を検出する方法に関する。 The present disclosure relates to a panel temperature detection device and a method for detecting the temperature of a detection region provided in a panel device.
 特許文献1には、盤筺体と、盤筺体の内部に収納された収納機器とを備える配電盤が開示されている。 [Patent Document 1] discloses a switchboard provided with a board housing and a storage device housed inside the board housing.
特開2016-093028号公報JP, 2016-093028, A
 ところで、収納機器の一部の領域の温度を検出可能な温度センサを用いて前記配電盤内の収納機器の温度を監視する場合、配電盤の内部を撮影可能なカメラにより温度センサを位置決めして、配電盤の所定の領域の温度を監視することが考えられる。しかし、通常、カメラは高価であるため、製造コストの増加を招くおそれがある。 By the way, when the temperature of the storage device in the switchboard is monitored using a temperature sensor capable of detecting the temperature of a part of the storage device, the temperature sensor is positioned by a camera capable of photographing the inside of the switchboard, and It is conceivable to monitor the temperature of a predetermined area of the. However, the camera is usually expensive, which may increase the manufacturing cost.
 本開示は、製造コストを抑制可能な盤温度検出装置、および、製造コストを抑制しつつ盤の機器に設けられた検出領域の温度を検出可能な方法を提供することを課題とする。 It is an object of the present disclosure to provide a panel temperature detection device capable of suppressing manufacturing costs, and a method capable of detecting the temperature of a detection region provided in a panel device while suppressing manufacturing costs.
 本開示の一例の盤温度検出装置は、
 開口部を有する筺体と、前記開口部を開閉可能な蓋体と、前記筺体の内部に配置された機器とを備える盤の前記機器の前記蓋体に対向する対向面に設けられた検出領域の温度を検出する盤温度検出装置であって、
 前記検出領域の温度を検出可能な温度センサと、
 前記対向面に光を照射可能な光照射装置と、
 前記温度センサおよび前記光照射装置のいずれか一方を保持した状態で、前記蓋体に対して前記対向面の延在方向に沿って移動可能に取り付けられた位置決定部材と
を備え、
 前記光照射装置から前記対向面に照射された光の照射領域と前記検出領域とが重なる検出位置に配置した前記位置決定部材に前記温度センサを保持させて、前記検出領域の温度を検出する。
An example of the board temperature detection device of the present disclosure is
A housing having an opening, a lid capable of opening and closing the opening, and a device provided inside the housing of a detection area provided on a surface of the device facing the lid of the device. A board temperature detecting device for detecting a temperature,
A temperature sensor capable of detecting the temperature of the detection region,
A light irradiation device capable of irradiating the opposite surface with light,
In a state in which one of the temperature sensor and the light irradiation device is held, a position determining member that is movably attached to the lid along the extending direction of the facing surface,
The temperature sensor is held by the position determining member arranged at a detection position where the irradiation area of the light emitted from the light irradiation device to the facing surface and the detection area overlap, and the temperature of the detection area is detected.
 また、本開示の一例の方法は、
 開口部を有する筺体と、前記開口部を開閉可能な蓋体と、前記筺体の内部に配置された機器とを備える盤の前記機器の前記蓋体に対向する対向面に設けられた検出領域の温度を検出する方法であって、
 前記蓋体に対して前記対向面の延在方向に沿って移動可能に取り付けられた位置決定部材に、前記対向面に光を照射可能な光照射装置を保持させ、
 前記光照射装置から前記対向面に照射された光の照射領域と前記検出領域とが重なる検出位置に、前記位置決定部材を移動させて固定し、
 前記位置決定部材から前記光照射装置を取り外すと共に、前記検出領域の温度を検出可能な温度センサを前記位置決定部材に保持させて、
 前記温度センサで前記検出領域の温度を検出する。
In addition, an example method of the present disclosure,
A housing having an opening, a lid capable of opening and closing the opening, and a device provided inside the housing of a detection area provided on a surface of the device facing the lid of the device. A method of detecting temperature,
The position determining member movably attached to the lid along the extending direction of the facing surface holds a light irradiation device capable of irradiating the facing surface with light,
The position determining member is moved and fixed to a detection position where the irradiation region of the light irradiated to the facing surface from the light irradiation device and the detection region overlap,
While removing the light irradiating device from the position determining member, a temperature sensor capable of detecting the temperature of the detection region is held by the position determining member,
The temperature of the detection area is detected by the temperature sensor.
 前記盤温度検出装置によれば、検出領域の温度を検出可能な温度センサと、機器に光を照射可能な光照射装置と、温度センサおよび光照射装置のいずれか一方を保持した状態で移動可能に取り付けられた位置決定部材とを備えている。このような構成により、カメラなどの高価な機器を用いることなく、検出領域の温度を検出することが可能な盤温度検出装置を実現できる。 According to the board temperature detection device, the temperature sensor capable of detecting the temperature of the detection region, the light irradiation device capable of irradiating the device with light, and the movable state while holding either the temperature sensor or the light irradiation device And a position determining member attached to the. With such a configuration, it is possible to realize a board temperature detection device capable of detecting the temperature of the detection area without using an expensive device such as a camera.
