JPH04314536A - Electric laminate - Google Patents
Electric laminateInfo
- Publication number
- JPH04314536A JPH04314536A JP10876691A JP10876691A JPH04314536A JP H04314536 A JPH04314536 A JP H04314536A JP 10876691 A JP10876691 A JP 10876691A JP 10876691 A JP10876691 A JP 10876691A JP H04314536 A JPH04314536 A JP H04314536A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- acid
- resin
- acrylate
- allyl ester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- -1 allyl ester Chemical class 0.000 claims abstract description 38
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000011888 foil Substances 0.000 claims abstract description 14
- 229920003043 Cellulose fiber Polymers 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229920002678 cellulose Polymers 0.000 abstract 1
- 239000001913 cellulose Substances 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 23
- 229920000877 Melamine resin Polymers 0.000 description 15
- 229920006395 saturated elastomer Polymers 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 13
- 239000004640 Melamine resin Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 12
- 239000007788 liquid Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 238000004080 punching Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 7
- 150000001298 alcohols Chemical class 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 150000005846 sugar alcohols Polymers 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 150000007519 polyprotic acids Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 125000005907 alkyl ester group Chemical group 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 235000003441 saturated fatty acids Nutrition 0.000 description 3
- 150000004671 saturated fatty acids Chemical class 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 3
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 3
- DJKGDNKYTKCJKD-BPOCMEKLSA-N (1s,4r,5s,6r)-1,2,3,4,7,7-hexachlorobicyclo[2.2.1]hept-2-ene-5,6-dicarboxylic acid Chemical compound ClC1=C(Cl)[C@]2(Cl)[C@H](C(=O)O)[C@H](C(O)=O)[C@@]1(Cl)C2(Cl)Cl DJKGDNKYTKCJKD-BPOCMEKLSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical class N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- CHUGKEQJSLOLHL-UHFFFAOYSA-N 2,2-Bis(bromomethyl)propane-1,3-diol Chemical compound OCC(CO)(CBr)CBr CHUGKEQJSLOLHL-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000012796 inorganic flame retardant Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 238000005809 transesterification reaction Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- NIDNOXCRFUCAKQ-UMRXKNAASA-N (1s,2r,3s,4r)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1[C@H]2C=C[C@@H]1[C@H](C(=O)O)[C@@H]2C(O)=O NIDNOXCRFUCAKQ-UMRXKNAASA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- RVHSTXJKKZWWDQ-UHFFFAOYSA-N 1,1,1,2-tetrabromoethane Chemical compound BrCC(Br)(Br)Br RVHSTXJKKZWWDQ-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- UJNVTDGCOKFBKM-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)hexane Chemical compound CCCCCC(OOC(C)(C)C)OOC(C)(C)C UJNVTDGCOKFBKM-UHFFFAOYSA-N 0.000 description 1
- HFVIYAZBVIGNAN-UHFFFAOYSA-N 1,1-dibromodecane Chemical compound CCCCCCCCCC(Br)Br HFVIYAZBVIGNAN-UHFFFAOYSA-N 0.000 description 1
- ATWLRNODAYAMQS-UHFFFAOYSA-N 1,1-dibromopropane Chemical compound CCC(Br)Br ATWLRNODAYAMQS-UHFFFAOYSA-N 0.000 description 1
- GPQLSLKPHQEEOP-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-(2,3,4-tribromophenoxy)benzene Chemical compound BrC1=C(Br)C(Br)=CC=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br GPQLSLKPHQEEOP-UHFFFAOYSA-N 0.000 description 1
- OZHJEQVYCBTHJT-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-methylbenzene Chemical compound CC1=C(Br)C(Br)=C(Br)C(Br)=C1Br OZHJEQVYCBTHJT-UHFFFAOYSA-N 0.000 description 1
- HGRZLIGHKHRTRE-UHFFFAOYSA-N 1,2,3,4-tetrabromobutane Chemical compound BrCC(Br)C(Br)CBr HGRZLIGHKHRTRE-UHFFFAOYSA-N 0.000 description 1
- GMVJKSNPLYBFSO-UHFFFAOYSA-N 1,2,3-tribromobenzene Chemical compound BrC1=CC=CC(Br)=C1Br GMVJKSNPLYBFSO-UHFFFAOYSA-N 0.000 description 1
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 1
- WQONPSCCEXUXTQ-UHFFFAOYSA-N 1,2-dibromobenzene Chemical compound BrC1=CC=CC=C1Br WQONPSCCEXUXTQ-UHFFFAOYSA-N 0.000 description 1
- YAOMHRRYSRRRKP-UHFFFAOYSA-N 1,2-dichloropropyl 2,3-dichloropropyl 3,3-dichloropropyl phosphate Chemical compound ClC(Cl)CCOP(=O)(OC(Cl)C(Cl)C)OCC(Cl)CCl YAOMHRRYSRRRKP-UHFFFAOYSA-N 0.000 description 1
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 description 1
- WLPXNBYWDDYJTN-UHFFFAOYSA-N 1-bromo-2,3-dimethylbenzene Chemical group CC1=CC=CC(Br)=C1C WLPXNBYWDDYJTN-UHFFFAOYSA-N 0.000 description 1
- QBELEDRHMPMKHP-UHFFFAOYSA-N 1-bromo-2-chlorobenzene Chemical compound ClC1=CC=CC=C1Br QBELEDRHMPMKHP-UHFFFAOYSA-N 0.000 description 1
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- MPPPKRYCTPRNTB-UHFFFAOYSA-N 1-bromobutane Chemical compound CCCCBr MPPPKRYCTPRNTB-UHFFFAOYSA-N 0.000 description 1
- PBLNBZIONSLZBU-UHFFFAOYSA-N 1-bromododecane Chemical compound CCCCCCCCCCCCBr PBLNBZIONSLZBU-UHFFFAOYSA-N 0.000 description 1
- MNDIARAMWBIKFW-UHFFFAOYSA-N 1-bromohexane Chemical compound CCCCCCBr MNDIARAMWBIKFW-UHFFFAOYSA-N 0.000 description 1
- DLKQHBOKULLWDQ-UHFFFAOYSA-N 1-bromonaphthalene Chemical compound C1=CC=C2C(Br)=CC=CC2=C1 DLKQHBOKULLWDQ-UHFFFAOYSA-N 0.000 description 1
- VMKOFRJSULQZRM-UHFFFAOYSA-N 1-bromooctane Chemical compound CCCCCCCCBr VMKOFRJSULQZRM-UHFFFAOYSA-N 0.000 description 1
- YZWKKMVJZFACSU-UHFFFAOYSA-N 1-bromopentane Chemical compound CCCCCBr YZWKKMVJZFACSU-UHFFFAOYSA-N 0.000 description 1