 また、前記方法によれば、蓋体に対して移動可能に取り付けられた位置決定部材に光照射装置を保持させ、光照射装置から機器に照射された光の照射領域と検出領域とが重なる検出位置に位置決定部材を移動させて固定し、位置決定部材から光照射装置を取り外すと共に温度センサを位置決定部材に保持させて、温度センサで検出領域の温度を検出する。このような構成により、カメラなどの高価な機器を用いることなく盤の機器に設けられた検出領域の温度を検出することができる。すなわち、製造コストを抑制しつつ、盤の機器に設けられた検出領域の温度を検出可能な方法を実現できる。 Further, according to the method, the position determining member movably attached to the lid holds the light irradiation device, and the detection region in which the light irradiation region of the light emitted from the light irradiation device overlaps the detection region is detected. The position determining member is moved and fixed to the position, the light irradiation device is removed from the position determining member, the temperature sensor is held by the position determining member, and the temperature of the detection region is detected by the temperature sensor. With such a configuration, it is possible to detect the temperature of the detection region provided in the device of the board without using an expensive device such as a camera. That is, it is possible to realize a method capable of detecting the temperature of the detection region provided in the equipment of the panel while suppressing the manufacturing cost.
本開示の一実施形態の盤温度検出装置の適用例を示す盤の正面図。The front view of the board which shows the example of application of the board temperature detecting device of one embodiment of this indication. 図1のII-II線に沿った断面図。Sectional drawing which followed the II-II line of FIG. 本開示の一実施形態の盤温度検出装置の温度センサおよび光照射装置の平面図。The top view of the temperature sensor and light irradiation device of the board temperature detection device of one embodiment of this indication. 本開示の一実施形態の盤温度検出装置の位置決定部材を示す斜視図。The perspective view showing the position deciding member of the board temperature detecting device of one embodiment of this indication. 本開示の一実施形態の盤温度検出装置を用いた検出領域の温度の検出方法を説明するためのフローチャート。6 is a flowchart for explaining a method of detecting the temperature of a detection region using the board temperature detection device according to the embodiment of the present disclosure. 本開示の一実施形態の盤温度検出装置を用いた検出領域の温度の検出方法を説明するための第1の断面図。The 1st sectional view for explaining the detecting method of the temperature of the detection field which uses the board temperature detecting device of one embodiment of this indication. 本開示の一実施形態の盤温度検出装置を用いた検出領域の温度の検出方法を説明するための第2の断面図。The 2nd sectional view for explaining the detecting method of the temperature of the detection field which uses the board temperature detecting device of one embodiment of this indication.
 以下、本開示の一例を添付図面に従って説明する。なお、以下の説明では、必要に応じて特定の方向あるいは位置を示す用語(例えば、「上」、「下」、「右」、「左」を含む用語)を用いるが、それらの用語の使用は図面を参照した本開示の理解を容易にするためであって、それらの用語の意味によって本開示の技術的範囲が限定されるものではない。また、以下の説明は、本質的に例示に過ぎず、本開示、その適用物、あるいは、その用途を制限することを意図するものではない。さらに、図面は模式的なものであり、各寸法の比率等は現実のものとは必ずしも合致していない。 Hereinafter, an example of the present disclosure will be described with reference to the accompanying drawings. In the following description, terms indicating a specific direction or position (for example, terms including “upper”, “lower”, “right”, and “left”) are used as necessary, but use of those terms Is for facilitating the understanding of the present disclosure with reference to the drawings, and the technical scope of the present disclosure is not limited by the meanings of the terms. In addition, the following description is merely exemplary in nature and is not intended to limit the present disclosure, the application thereof, or the application thereof. Furthermore, the drawings are schematic, and the ratios of the respective dimensions and the like do not always match the actual ones.
 本開示の一実施形態の盤温度検出装置10は、例えば、図1に示す盤1に適用できる。この盤1は、図2に示すように、開口部5を有する筺体2と、開口部5を開閉可能な蓋体3と、筺体2の内部に配置された機器4とを備える。なお、図1では、蓋体3を省略している。 The board temperature detection device 10 according to an embodiment of the present disclosure can be applied to the board 1 shown in FIG. 1, for example. As shown in FIG. 2, the board 1 includes a housing 2 having an opening 5, a lid 3 capable of opening and closing the opening 5, and a device 4 arranged inside the housing 2. The lid 3 is omitted in FIG. 1.
 筺体2は、一例として、略直方体状を有し、開口部5は、略矩形状を有している。図2に示すように、筺体2の内部に収容されている機器4と蓋体3との間には、隙間6が形成されている。この隙間6に、盤温度検出装置10が配置されている。また、筺体2および蓋体3は、一例として、磁性体で構成されている。 The housing 2 has, for example, a substantially rectangular parallelepiped shape, and the opening 5 has a substantially rectangular shape. As shown in FIG. 2, a gap 6 is formed between the device 4 and the lid 3 housed inside the housing 2. A board temperature detecting device 10 is arranged in the gap 6. The housing 2 and the lid 3 are made of a magnetic material, for example.