- CYNYIHKIEHGYOZ-UHFFFAOYSA-N 1-bromopropane Chemical compound CCCBr CYNYIHKIEHGYOZ-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- PMUPSYZVABJEKC-UHFFFAOYSA-N 1-methylcyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)CCCCC1C(O)=O PMUPSYZVABJEKC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- RZRNAYUHWVFMIP-KTKRTIGZSA-N 1-oleoylglycerol Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-KTKRTIGZSA-N 0.000 description 1
- FNAKEOXYWBWIRT-UHFFFAOYSA-N 2,3-dibromophenol Chemical compound OC1=CC=CC(Br)=C1Br FNAKEOXYWBWIRT-UHFFFAOYSA-N 0.000 description 1
- QWVCIORZLNBIIC-UHFFFAOYSA-N 2,3-dibromopropan-1-ol Chemical compound OCC(Br)CBr QWVCIORZLNBIIC-UHFFFAOYSA-N 0.000 description 1
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical compound OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- ODGCZQFTJDEYNI-UHFFFAOYSA-N 2-methylcyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)C=CCCC1C(O)=O ODGCZQFTJDEYNI-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- XIRDTMSOGDWMOX-UHFFFAOYSA-N 3,4,5,6-tetrabromophthalic acid Chemical compound OC(=O)C1=C(Br)C(Br)=C(Br)C(Br)=C1C(O)=O XIRDTMSOGDWMOX-UHFFFAOYSA-N 0.000 description 1
- WZHHYIOUKQNLQM-UHFFFAOYSA-N 3,4,5,6-tetrachlorophthalic acid Chemical compound OC(=O)C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1C(O)=O WZHHYIOUKQNLQM-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- JPKVIAIUBLGJQH-UHFFFAOYSA-N 6-methylidenecyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1C=CCC(=C)C1C(O)=O JPKVIAIUBLGJQH-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 229910020543 Cm H2m+1 Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001214 Polysorbate 60 Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Natural products CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N beta-monoglyceryl stearate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 description 1
- RDHPKYGYEGBMSE-UHFFFAOYSA-N bromoethane Chemical compound CCBr RDHPKYGYEGBMSE-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- BXIQXYOPGBXIEM-UHFFFAOYSA-N butyl 4,4-bis(tert-butylperoxy)pentanoate Chemical compound CCCCOC(=O)CCC(C)(OOC(C)(C)C)OOC(C)(C)C BXIQXYOPGBXIEM-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 1
- AOEJUDXDTCZDDB-UHFFFAOYSA-N carboxyoxy hydroxy carbonate Chemical class OOC(=O)OOC(O)=O AOEJUDXDTCZDDB-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- GVYLCNUFSHDAAW-UHFFFAOYSA-N mirex Chemical compound ClC12C(Cl)(Cl)C3(Cl)C4(Cl)C1(Cl)C1(Cl)C2(Cl)C3(Cl)C4(Cl)C1(Cl)Cl GVYLCNUFSHDAAW-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- RZRNAYUHWVFMIP-UHFFFAOYSA-N monoelaidin Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- URLKBWYHVLBVBO-UHFFFAOYSA-N p-dimethylbenzene Natural products CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- SVHOVVJFOWGYJO-UHFFFAOYSA-N pentabromophenol Chemical compound OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br SVHOVVJFOWGYJO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 150000003022 phthalic acids Chemical class 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- CSKKAINPUYTTRW-UHFFFAOYSA-N tetradecoxycarbonyloxy tetradecyl carbonate Chemical compound CCCCCCCCCCCCCCOC(=O)OOC(=O)OCCCCCCCCCCCCCC CSKKAINPUYTTRW-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、電気機器、電子機器、
通信機器等に使用される印刷回路を形成するための電気
用積層板に関する。[Industrial Application Field] The present invention is applicable to electrical equipment, electronic equipment,
The present invention relates to electrical laminates for forming printed circuits used in communication equipment, etc.
【0002】0002
【従来の技術】印刷回路を形成するための電気用積層板
には、種々のものが実用化されている。セルロース繊維
を主成分とするものでは、紙とフェノール樹脂、あるい
は紙と不飽和ポリエステル樹脂によって積層板を構成し
、この積層板の片面もしくは両面に金属箔を張り合わせ
たものが一般的である。セルロース繊維とアリルエステ
ル樹脂によって構成される電気用積層板については、例
えば特願平1−255038号において提案されている
。2. Description of the Related Art Various types of electrical laminates for forming printed circuits have been put into practical use. For those whose main component is cellulose fiber, a laminate is generally constructed of paper and phenol resin, or paper and unsaturated polyester resin, and metal foil is laminated on one or both sides of this laminate. An electrical laminate made of cellulose fibers and allyl ester resin has been proposed, for example, in Japanese Patent Application No. 1-255038.
【0003】このようなセルロース繊維とアリルエステ
ル樹脂とを主成分とする電気用積層板を製造する場合、
セルロース繊維をメラミン樹脂で予め含浸乾燥処理した
後、このセルロース繊維基材にアリルエステル樹脂を主
成分とする硬化性樹脂液を含浸後、硬化させる方法が一
般的である。[0003] When manufacturing an electrical laminate mainly composed of cellulose fibers and allyl ester resin,
A common method is to pre-impregnate cellulose fibers with a melamine resin and dry them, then impregnate this cellulose fiber base material with a curable resin liquid containing allyl ester resin as a main component, and then harden the impregnated cellulose fibers.
【0004】0004
【発明が解決しようとする課題】しかしながら、このよ
うにして得られるアリルエステル樹脂系積層板にあって
は、その機械的強度は高いものの打ち抜き加工性等の耐
衝撃性能が不充分であり、機械的強度及び打ち抜き加工
性が共に優れた両性能のバランスのとれた積層板を得る
ことが現在大きな課題となっている。よって、本発明は
、高度な機械的強度を有し、かつ優れた打ち抜き加工性
を合わせ持つ電気用積層板の提供を目的とする。[Problems to be Solved by the Invention] However, although the allyl ester resin laminate obtained in this manner has high mechanical strength, its impact resistance such as punching workability is insufficient, and mechanical Currently, it is a major challenge to obtain a laminate with a good balance of both mechanical strength and punching workability. Therefore, an object of the present invention is to provide an electrical laminate having high mechanical strength and excellent punching workability.