 盤温度検出装置10は、図2に示すように、温度センサ11と、光照射装置12(図6および図7に示す)と、温度センサ11および光照射装置12のいずれか一方を保持可能な位置決定部材20とを備えている。 As shown in FIG. 2, the board temperature detection device 10 can hold a temperature sensor 11, a light irradiation device 12 (shown in FIGS. 6 and 7), or one of the temperature sensor 11 and the light irradiation device 12. The position determining member 20 is provided.
 温度センサ11は、例えば、熱画像センサであり、図2に示すように、機器4の蓋体3に対向する対向面7に設けられた検出領域30の温度を検出可能に配置されている。検出領域30は、例えば、機器4の設計などにより予め定められた対向面7上の略円形状の領域であり、温度を検出したい対向面7上の領域を含むように(例えば、温度を検出したい対向面7上の領域と略同等の大きさに)設定される。この検出領域30は、1つに限らず、複数設けることもできる。 The temperature sensor 11 is, for example, a thermal image sensor, and is arranged to be able to detect the temperature of the detection region 30 provided on the facing surface 7 facing the lid 3 of the device 4, as shown in FIG. The detection area 30 is, for example, a substantially circular area on the facing surface 7 that is predetermined according to the design of the device 4 or the like, and includes an area on the facing surface 7 where the temperature is desired to be detected (for example, the temperature is detected). The size is set to be approximately the same as the area on the facing surface 7 that is desired. The number of the detection areas 30 is not limited to one, and a plurality of detection areas may be provided.
 光照射装置12は、LEDなどの可視光を照射可能な発光素子(図示せず)を有し、図6および図7に示すように、機器4の対向面7に光を照射可能に配置されている。光照射装置12から対向面7に照射された光は、照射領域50を形成する(図6および図7参照)。この照射領域50は、例えば、検出領域30と略同等の大きさの略円形状を有している。 The light irradiator 12 has a light emitting element (not shown) such as an LED capable of irradiating visible light, and is arranged so as to irradiate light on the facing surface 7 of the device 4, as shown in FIGS. 6 and 7. ing. The light emitted from the light irradiation device 12 to the facing surface 7 forms an irradiation area 50 (see FIGS. 6 and 7). The irradiation area 50 has, for example, a substantially circular shape having substantially the same size as the detection area 30.
 また、温度センサ11および光照射装置12の各々には、図3に示すように、後述する位置決定部材20の一対のレール部221、222に係合可能な係合部40が設けられている。この実施形態では、温度センサ11および光照射装置12の各々における略直方体状のハウジング111、121の一面における4つの角部に、4つの係合部40がそれぞれ配置されている。 Further, as shown in FIG. 3, each of the temperature sensor 11 and the light irradiation device 12 is provided with an engaging portion 40 capable of engaging with a pair of rail portions 221 and 222 of the position determining member 20 described later. .. In this embodiment, four engaging portions 40 are respectively arranged at four corners on one surface of the substantially rectangular parallelepiped housings 111 and 121 in each of the temperature sensor 11 and the light irradiation device 12.
 各係合部40は、ハウジング111、121の厚さ方向(すなわち、図3の紙面貫通方向)から見て、略L字状を有し、一対のレール部221、222に係合された温度センサ11および光照射装置12の各々が、ハウジング111、121の厚さ方向において係止されるように構成されている。 Each of the engaging portions 40 has a substantially L-shape when viewed from the thickness direction of the housings 111 and 121 (that is, the paper penetration direction of FIG. 3), and has a temperature that is engaged with the pair of rail portions 221 and 222. Each of the sensor 11 and the light irradiation device 12 is configured to be locked in the thickness direction of the housings 111 and 121.
 位置決定部材20は、図2に示すように、温度センサ11および光照射装置12のいずれか一方を保持した状態で、蓋体3に対して対向面7の延在方向に沿って移動可能に取り付けられている。 As shown in FIG. 2, the position determining member 20 is movable along the extending direction of the facing surface 7 with respect to the lid body 3, while holding either one of the temperature sensor 11 and the light irradiation device 12. It is installed.
 詳しくは、位置決定部材20は、図4に示すように、蓋体3に取り外し可能に固定される固定部21と、光照射装置12および温度センサ11のいずれか一方を取り外し可能に保持する保持部22と、固定部21および保持部22に接続されて保持部22を対向面7に沿って移動可能な接続部23とを有している。 Specifically, as shown in FIG. 4, the position determining member 20 holds a fixing portion 21 that is detachably fixed to the lid body 3 and a holding portion that detachably holds one of the light irradiation device 12 and the temperature sensor 11. It has a portion 22 and a connecting portion 23 that is connected to the fixed portion 21 and the holding portion 22 and is capable of moving the holding portion 22 along the facing surface 7.
 固定部21は、一例として、略矩形の板状を有し、その内部に永久磁石(図示せず)が設けられている。すなわち、固定部21は、永久磁石を介して磁性体の蓋体3に固定される。 The fixed portion 21 has, for example, a substantially rectangular plate shape, and a permanent magnet (not shown) is provided inside thereof. That is, the fixed portion 21 is fixed to the magnetic lid 3 via the permanent magnet.