【0005】[0005]
【課題を解決するための手段】本発明者はこれらの目的
達成のために鋭意検討を重ねた結果、セルロース繊維を
主成分とする基材、アリルエステル樹脂及び金属箔より
なる積層板において、金属箔を除去した積層板に対して
の含水率が0.1〜5.0重量%の範囲内にあるように
調節することにより、機械的強度及び打ち抜き加工性が
共に優れた電気用積層板を作り得ることを見出した。[Means for Solving the Problems] As a result of intensive studies to achieve these objectives, the present inventors have developed a laminate consisting of a base material mainly composed of cellulose fibers, an allyl ester resin, and a metal foil. By adjusting the moisture content of the laminate from which the foil has been removed to within the range of 0.1 to 5.0% by weight, an electrical laminate with excellent mechanical strength and punching workability can be obtained. I discovered that it can be made.
【0006】以下、本発明を詳細に説明する。The present invention will be explained in detail below.
【0007】本発明にいうセルロース繊維を主成分とす
る基材としては、例えばクラフト紙、リンター紙、コッ
トン紙等があげられ、含浸性や品質の観点から風乾時の
密度が0.3〜0.7g/cm3 であるような紙、例
えばクラフト紙があげられる。[0007] Examples of the base material containing cellulose fiber as a main component in the present invention include kraft paper, linter paper, cotton paper, etc., and from the viewpoint of impregnability and quality, the density when air-dried is 0.3 to 0. .7 g/cm3, such as kraft paper.
【0008】本発明における積層板を製造する場合、通
常セルロース繊維を主成分とする基材をメラミン樹脂で
予め含浸乾燥処理するが、本発明にいうメラミン樹脂と
は、メラミン又はグアナミン類とホルムアルデヒドとの
初期縮合物、あるいはそれらのメチロール基の一部又は
全部を炭素数5以下のアルコールでエーテル化したもの
などをさす。メラミン又はグアナミン類と反応させるホ
ルムアルデヒドの量は適宜選択することが可能であるが
、通常、メラミン又はグアナミン類1モルに対して2.
0〜3.5モルが好ましい。When producing the laminate according to the present invention, a base material mainly composed of cellulose fibers is usually impregnated with a melamine resin and dried. It refers to the initial condensation products of , or those obtained by etherifying some or all of their methylol groups with alcohols having 5 or less carbon atoms. The amount of formaldehyde to be reacted with melamine or guanamines can be selected as appropriate, but usually 2.0% per mole of melamine or guanamines.
0 to 3.5 mol is preferred.
【0009】本発明において基材をメラミン樹脂で含浸
乾燥処理する際に、メラミン樹脂とともに高級脂肪酸エ
ステル系化合物やノニオン型の界面活性剤を混合して使
用することもできる。高級脂肪酸エステル系化合物とし
ては炭素数10以上の飽和又は不飽和脂肪酸と炭素数5
以下のグリコール又はポリオールとの部分エステル化物
をさし、通常、室温で固体状のものが多く、例えばステ
アリン酸モノグリセリド、ステアリン酸ジグリセリド、
オレイン酸モノグリセリド、オレイン酸ジグリセリド等
があげられるが、これらに限定されるものではない。
又、高級脂肪酸エステル系化合物は単独だけでなく二種
又はそれ以上併用して使用することができ、さらに、高
級脂肪酸エステル系化合物とともに炭素数10以上の飽
和又は不飽和脂肪酸や炭素数5以下のグリコール又はポ
リオールを一部併用して使用しても何ら差し支えない。
ノニオン型の界面活性剤としては、通常市販されている
ものはいずれも使用可能であり、例えばポリオキシエチ
レンアルキルエステル、ポリオキシエチレンアルキルエ
ーテル、ポリオキシエチレンアルキルフェノールエーテ
ル、ソルビタンアルキルエステル、ポリオキシエチレン
ソルビタンアルキルエステル、ポリグリセリンアルキル
エステル等があげられる。In the present invention, when impregnating and drying a substrate with a melamine resin, a higher fatty acid ester compound or a nonionic surfactant may be used in combination with the melamine resin. Higher fatty acid ester compounds include saturated or unsaturated fatty acids with 10 or more carbon atoms and 5 carbon atoms.
Refers to partially esterified products with the following glycols or polyols, which are usually solid at room temperature, such as stearic acid monoglyceride, stearic acid diglyceride,
Examples include, but are not limited to, oleic acid monoglyceride and oleic acid diglyceride. In addition, higher fatty acid ester compounds can be used not only alone but also in combination of two or more. Furthermore, higher fatty acid ester compounds can be used together with saturated or unsaturated fatty acids having 10 or more carbon atoms or saturated or unsaturated fatty acids having 5 or less carbon atoms. There is no problem even if a part of glycol or polyol is used in combination. Any commercially available nonionic surfactants can be used, such as polyoxyethylene alkyl ester, polyoxyethylene alkyl ether, polyoxyethylene alkylphenol ether, sorbitan alkyl ester, and polyoxyethylene sorbitan. Examples include alkyl esters and polyglycerin alkyl esters.
【0010】セルロース繊維を主成分とする基材へのメ
ラミン樹脂の含浸乾燥処理に際しては、メラミン樹脂を
水、アルコール類、ケトン類等の単独又は混合溶剤に混
合して溶液又は懸濁液の状態で使用する。該基材をメラ
ミン樹脂の溶液又は懸濁液に含浸させた後、乾燥処理を
行なうが、乾燥処理に際しては必要に応じて加熱処理を
行なう。加熱処理は通常80〜180℃で行なうがこの
温度に限定されるものではない。含浸乾燥後の基材には
、含浸乾燥前の基材100重量部に対してメラミン樹脂
を5〜40重量部、望ましくは10〜30重量部付着さ
せることが好ましい。5重量部未満では耐水性能が不充
分であり、40重量部を越えるとむしろ打ち抜き加工性
が低下する。[0010] When impregnating and drying a base material mainly composed of cellulose fibers with melamine resin, the melamine resin is mixed with water, alcohols, ketones, etc. alone or in a mixed solvent to form a solution or suspension. Use with. After impregnating the base material with a solution or suspension of melamine resin, a drying treatment is performed, and during the drying treatment, a heat treatment is performed as necessary. The heat treatment is usually carried out at 80 to 180°C, but is not limited to this temperature. It is preferable that 5 to 40 parts by weight, preferably 10 to 30 parts by weight of melamine resin be attached to the substrate after impregnating and drying, based on 100 parts by weight of the substrate before impregnating and drying. If it is less than 5 parts by weight, the water resistance is insufficient, and if it exceeds 40 parts by weight, the punching workability is rather deteriorated.