 保持部22は、並列に延びる一対のレール部221、222を有している。この一対のレール部221、222は、温度センサ11および光照射装置12のいずれか一方の係合部40が係合されて、温度センサ11および光照射装置12のいずれか一方を保持可能に構成されている。 The holding portion 22 has a pair of rail portions 221 and 222 extending in parallel. The pair of rail portions 221 and 222 are configured such that either the temperature sensor 11 or the light irradiation device 12 is engaged with the engagement portion 40 to hold either the temperature sensor 11 or the light irradiation device 12. Has been done.
 なお、相互に直交する2つの方向(図3の矢印A方向および矢印B方向)のいずれか一方から、一対のレール部221、222を係合部40に対してスライド移動させることで、各係合部40を一対のレール部221、222に係合させ、また、各係合部40の一対のレール部221に対する係合を解除させることができる。 In addition, by sliding the pair of rail portions 221 and 222 with respect to the engaging portion 40 from one of two directions (arrow A direction and arrow B direction in FIG. 3) mutually orthogonal to each other, The joining portion 40 can be engaged with the pair of rail portions 221, 222, and the engagement of each engaging portion 40 with the pair of rail portions 221 can be released.
 接続部23は、一例として、略円柱状で、その延在方向の両端部の各々が、ボールジョイントを介して固定部21および保持部22に接続されている。この接続部23により、ある程度の範囲であれば、位置決定部材20全体を移動させることなく保持部22を移動させることができる。 The connecting portion 23 is, for example, in a substantially columnar shape, and both ends in the extending direction are connected to the fixing portion 21 and the holding portion 22 via ball joints. With this connecting portion 23, the holding portion 22 can be moved without moving the entire position determining member 20 within a certain range.
 次に、盤温度検出装置10を用いた検出領域30の温度の検出方法について、図5~図7を参照して説明する。 Next, a method of detecting the temperature of the detection area 30 using the panel temperature detection device 10 will be described with reference to FIGS. 5 to 7.
 図5に示すように、まず、位置決定部材20に光照射装置12を保持させて、光照射装置12から機器4の対向面7に光を照射して照射領域50(図6参照)を形成し(ステップS1)、形成された照射領域50と検出領域30とが重なっているか否かを判定する(ステップS2)。照射領域50と検出領域30とが重なっているか否かは、例えば、ユーザの目視により、照射領域50と検出領域30とが概ね重なっていることが確認できれば、「照射領域50と検出領域30とが重なっている」と判定する。 As shown in FIG. 5, first, the position determining member 20 holds the light irradiation device 12, and the light irradiation device 12 irradiates the opposing surface 7 of the device 4 with light to form an irradiation region 50 (see FIG. 6). Then, (step S1), it is determined whether or not the formed irradiation area 50 and the detection area 30 overlap (step S2). Whether or not the irradiation area 50 and the detection area 30 overlap with each other can be determined by, for example, visually confirming that the irradiation area 50 and the detection area 30 substantially overlap with each other. Overlap. ”
 照射領域50と検出領域30とが重なっていないと判定された場合、位置決定部材20全体あるいは保持部22のみを移動させることで光照射装置12を移動させて(ステップS3)、照射領域50と検出領域30とが重なっていると判定されるまで、ステップS2およびステップS3を繰り返す。位置決定部材20の移動は、例えば、ユーザにより手動で行われる。 When it is determined that the irradiation region 50 and the detection region 30 do not overlap, the light irradiation device 12 is moved by moving the entire position determining member 20 or only the holding unit 22 (step S3), and the irradiation region 50 Steps S2 and S3 are repeated until it is determined that the detection area 30 overlaps. The movement of the position determining member 20 is manually performed by the user, for example.
 照射領域50と検出領域30とが重なっていると判定された場合、照射領域50と検出領域30とが重なっていると判定された検出位置P(図7参照)に位置決定部材20を固定する(ステップS4)。そして、位置決定部材20から光照射装置12を取り外すと共に、温度センサ11を位置決定部材20に保持させる(ステップS5)。これにより、温度センサ11が検出領域30の温度を検出する(ステップS6)。なお、ステップS4およびステップS6は、例えば、ユーザにより手動で行われる。 When it is determined that the irradiation area 50 and the detection area 30 overlap, the position determining member 20 is fixed to the detection position P (see FIG. 7) where it is determined that the irradiation area 50 and the detection area 30 overlap. (Step S4). Then, the light irradiation device 12 is removed from the position determining member 20, and the temperature sensor 11 is held by the position determining member 20 (step S5). As a result, the temperature sensor 11 detects the temperature of the detection area 30 (step S6). Note that steps S4 and S6 are manually performed by the user, for example.
 このように、盤温度検出装置10によれば、検出領域30の温度を検出可能な温度センサ11と、機器4に光を照射可能な光照射装置12と、温度センサ11および光照射装置12のいずれか一方を保持した状態で移動可能に取り付けられた位置決定部材20とを備えている。このような構成により、カメラなどの高価な機器を用いることなく、検出領域30の温度を検出することが可能な盤温度検出装置10を実現できる。 Thus, according to the board temperature detection device 10, the temperature sensor 11 capable of detecting the temperature of the detection region 30, the light irradiation device 12 capable of irradiating the device 4 with light, and the temperature sensor 11 and the light irradiation device 12 are provided. The position determining member 20 is movably attached while holding one of them. With such a configuration, it is possible to realize the board temperature detection device 10 that can detect the temperature of the detection region 30 without using an expensive device such as a camera.
 また、盤温度検出装置10を用いることで、カメラなどの高価な機器を用いることなく盤1の機器4に設けられた検出領域30の温度を検出することができる。すなわち、製造コストを抑制しつつ、盤1の機器4に設けられた検出領域30の温度を検出可能な方法を実現できる。 Further, by using the board temperature detection device 10, it is possible to detect the temperature of the detection region 30 provided in the device 4 of the board 1 without using an expensive device such as a camera. That is, it is possible to realize a method capable of detecting the temperature of the detection region 30 provided in the device 4 of the panel 1 while suppressing the manufacturing cost.
 また、位置決定部材20が、蓋体3に取り外し可能に固定される固定部21と、光照射装置12および温度センサ11のいずれか一方を取り外し可能に保持する保持部22と、固定部21および保持部22に接続されて保持部22を機器4の対向面7に沿って移動可能な接続部23とを有している。このような構成により、位置決定部材20全体を移動させることなく、照射領域50を検出領域30に重ならせることができる。その結果、位置決定部材20を検出位置Pに容易に移動させることができる。 Further, the position determining member 20 includes a fixing portion 21 that is detachably fixed to the lid body 3, a holding portion 22 that detachably holds one of the light irradiation device 12 and the temperature sensor 11, and the fixing portion 21 and It has a connecting portion 23 that is connected to the holding portion 22 and that can move the holding portion 22 along the facing surface 7 of the device 4. With such a configuration, the irradiation region 50 can be overlapped with the detection region 30 without moving the entire position determining member 20. As a result, the position determining member 20 can be easily moved to the detection position P.
 また、保持部22が、並列に延びる一対のレール部221、222を有し、光照射装置12および温度センサ11の各々が、一対のレール部221、222に係合可能な係合部40を有している。これにより、簡単な構成で、温度センサ11および光照射装置12の各々を位置決定部材20に容易に保持させることができる。 Further, the holding portion 22 has a pair of rail portions 221 and 222 extending in parallel, and each of the light irradiation device 12 and the temperature sensor 11 has an engaging portion 40 that can be engaged with the pair of rail portions 221 and 222. Have Thereby, each of the temperature sensor 11 and the light irradiation device 12 can be easily held by the position determining member 20 with a simple configuration.
 なお、位置決定部材20は、温度センサ11および光照射装置12のいずれか一方を保持した状態で、蓋体3に対して機器4の対向面7の延在方向に沿って移動可能に取り付けることができればよく、前記実施形態に限らない。 The position determining member 20 is movably attached to the lid 3 along the extending direction of the facing surface 7 of the device 4 while holding either the temperature sensor 11 or the light irradiation device 12. However, it is not limited to the above embodiment.
 例えば、固定部21は、繰り返し使用可能な接着剤あるいは両面テープを用いて、蓋体3に固定してもよい。また、保持部22は、磁石あるいは雲台を用いて、温度センサ11および光照射装置12のいずれか一方を保持するように構成してもよい。また、接続部23は、保持部22を移動不可能に固定部21に接続するように構成してもよい。 For example, the fixing portion 21 may be fixed to the lid body 3 by using a reusable adhesive or a double-sided tape. The holding unit 22 may be configured to hold either one of the temperature sensor 11 and the light irradiation device 12 by using a magnet or a platform. Further, the connecting portion 23 may be configured to connect the holding portion 22 to the fixed portion 21 immovably.
 また、盤温度検出装置10が、温度センサ11の検出位置Pに対する位置ずれを検出する位置ずれ検出センサと、温度センサ11の検出位置Pに対する位置ずれが検出されたことを表示する表示部とを有する位置ずれ表示装置をさらに備えてもよい。このような構成により、検出領域30の温度をより正確に検出することができる。 In addition, the board temperature detection device 10 includes a position shift detection sensor that detects a position shift of the temperature sensor 11 with respect to the detection position P, and a display unit that displays that the position shift of the temperature sensor 11 with respect to the detection position P is detected. The display device may further include a positional deviation display device having the same. With such a configuration, the temperature of the detection region 30 can be detected more accurately.
 以上、図面を参照して本開示における種々の実施形態を詳細に説明したが、最後に、本開示の種々の態様について説明する。なお、以下の説明では、一例として、参照符号も添えて記載する。 Although various embodiments of the present disclosure have been described in detail above with reference to the drawings, finally, various aspects of the present disclosure will be described. Note that, in the following description, reference numerals are also attached as an example.