【0011】本発明にいうアリルエステル樹脂とは飽和
多塩基酸と飽和多価アルコールより構成されてなる飽和
ポリエステルの末端にアリルエステル基を有する樹脂を
いう。[0011] The allyl ester resin as used in the present invention refers to a resin having an allyl ester group at the end of a saturated polyester composed of a saturated polybasic acid and a saturated polyhydric alcohol.
【0012】飽和多塩基酸としては、例えば二塩基酸と
してオルソフタル酸、オルソフタル酸無水物、イソフタ
ル酸、テレフタル酸等のフタル酸類、テトラヒドロフタ
ル酸、メチルテトラヒドロフタル酸、エンドメチレンテ
トラヒドロフタル酸、メチルエンドメチレンテトラヒド
ロフタル酸、ヘキサヒドロフタル酸、メチルヘキサヒド
ロフタル酸、及びそれらの酸無水物等のヒドロフタル酸
類、マロン酸、コハク酸、グルタル酸、アジピン酸等の
脂肪族二塩基酸、テトラブロムフタル酸、テトラクロル
フタル酸、クロレンド酸、及びこれらの酸無水物等のハ
ロゲン化二塩基酸があげられる。三官能以上の多塩基酸
としてはトリメリット酸、ピロメリット酸及びそれらの
酸無水物があげられる。これらは、単独でもまたは混合
しても用いることができる。Examples of saturated polybasic acids include dibasic acids such as orthophthalic acid, orthophthalic anhydride, isophthalic acid, phthalic acids such as terephthalic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, endomethylenetetrahydrophthalic acid, and methylendo. Hydrophthalic acids such as methylenetetrahydrophthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, and their acid anhydrides; aliphatic dibasic acids such as malonic acid, succinic acid, glutaric acid, and adipic acid; tetrabromophthalic acid; , tetrachlorophthalic acid, chlorendic acid, and halogenated dibasic acids such as acid anhydrides thereof. Examples of trifunctional or higher-functional polybasic acids include trimellitic acid, pyromellitic acid, and acid anhydrides thereof. These can be used alone or in combination.
【0013】飽和多価アルコールとしては、エチレング
リコール、1,2−プロピレングリコール、1,4−ブ
タンジオール、1,6−ヘキサンジオール、ネオペンチ
ルグリコール、1,4−シクロヘキサンジメタノール、
パラキシレングリコール等の脂肪族、脂環族または芳香
族を含んだ二価のアルコールの他、一般式HO(CHR
CH2 O)n H(RはHまたはCm H2m+1、
mは1〜5の整数、nは2〜10の整数)で表わされる
エチレンオキサイド、プロピレンオキサイド等のアルキ
レンオキサイドの付加反応によって得られる二価のアル
コールがあげられる。三価以上の多価アルコールとして
は、例えばグリセリン、トリメチロールプロパン等の脂
肪族の三価のアルコールやペンタエリスリトール、ソル
ビトール等の四価以上のアルコールがあげられる。また
、ジブロムネオペンチルグリコール、テトラブロモビス
フェノールAエチレンオキサイド付加物のようなハロゲ
ン原子を含む脂肪族、脂環族または芳香族のハロゲン化
多価アルコールがあげられる。これらは、単独でもまた
は混合しても用いることができる。Examples of the saturated polyhydric alcohol include ethylene glycol, 1,2-propylene glycol, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, 1,4-cyclohexanedimethanol,
In addition to dihydric alcohols containing aliphatic, alicyclic or aromatic compounds such as paraxylene glycol, alcohols with the general formula HO (CHR
CH2 O)n H (R is H or Cm H2m+1,
(m is an integer of 1 to 5, n is an integer of 2 to 10) dihydric alcohols obtained by addition reaction of alkylene oxides such as ethylene oxide and propylene oxide. Examples of trihydric or higher polyhydric alcohols include aliphatic trihydric alcohols such as glycerin and trimethylolpropane, and tetrahydric or higher alcohols such as pentaerythritol and sorbitol. Further examples include aliphatic, alicyclic or aromatic halogenated polyhydric alcohols containing a halogen atom, such as dibromneopentyl glycol and tetrabromobisphenol A ethylene oxide adduct. These can be used alone or in combination.
【0014】アリルエステル樹脂の製造法は既に公知で
あり、例えば特願昭63−262217号に述べられて
いる。例えば、アリルエステル樹脂はジアリルテレフタ
レートのような飽和二塩基酸のジアリルエステルと飽和
多価アルコールとをエステル交換触媒と共に反応器に仕
込みアリルアルコールを留去させながら反応させ製造さ
れる。工業的に更に有効な方法としては、ジアリルテレ
フタレートの代わりにジメチルテレフタレートのような
飽和二塩基酸のジアルキルエステルをアリルアルコール
、多価アルコール及びエステル交換触媒と共に反応器に
仕込み、メタノール等の副製するアルコールを留去させ
ながら反応させて得ることができる。また、反応温度に
よってはハイドロキノンのような重合禁止剤を反応液中
に共存させてもよい。このようにして飽和ポリエステル
の末端にアリルエステル基を有するアリルエステル樹脂
を製造することができる。The method for producing allyl ester resins is already known and is described, for example, in Japanese Patent Application No. 63-262217. For example, an allyl ester resin is produced by charging a diallyl ester of a saturated dibasic acid such as diallyl terephthalate and a saturated polyhydric alcohol together with a transesterification catalyst into a reactor and reacting the allyl alcohol while distilling off the allyl alcohol. As an industrially more effective method, instead of diallyl terephthalate, a dialkyl ester of a saturated dibasic acid such as dimethyl terephthalate is charged into a reactor together with allyl alcohol, a polyhydric alcohol, and a transesterification catalyst to produce by-products such as methanol. It can be obtained by reacting while distilling off the alcohol. Further, depending on the reaction temperature, a polymerization inhibitor such as hydroquinone may be allowed to coexist in the reaction solution. In this way, an allyl ester resin having an allyl ester group at the end of a saturated polyester can be produced.
【0015】本発明において、メラミン樹脂で予め含浸
乾燥処理した基材に含浸するアリルエステル樹脂の種類
は、一種類でも二種類以上混合してもよい。飽和多塩基
酸と飽和多価アルコールの種類を種々選択することによ
って目的性能に応じた電気用積層板を得ることができる
。In the present invention, the type of allyl ester resin that is impregnated into the base material which has been previously impregnated and dried with the melamine resin may be one type or a mixture of two or more types. By selecting various types of saturated polybasic acid and saturated polyhydric alcohol, it is possible to obtain an electrical laminate that meets the desired performance.