 本開示の第1態様の盤温度検出装置10は、
 開口部5を有する筺体2と、前記開口部5を開閉可能な蓋体3と、前記筺体2の内部に配置された機器4とを備える盤1の前記機器4の前記蓋体3に対向する対向面7に設けられた検出領域30の温度を検出する盤温度検出装置10であって、
 前記検出領域30の温度を検出可能な温度センサ11と、
 前記対向面7に光を照射可能な光照射装置12と、
 前記温度センサ11および前記光照射装置12のいずれか一方を保持した状態で、前記蓋体3に対して前記対向面7の延在方向に沿って移動可能に取り付けられた位置決定部材20と
を備え、
 前記光照射装置12から前記対向面7に照射された光の照射領域50と前記検出領域30とが重なる検出位置Pに配置した前記位置決定部材20に前記温度センサ11を保持させて、前記検出領域30の温度を検出する。
The board temperature detection device 10 according to the first aspect of the present disclosure is
Opposed to the lid 3 of the device 4 of the board 1 including the casing 2 having the opening 5, the lid 3 capable of opening and closing the opening 5, and the device 4 arranged inside the casing 2. A board temperature detection device 10 for detecting the temperature of a detection area 30 provided on the facing surface 7,
A temperature sensor 11 capable of detecting the temperature of the detection region 30,
A light irradiation device 12 capable of irradiating the facing surface 7 with light;
A position determining member 20 movably attached to the lid body 3 along the extending direction of the facing surface 7 while holding either one of the temperature sensor 11 and the light irradiation device 12. Prepare,
The temperature sensor 11 is held by the position determining member 20 arranged at the detection position P where the irradiation area 50 of the light emitted from the light irradiation device 12 to the facing surface 7 and the detection area 30 overlap, and the detection is performed. The temperature of the area 30 is detected.
 第1態様の盤温度検出装置10によれば、カメラなどの高価な機器を用いることなく、検出領域30の温度を検出することが可能な盤温度検出装置10を実現できる。 According to the board temperature detecting device 10 of the first aspect, it is possible to realize the board temperature detecting device 10 capable of detecting the temperature of the detection region 30 without using an expensive device such as a camera.
 本開示の第2態様の盤温度検出装置10は、
 前記位置決定部材20が、
 前記蓋体3に取り外し可能に固定される固定部21と、前記光照射装置12および前記温度センサ11のいずれか一方を取り外し可能に保持する保持部22と、前記固定部21および前記保持部22に接続されて前記保持部22を前記対向面7の延在方向に沿って移動可能な接続部23とを有する。
The board temperature detection device 10 according to the second aspect of the present disclosure is
The position determining member 20 is
A fixing portion 21 that is detachably fixed to the lid body 3, a holding portion 22 that detachably holds any one of the light irradiation device 12 and the temperature sensor 11, and the fixing portion 21 and the holding portion 22. And a connecting portion 23 that is connected to the holding portion 22 and is movable along the extending direction of the facing surface 7.
 第2態様の盤温度検出装置10によれば、位置決定部材20全体を移動させることなく、照射領域50を検出領域30に重ならせることができる。その結果、位置決定部材20を検出位置Pに容易に移動させることができる。 According to the board temperature detection device 10 of the second aspect, the irradiation area 50 can be overlapped with the detection area 30 without moving the entire position determining member 20. As a result, the position determining member 20 can be easily moved to the detection position P.
 本開示の第3態様の盤温度検出装置10は、
 前記保持部22が、並列に延びる一対のレール部221、222を有し、
 前記光照射装置12および前記温度センサ11の各々が、前記一対のレール部221、222に係合可能な係合部40を有し、
 前記係合部40が前記一対のレール部221、222に係合することにより、前記光照射装置12および前記温度センサ11の各々が、前記保持部22に保持される。
The board temperature detection device 10 according to the third aspect of the present disclosure is
The holding portion 22 has a pair of rail portions 221, 222 extending in parallel,
Each of the light irradiation device 12 and the temperature sensor 11 has an engaging portion 40 engageable with the pair of rail portions 221 and 222,
Each of the light irradiation device 12 and the temperature sensor 11 is held by the holding portion 22 by the engagement portion 40 engaging with the pair of rail portions 221, 222.
 第3態様の盤温度検出装置10によれば、簡単な構成で、温度センサ11および光照射装置12の各々を位置決定部材20に容易に保持させることができる。 According to the board temperature detection device 10 of the third aspect, each of the temperature sensor 11 and the light irradiation device 12 can be easily held by the position determining member 20 with a simple configuration.
 本開示の第4態様の盤温度検出装置10は、
 前記温度センサ11の前記検出位置Pに対する位置ずれを検出する位置ずれ検出センサと、前記温度センサ11の前記検出位置Pに対する位置ずれが検出されたことを表示する表示部とを有する位置ずれ表示装置をさらに備える。
The board temperature detection device 10 according to the fourth aspect of the present disclosure is
A displacement display device having a displacement detection sensor that detects a displacement of the temperature sensor 11 with respect to the detection position P, and a display unit that displays that the displacement of the temperature sensor 11 with respect to the detection position P is detected. Is further provided.
 第4態様の盤温度検出装置10によれば、検出領域30の温度をより正確に検出することができる。 According to the board temperature detection device 10 of the fourth aspect, the temperature of the detection region 30 can be detected more accurately.
 本開示の第5態様の方法は、
 開口部5を有する筺体2と、前記開口部5を開閉可能な蓋体3と、前記筺体2の内部に配置された機器4とを備える盤1の前記機器4の前記蓋体3に対向する対向面7に設けられた検出領域30の温度を検出する方法であって、
 前記蓋体3に対して前記対向面7の延在方向に沿って移動可能に取り付けられた位置決定部材20に、前記対向面7に光を照射可能な光照射装置12を保持させ、
 前記光照射装置12から前記対向面7に照射された光の照射領域50と前記検出領域30とが重なる検出位置Pに、前記位置決定部材20を移動させて固定し、
 前記位置決定部材20から前記光照射装置12を取り外すと共に、前記検出領域30の温度を検出可能な温度センサ11を前記位置決定部材20に保持させて、
 前記温度センサ11で前記検出領域30の温度を検出する。
The method of the fifth aspect of the present disclosure is
Opposed to the lid 3 of the device 4 of the board 1 including the casing 2 having the opening 5, the lid 3 capable of opening and closing the opening 5, and the device 4 arranged inside the casing 2. A method for detecting the temperature of the detection area 30 provided on the facing surface 7,
The position determining member 20 movably attached to the lid body 3 along the extending direction of the facing surface 7 holds the light irradiating device 12 capable of irradiating the facing surface 7 with light.
The position determining member 20 is moved and fixed to a detection position P where the irradiation region 50 of the light emitted from the light irradiation device 12 to the facing surface 7 and the detection region 30 overlap,
While removing the light irradiation device 12 from the position determining member 20, the position determining member 20 holds a temperature sensor 11 capable of detecting the temperature of the detection region 30,
The temperature of the detection area 30 is detected by the temperature sensor 11.
 第5態様の方法によれば、カメラなどの高価な機器を用いることなく盤1の機器4に設けられた検出領域30の温度を検出することができる。すなわち、製造コストを抑制しつつ、盤1の機器4に設けられた検出領域30の温度を検出可能な方法を実現できる。 According to the method of the fifth aspect, it is possible to detect the temperature of the detection region 30 provided in the device 4 of the panel 1 without using an expensive device such as a camera. That is, it is possible to realize a method capable of detecting the temperature of the detection region 30 provided in the device 4 of the panel 1 while suppressing the manufacturing cost.
 なお、前記様々な実施形態または変形例のうちの任意の実施形態または変形例を適宜組み合わせることにより、それぞれの有する効果を奏するようにすることができる。また、実施形態同士の組み合わせまたは実施例同士の組み合わせまたは実施形態と実施例との組み合わせが可能であると共に、異なる実施形態または実施例の中の特徴同士の組み合わせも可能である。 By properly combining the arbitrary embodiments or modifications of the aforementioned various embodiments or modifications, the effects possessed by them can be produced. Further, a combination of the embodiments or a combination of the examples or a combination of the embodiment and the example is possible, and a combination of features in different embodiments or examples is also possible.
 本開示は、添付図面を参照しながら好ましい実施形態に関連して充分に記載されているが、この技術の熟練した人々にとっては種々の変形や修正は明白である。そのような変形や修正は、添付した請求の範囲による本開示の範囲から外れない限りにおいて、その中に含まれると理解されるべきである。 Although the present disclosure has been fully described with reference to the preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. It is to be understood that such variations and modifications are intended to be included therein without departing from the scope of the present disclosure according to the appended claims.
 本開示の盤温度検出装置は、例えば、配電盤に適用できる。 The panel temperature detection device of the present disclosure can be applied to, for example, a switchboard.
 本開示の方法は、例えば、配電盤の温度検出に適用できる。 The method of the present disclosure can be applied to, for example, temperature detection of a switchboard.
1 盤
2 筺体
3 蓋体
4 機器
5 開口部
6 隙間
7 対向面
10 盤温度検出装置
11 温度センサ
111 ハウジング
12 光照射装置
121 ハウジング
20 位置決定部材
21 固定部
22 保持部
221、222 レール部
23 接続部
30 検出領域
40 係合部
50 照射領域
P 検出位置
1 board 2 housing 3 lid 4 equipment 5 opening 6 gap 7 facing surface 10 board temperature detecting device 11 temperature sensor 111 housing 12 light irradiation device 121 housing 20 position determining member 21 fixing part 22 holding part 221, 222 rail part 23 connection Part 30 Detection area 40 Engaging part 50 Irradiation area P Detection position

Claims (5)

  1.  開口部を有する筺体と、前記開口部を開閉可能な蓋体と、前記筺体の内部に配置された機器とを備える盤の前記機器の前記蓋体に対向する対向面に設けられた検出領域の温度を検出する盤温度検出装置であって、
     前記検出領域の温度を検出可能な温度センサと、
     前記対向面に光を照射可能な光照射装置と、
     前記温度センサおよび前記光照射装置のいずれか一方を保持した状態で、前記蓋体に対して前記対向面の延在方向に沿って移動可能に取り付けられた位置決定部材と
    を備え、
     前記光照射装置から前記対向面に照射された光の照射領域と前記検出領域とが重なる検出位置に配置した前記位置決定部材に前記温度センサを保持させて、前記検出領域の温度を検出する、盤温度検出装置。
    A housing having an opening, a lid capable of opening and closing the opening, and a device provided inside the housing of a detection area provided on a surface of the device facing the lid of the device. A board temperature detecting device for detecting a temperature,
    A temperature sensor capable of detecting the temperature of the detection region,
    A light irradiation device capable of irradiating the opposite surface with light,
    In a state in which one of the temperature sensor and the light irradiation device is held, a position determining member that is movably attached to the lid along the extending direction of the facing surface,
    By holding the temperature sensor in the position determining member arranged at a detection position where the irradiation region of the light irradiated to the facing surface from the light irradiation device and the detection region overlap, the temperature of the detection region is detected, Board temperature detection device.