【0016】本発明においてメラミン樹脂で予め含浸乾
燥処理した基材には、アリルエステル樹脂以外に、必要
に応じてラジカル重合可能な架橋性モノマーや臭素、塩
素またはリンを含む添加型難燃性化合物、無機系難燃剤
等を併用して含浸、成形することも可能である。In the present invention, in addition to the allyl ester resin, the base material pre-impregnated and dried with the melamine resin may optionally contain a radically polymerizable crosslinking monomer or an additive type flame retardant compound containing bromine, chlorine, or phosphorus. It is also possible to impregnate and mold using a combination of inorganic flame retardants and the like.
【0017】ラジカル重合可能な架橋性モノマーとして
は公知のものはいずれも使用可能であるが、例えば、ジ
アリルオルソフタレート、ジアリルイソフタレート、ジ
アリルテレフタレートのようなジアリルフタレート類;
スチレン、α−メチルスチレン、p−メチルスチレン、
p−クロルスチレン、ブロムスチレン、ジビニルベンゼ
ンのような置換スチレン類;(メタ)アクリル酸メチル
、(メタ)アクリル酸エチル、(メタ)アクリル酸ブチ
ル、(メタ)アクリル酸2−エチルヘキシル、(メタ)
アクリル酸ラウリル、(メタ)アクリル酸ベンジル、ブ
ロム化フェニル(メタ)アクリル酸エステルのようなア
クリル酸またはメタアクリル酸エステル類;エチレング
リコールジ(メタ)アクリレート、1,4−ブタンジオ
ールジ(メタ)アクリレート、トリメチロールプロパン
トリ(メタ)アクリレート、ジアクリル化イソシアヌレ
ート、ペンタエリスリトールトリ(メタ)アクリレート
、ペンタエリスリトールテトラ(メタ)アクリレート、
グリセリンジ(メタ)アクリレート、ネオペンチルグリ
コールジ(メタ)アクリレート、ビスフェノールAジ(
メタ)アクリレート等のビニル多官能アクリル酸または
メタアクリル酸エステル類;ポリウレタン(メタ)アク
リレート、ポリエーテル(メタ)アクリレート、エピク
ロルヒドリン変性ビスフェノールAジ(メタ)アクリレ
ート、エチレンオキシド変性ビスフェノールAジ(メタ
)アクリレート、ポリエチレングリコールジ(メタ)ア
クリレート、ポリプロピレングリコールジ(メタ)アク
リレート等のビニル多官能オリゴエステル類等が含まれ
る。Any known radically polymerizable crosslinking monomer can be used, including diallyl phthalates such as diallyl orthophthalate, diallyl isophthalate, and diallyl terephthalate;
Styrene, α-methylstyrene, p-methylstyrene,
Substituted styrenes such as p-chlorostyrene, bromustyrene, divinylbenzene; methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (meth)acrylate
Acrylic acid or methacrylic acid esters such as lauryl acrylate, benzyl (meth)acrylate, brominated phenyl (meth)acrylate; ethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate Acrylate, trimethylolpropane tri(meth)acrylate, diacrylated isocyanurate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate,
Glycerin di(meth)acrylate, neopentyl glycol di(meth)acrylate, bisphenol A di(
Vinyl polyfunctional acrylic acid or methacrylic acid esters such as meth)acrylate; polyurethane (meth)acrylate, polyether (meth)acrylate, epichlorohydrin-modified bisphenol A di(meth)acrylate, ethylene oxide-modified bisphenol A di(meth)acrylate, Vinyl polyfunctional oligoesters such as polyethylene glycol di(meth)acrylate and polypropylene glycol di(meth)acrylate are included.
【0018】架橋性モノマーは目的に応じて二種類また
はそれ以上を組み合わせて用いても何ら差しつかえない
。本発明において架橋性モノマーを配合すると、本来、
固形もしくは粘稠な液体であるアリルエステル樹脂の粘
度を下げることができ、かつ、溶剤等を使用したプリプ
レグ状態を経ることなく、積層板の製造工程を簡略化す
ることも可能である。There is no problem in using two or more types of crosslinking monomers in combination depending on the purpose. In the present invention, when a crosslinking monomer is blended, originally,
The viscosity of the allyl ester resin, which is a solid or viscous liquid, can be lowered, and the manufacturing process of the laminate can be simplified without going through a prepreg state using a solvent or the like.
【0019】臭素、塩素、またはリンを含む添加型難燃
性化合物としては分子内に1個または複数個の臭素原子
、塩素原子、またはリン原子を有する化合物をさし、ラ
ジカル重合しない添加型の脂肪族系、脂環族系、芳香族
系炭化水素化合物をいう。Additive flame retardant compounds containing bromine, chlorine, or phosphorus refer to compounds having one or more bromine atoms, chlorine atoms, or phosphorus atoms in the molecule, and additive-type flame retardant compounds that do not undergo radical polymerization. Refers to aliphatic, alicyclic, and aromatic hydrocarbon compounds.