  2.  前記位置決定部材が、
     前記蓋体に取り外し可能に固定される固定部と、前記光照射装置および前記温度センサのいずれか一方を取り外し可能に保持する保持部と、前記固定部および前記保持部に接続されて前記保持部を前記対向面の延在方向に沿って移動可能な接続部とを有する、請求項1の盤温度検出装置。
    The position determining member,
    A fixing portion that is detachably fixed to the lid body, a holding portion that detachably holds one of the light irradiation device and the temperature sensor, and the holding portion that is connected to the fixing portion and the holding portion. The board temperature detecting device according to claim 1, further comprising a connecting portion that is movable along the extending direction of the facing surface.
  3.  前記保持部が、並列に延びる一対のレール部を有し、
     前記光照射装置および前記温度センサの各々が、前記一対のレール部に係合可能な係合部を有し、
     前記係合部が前記一対のレール部に係合することにより、前記光照射装置および前記温度センサの各々が、前記保持部に保持される、請求項2の盤温度検出装置。
    The holding portion has a pair of rail portions extending in parallel,
    Each of the light irradiation device and the temperature sensor has an engaging portion that is engageable with the pair of rail portions,
    The board temperature detection device according to claim 2, wherein each of the light irradiation device and the temperature sensor is held by the holding part by the engagement part engaging with the pair of rail parts.
  4.  前記温度センサの前記検出位置に対する位置ずれを検出する位置ずれ検出センサと、前記温度センサの前記検出位置に対する位置ずれが検出されたことを表示する表示部とを有する位置ずれ表示装置をさらに備える、請求項1から3のいずれか1つの盤温度検出装置。 A position shift display device further comprising a position shift detection sensor that detects a position shift of the temperature sensor with respect to the detection position, and a display unit that displays that the position shift of the temperature sensor with respect to the detection position is detected. The board temperature detection device according to claim 1.
  5.  開口部を有する筺体と、前記開口部を開閉可能な蓋体と、前記筺体の内部に配置された機器とを備える盤の前記機器の前記蓋体に対向する対向面に設けられた検出領域の温度を検出する方法であって、
     前記蓋体に対して前記対向面の延在方向に沿って移動可能に取り付けられた位置決定部材に、前記対向面に光を照射可能な光照射装置を保持させ、
     前記光照射装置から前記対向面に照射された光の照射領域と前記検出領域とが重なる検出位置に、前記位置決定部材を移動させて固定し、
     前記位置決定部材から前記光照射装置を取り外すと共に、前記検出領域の温度を検出可能な温度センサを前記位置決定部材に保持させて、
     前記温度センサで前記検出領域の温度を検出する、方法。
    A housing having an opening, a lid capable of opening and closing the opening, and a device provided inside the housing of a detection area provided on a surface of the device facing the lid of the device. A method of detecting temperature,
    The position determining member movably attached to the lid along the extending direction of the facing surface holds a light irradiation device capable of irradiating the facing surface with light,
    The position determining member is moved and fixed to a detection position where the irradiation region of the light irradiated to the facing surface from the light irradiation device and the detection region overlap,
    While removing the light irradiating device from the position determining member, a temperature sensor capable of detecting the temperature of the detection region is held by the position determining member,
    A method of detecting the temperature of the detection region with the temperature sensor.
PCT/JP2019/039478 2018-10-31 2019-10-07 Panel temperature detecting device and method for detecting temperature of detection region of panel WO2020090359A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112649181A (en) * 2020-09-01 2021-04-13 江苏振宁半导体研究院有限公司 Quality detection method for instrument panel

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04315930A (en) * 1991-04-16 1992-11-06 Minolta Camera Co Ltd Temperature monitoring device
JPH0571995U (en) * 1992-02-27 1993-09-28 能美防災株式会社 Flame-type fire detector inspection device
JPH11150818A (en) * 1997-11-18 1999-06-02 Nissin Electric Co Ltd Abnormal overheat detector for switch gear
JP2005269848A (en) * 2004-03-22 2005-09-29 Hitachi Ltd Receiving and distributing facility
JP2006112910A (en) * 2004-10-14 2006-04-27 Optex Co Ltd Infrared sensing device and its installation method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04315930A (en) * 1991-04-16 1992-11-06 Minolta Camera Co Ltd Temperature monitoring device
JPH0571995U (en) * 1992-02-27 1993-09-28 能美防災株式会社 Flame-type fire detector inspection device
JPH11150818A (en) * 1997-11-18 1999-06-02 Nissin Electric Co Ltd Abnormal overheat detector for switch gear
JP2005269848A (en) * 2004-03-22 2005-09-29 Hitachi Ltd Receiving and distributing facility
JP2006112910A (en) * 2004-10-14 2006-04-27 Optex Co Ltd Infrared sensing device and its installation method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112649181A (en) * 2020-09-01 2021-04-13 江苏振宁半导体研究院有限公司 Quality detection method for instrument panel

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