【0020】たとえば、モノブロモベンゼン、ジブロモ
ベンゼン、トリブロモベンゼン、ブロモクロロベンゼン
等の置換ベンゼン類、ブロモフェノール、ジブロモフェ
ノール、トリブロモフェノール、ペンタブロモフェノー
ル等の置換フェノール類、テトラブロムジフェニルエー
テル、ペンタブロムジフェニルエーテル、ヘキサブロム
ジフェニルエーテル、オクタブロムジフェニルエーテル
、デカブロムジフェニルエーテル等の置換ジフェニルエ
ーテル類、テトラブロモビスフェノールA、テトラブロ
モビスフェノールAのエチレンオキサイド付加物、テト
ラクロロビスフェノールA、臭素化エポキシ化合物、エ
チルブロマイド、プロピルブロマイド、ブチルブロマイ
ド、アミルブロマイド、ヘキシルブロマイド、オクチル
ブロマイド、ラウリルブロマイド、ジブロモプロパン、
ジブロモデカン、テトラブロメタン、テトラブロモブタ
ン、ヘキサブロモシクロドデカン、ジブロモネオペンチ
ルグリコール、ジブロモプロパノール、エピブロモヒド
リン、ブロモトルエン、ペンタブロモトルエン、ブロモ
キシレン、ブロモナフタレン、塩素化パラフィン、塩素
化ポリエチレン、塩素化ポリプロピレン、パークロロペ
ンタシクロデカン、クロレンド酸、テトラクロロ無水フ
タル酸、テトラブロモ無水フタル酸、臭素化ポリスチレ
ン、ポリジブロモフェニルオキサイド、トリメチルホス
フェート、トリエチルホスフェート、トリブチルホスフ
ェート、トリオクチルホスフェート、トリフェニルホス
フェート、トリクレジルホスフェート、トリス(クロル
エチル)ホスフェート、トリス(ジクロルプロピル)ホ
スフェート、クレジルジフェニルホスフェート、トリフ
ェニルホスファイト等があげられるが、これらに限定さ
れるものではない。これらは単独または複数個の組み合
わせで使用できる。For example, substituted benzenes such as monobromobenzene, dibromobenzene, tribromobenzene, and bromochlorobenzene, substituted phenols such as bromophenol, dibromophenol, tribromophenol, and pentabromophenol, tetrabrom diphenyl ether, and pentabrom diphenyl ether. , substituted diphenyl ethers such as hexabrom diphenyl ether, octabrom diphenyl ether, decabrom diphenyl ether, tetrabromo bisphenol A, ethylene oxide adduct of tetrabromo bisphenol A, tetrachlorobisphenol A, brominated epoxy compounds, ethyl bromide, propyl bromide, butyl Bromide, amyl bromide, hexyl bromide, octyl bromide, lauryl bromide, dibromopropane,
Dibromodecane, tetrabromethane, tetrabromobutane, hexabromocyclododecane, dibromoneopentyl glycol, dibromopropanol, epibromohydrin, bromotoluene, pentabromotoluene, bromoxylene, bromonaphthalene, chlorinated paraffin, chlorinated polyethylene, Chlorinated polypropylene, perchloropentacyclodecane, chlorendic acid, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, brominated polystyrene, polydibromophenyl oxide, trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, Examples include, but are not limited to, tricresyl phosphate, tris(chlorethyl) phosphate, tris(dichloropropyl) phosphate, cresyl diphenyl phosphate, triphenyl phosphite, and the like. These can be used alone or in combination.
【0021】無機系難燃剤としては例えば三酸化アンチ
モン、五酸化アンチモン等のアンチモン化合物、ホウ酸
亜鉛、水酸化アルミニウム等を併用することも可能であ
る。As the inorganic flame retardant, for example, antimony compounds such as antimony trioxide and antimony pentoxide, zinc borate, aluminum hydroxide, etc. can be used in combination.
【0022】本発明においてアリルエステル樹脂は、汎
用の有機過酸化物を用いて硬化させることができ、有機
過酸化物とともにまたは単独で、光に感応する重合開始
剤や放射線、電子線に感応する重合開始剤等の公知の重
合開始剤も利用できる。[0022] In the present invention, the allyl ester resin can be cured using a general-purpose organic peroxide, and together with the organic peroxide or alone, it can be cured with a polymerization initiator that is sensitive to light, radiation, or an electron beam. Known polymerization initiators such as polymerization initiators can also be used.
【0023】有機過酸化物としては、例えば、メチルエ
チルケトンパーオキサイド、アセチルアセトンパーオキ
サイド等のケトンパーオキサイド類、1,1−ビス(t
−ブチルパーオキシ)3,3,5−トリメチルシクロヘ
キサン、n−ブチル−4,4−ビス(t−ブチルパーオ
キシ)バレレート等のパーオキシケタール類、t−ブチ
ルハイドロパーオキサイド、クメンハイドロパーオキサ
イド、p−メンタンハイドロパーオキサイド等のハイド
ロパーオキサイド類、ジ−t−ブチルパーオキサイド、
ジクミルパーオキサイド、2,5−ジメチル−2,5−
ジ(t−ブチルパーオキシ)ヘキサン等のジアルキルパ
ーオキサイド類、ラウロイルパーオキサイド、ベンゾイ
ルパーオキサイド等のジアシルパーオキサイド類、ジ−
iso−プロピルパーオキシジカーボネート、ジミリス
チルパーオキシジカーボネート、ビス(4−t−ブチル
シクロヘキシル)パーオキシジカーボネート等のパーオ
キシジカーボネート類、t−ブチルパーオキシピバレー
ト、t−ブチルパーオキシ−2−エチルヘキサノエート
、t−ブチルパーオキシベンゾエート等のパーオキシエ
ステル類があげられる。これらは一種類または二種類以
上混合して、樹脂の種類、硬化条件に応じて用いること
ができる。Examples of organic peroxides include ketone peroxides such as methyl ethyl ketone peroxide and acetylacetone peroxide, 1,1-bis(t
-butylperoxy) 3,3,5-trimethylcyclohexane, peroxyketals such as n-butyl-4,4-bis(t-butylperoxy)valerate, t-butyl hydroperoxide, cumene hydroperoxide, Hydroperoxides such as p-menthane hydroperoxide, di-t-butyl peroxide,
Dicumyl peroxide, 2,5-dimethyl-2,5-
Dialkyl peroxides such as di(t-butylperoxy)hexane, diacyl peroxides such as lauroyl peroxide and benzoyl peroxide, di-
Peroxydicarbonates such as iso-propyl peroxydicarbonate, dimyristyl peroxydicarbonate, bis(4-t-butylcyclohexyl)peroxydicarbonate, t-butylperoxypivalate, t-butylperoxy- Examples include peroxy esters such as 2-ethylhexanoate and t-butylperoxybenzoate. These can be used alone or in combination of two or more depending on the type of resin and curing conditions.
【0024】本発明においてアリルエステル樹脂には必
要に応じて充填材、補強材、離型剤、着色剤、硬化剤、
促進剤、安定剤等を併用して積層板の性能を一層高める
ことも可能である。In the present invention, the allyl ester resin may contain fillers, reinforcing materials, mold release agents, colorants, curing agents,
It is also possible to use accelerators, stabilizers, etc. in combination to further enhance the performance of the laminate.
【0025】本発明の電気用積層板は公知の方法に従っ
て製造することができる。即ち、メラミン樹脂で予め含
浸乾燥処理した基材に上記アリルエステル樹脂を主成分
とする硬化性樹脂液を含浸し、含浸した基材を複数枚積
層し、片面もしくは両面にあらかじめ接着剤を塗布した
、あるいは塗布しない金属箔を重ね、無圧または加圧下
で加熱、硬化、成形することによって、電気用積層板を
製造することができる。この時、金属箔は含浸積層基材
の硬化成形後、貼りつけてもよい。The electrical laminate of the present invention can be manufactured according to known methods. That is, a base material that had been previously impregnated and dried with a melamine resin was impregnated with a curable resin liquid containing the above-mentioned allyl ester resin as a main component, a plurality of impregnated base materials were laminated, and an adhesive was applied on one or both sides in advance. Alternatively, an electrical laminate can be manufactured by stacking uncoated metal foils and heating, curing, and forming them without pressure or under pressure. At this time, the metal foil may be attached after the impregnated laminated base material is cured and molded.
【0026】金属箔としては、電気回路用銅箔張り積層
板への目的とした電解銅箔が市販されており、これを用
いることが、耐食性、エッチング性、接着性の観点から
好ましいが、本発明においてはこれに限定されるもので
はない。金属箔の厚さは10〜100μm程度が好まし
い。As the metal foil, electrolytic copper foil intended for use in copper foil-clad laminates for electric circuits is commercially available, and it is preferable to use this from the viewpoints of corrosion resistance, etching properties, and adhesion. The invention is not limited to this. The thickness of the metal foil is preferably about 10 to 100 μm.
【0027】金属箔と樹脂含浸基材との接着を効果的に
達成するためには、接着剤を用いることが好ましく、接
着剤としては硬化過程で不必要な副反応生成物の発生し
ない液状もしくは半流動状のものが好ましい。かかる観
点から、アクリレート系接着剤、エポキシ系接着剤、エ
ポキシアクリレート系接着剤、イソシアネート系接着剤
、もしくはこれらの各種変成接着剤が用いられる。In order to effectively achieve adhesion between the metal foil and the resin-impregnated base material, it is preferable to use an adhesive, and the adhesive may be a liquid or adhesive that does not generate unnecessary side reaction products during the curing process. Semi-liquid ones are preferred. From this point of view, acrylate adhesives, epoxy adhesives, epoxy acrylate adhesives, isocyanate adhesives, or various modified adhesives thereof are used.
【0028】本発明の電気用積層板の厚みは、基材の種
類、硬化性樹脂液の組成、積層板の用途によって異なる
が、通常、0.5〜5mmである。また、電気用積層板
中の樹脂組成物の割合は30〜80重量%である。The thickness of the electrical laminate of the present invention varies depending on the type of substrate, the composition of the curable resin liquid, and the use of the laminate, but is usually 0.5 to 5 mm. Further, the proportion of the resin composition in the electrical laminate is 30 to 80% by weight.
【0029】かくして得られる積層板の機械的強度は高
いものの、打ち抜き加工性が不充分であり、プリント配
線板の材料として不適切である。本発明者の検討の結果
積層板の打ち抜き加工性は得られた積層板中の水分量、
すなわち含水率に関係があることがわかった。含水率が
一定値以下であると打ち抜き加工性は低下し、また過剰
であると積層板の他の性能、例えば曲げ強度、半田耐熱
性、絶縁特性等を低下させる。本発明における金属箔張
り積層板において、金属箔を除去した積層板に対しての
含水率が0.1〜5.0重量%、望ましくは0.1〜3
.0重量%の範囲内であることが好ましい。Although the thus obtained laminate has high mechanical strength, its punching workability is insufficient, making it unsuitable as a material for printed wiring boards. As a result of the inventor's study, the punching workability of the laminate is determined by the moisture content in the obtained laminate,
In other words, it was found that there is a relationship with the water content. If the water content is below a certain value, punching workability will be reduced, and if it is excessive, other properties of the laminate, such as bending strength, soldering heat resistance, insulation properties, etc. will be reduced. In the metal foil-clad laminate of the present invention, the water content is 0.1 to 5.0% by weight, preferably 0.1 to 3% by weight, relative to the laminate from which the metal foil has been removed.
.. It is preferably within the range of 0% by weight.
【0030】含水率を調節する方法としては種々の方法
が採用可能であり、特に限定されるものではないが、例
えば、セルロース繊維基材を硬化性樹脂液含浸前に加湿
又は乾燥させておく方法、硬化性樹脂液を硬化前に予め
加湿又は乾燥させておく方法、硬化性樹脂液の硬化時に
加湿又は乾燥させる方法、硬化性樹脂液硬化後に積層板
を加湿又は乾燥させる方法等があげられる。[0030] Various methods can be used to adjust the moisture content, and are not particularly limited. For example, a method in which the cellulose fiber base material is humidified or dried before being impregnated with a curable resin liquid. , a method in which the curable resin liquid is humidified or dried in advance before curing, a method in which the curable resin liquid is humidified or dried during curing, a method in which the laminate is humidified or dried after the curable resin liquid is cured, etc.
【0031】含水率を測定する方法としては種々の方法
があるが、本発明に於ける含水率は、銅箔を除去した積
層板約10×50mm2枚を200℃30分加熱して発
生した水分をカールフィッシャー法にて定量して求めた
ものである。[0031] There are various methods for measuring the moisture content, but the moisture content in the present invention is determined by measuring the moisture generated by heating two laminates of about 10 x 50 mm from which the copper foil has been removed at 200°C for 30 minutes. was determined using the Karl Fischer method.
【0032】以下、本発明を実施例によって詳しく述べ
るが、本発明の要旨を逸脱しない限り、これらの実施例
のみに限定されるものではない。なお、この明細書を通
じて、温度はすべて℃であり、部及び%は特記しない限
り重量基準である。The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples unless it departs from the gist of the present invention. Throughout this specification, all temperatures are in degrees Celsius, and parts and percentages are by weight unless otherwise specified.
【0033】[0033]
製造例1 アリルエステル樹脂(1)の製造蒸留装置
を具備した1リットル反応器に、ジアリルテレフタレー
ト600g(2.44mol)、プロピレングリコール
95.9g(1.26mol),ジブチル錫オキサイド
0.1gを仕込んで窒素気流下で180℃に加熱し、生
成してくるアリルアルコールを留去した。アリルアルコ
ールが140g(2.41mol)留出したところで、
反応器内を50mmHgまで減圧にし留去速度を速めた
。プロピレングリコールと当量のアリルアルコールが留
出した後、反応液を薄膜蒸留器を用いて200℃に維持
しながら1mmHgにおいて未反応のジアリルテレフタ
レートを留出した。反応液をバットにあけ、冷却、粉砕
して粉状のアリルエステル樹脂(1)を得た。Production Example 1 Production of Allyl Ester Resin (1) A 1-liter reactor equipped with a distillation apparatus was charged with 600 g (2.44 mol) of diallyl terephthalate, 95.9 g (1.26 mol) of propylene glycol, and 0.1 g of dibutyltin oxide. The mixture was heated to 180° C. under a nitrogen stream, and the allyl alcohol produced was distilled off. When 140 g (2.41 mol) of allyl alcohol was distilled out,
The pressure inside the reactor was reduced to 50 mmHg to accelerate the distillation rate. After allyl alcohol equivalent to propylene glycol was distilled off, unreacted diallyl terephthalate was distilled off at 1 mmHg while maintaining the reaction solution at 200° C. using a thin film distiller. The reaction solution was poured into a vat, cooled and pulverized to obtain powdered allyl ester resin (1).
【0034】製造例2 臭素含有アリルエステル樹脂
(2)の製造
表1に示した条件を除いてはアリルエステル樹脂(1)
と同様に操作し、臭素含有アリルエステル樹脂(2)を
得た。Production Example 2 Production of Bromine-Containing Allyl Ester Resin (2) Allyl Ester Resin (1) except for the conditions shown in Table 1.
In the same manner as above, a bromine-containing allyl ester resin (2) was obtained.
【0035】[0035]
【表1】[Table 1]
【0036】表1において、「DATP」はジアリルテ
レフタレートを、「DBNPG」はジブロムネオペンチ
ルグリコールを示し、「ハロゲン含有量」は、製品樹脂
中のハロゲン含有量を意味する。In Table 1, "DATP" stands for diallyl terephthalate, "DBNPG" stands for dibromneopentyl glycol, and "halogen content" means the halogen content in the product resin.
【0037】実施例1
メラミン樹脂(日本カーバイド社製ニカレヂンS−30
5)を50%メタノール水溶液に溶解して固形分濃度1
5%の溶液とした。この溶液に坪量155g/m2 、
厚さ300μmのクラフト紙を浸した後、ローラで絞り
、120℃、30分乾燥させた。得られた紙基材にはメ
ラミン樹脂が処理前の紙基材100重量部に対して15
重量部付着した。この紙基材を表2に示した樹脂組成物
の配合液に浮かべ片面より樹脂液を含浸させ、7枚を重
ね合わせ、さらに片面に接着剤付き銅箔(三井金属鉱業
社製MK−61、銅箔坪量300g/m2)を重ね合わ
せ、両面に50μmのポリエステルフィルムを置き、プ
レス機で加熱加圧成形した。Example 1 Melamine resin (Nicaregin S-30 manufactured by Nippon Carbide Co., Ltd.)
5) in a 50% aqueous methanol solution to give a solid content concentration of 1.
A 5% solution was prepared. This solution has a basis weight of 155 g/m2,
After soaking 300 μm thick kraft paper, it was squeezed with a roller and dried at 120° C. for 30 minutes. The obtained paper base material contains 15 parts by weight of melamine resin based on 100 parts by weight of the paper base material before treatment.
Part by weight was attached. This paper base material was floated in a blended solution of the resin composition shown in Table 2, and one side was impregnated with the resin liquid, seven sheets were stacked, and one side was coated with adhesive-coated copper foil (MK-61, manufactured by Mitsui Mining & Mining Co., Ltd.). Copper foils (basis weight 300 g/m2) were stacked one on top of the other, a 50 μm polyester film was placed on both sides, and heat and pressure molding was performed using a press machine.
【0038】加熱加圧条件は150℃、5分、30kg
/cm2 であった。プレス後、熱風乾燥炉中で180
℃、1時間加熱を行なった。さらに温度50℃、相対湿
度90%の恒温恒湿槽中に8時間放置した結果、厚さ1
.6mmの銅箔張り積層板を得た。該銅箔張り積層板の
含水率を測定したところ、銅箔を除去した積層板基準で
2.0%であった。該銅箔張り積層板の試験結果を表3
〜表4に示す。[0038] Heating and pressing conditions were 150°C, 5 minutes, and 30 kg.
/cm2. After pressing, 180℃ in a hot air drying oven.
Heating was performed at ℃ for 1 hour. Furthermore, as a result of being left in a constant temperature and humidity chamber at a temperature of 50°C and a relative humidity of 90% for 8 hours, the thickness of
.. A 6 mm copper foil-clad laminate was obtained. When the moisture content of the copper foil-clad laminate was measured, it was 2.0% based on the laminate with the copper foil removed. Table 3 shows the test results of the copper foil clad laminate.
- Shown in Table 4.
【0039】実施例2、3及び比較例1、2恒温恒湿槽
中に放置した時間を変えた以外は実施例1と同様にして
銅箔張り積層板を得た。該銅箔張り積層板の含水率及び
試験結果を表3〜表4に示す。Examples 2 and 3 and Comparative Examples 1 and 2 Copper foil-clad laminates were obtained in the same manner as in Example 1, except that the time of standing in the constant temperature and humidity chamber was changed. The moisture content and test results of the copper foil-clad laminate are shown in Tables 3 and 4.
【0040】[0040]
【表2】[Table 2]
【0041】[0041]
【表3】[Table 3]
【0042】[0042]
【表4】[Table 4]
【0043】表3において、「含水率」および「樹脂含
有率」は、いずれも銅箔を除去した積層板を基準として
表したものである。また、「曲げ強度」、「半田耐熱性
」および「絶縁抵抗」の試験は、いずれもJIS−C−
6481に準じて行った。In Table 3, "water content" and "resin content" are both expressed based on the laminate from which the copper foil has been removed. In addition, the tests for "bending strength", "soldering heat resistance" and "insulation resistance" are all conducted according to JIS-C-
It was carried out according to 6481.
【0044】表3〜表4の実施例及び比較例の結果から
明らかなように、金属箔を除去した積層板に対しての含
水率が0.1〜5.0重量%の範囲内である積層板は、
打ち抜き加工性、曲げ強度ともに優れていることがわか
る。As is clear from the results of the Examples and Comparative Examples in Tables 3 and 4, the moisture content of the laminates from which the metal foil has been removed is within the range of 0.1 to 5.0% by weight. The laminate is
It can be seen that both punching workability and bending strength are excellent.
【0045】[0045]
【発明の効果】以上説明したように、この発明によれば
、高度な機械的強度を有するとともに優れた打ち抜き加
工性、電気特性を有するアリルエステル樹脂系の電気用
積層板を得ることができる。As explained above, according to the present invention, it is possible to obtain an allyl ester resin-based electrical laminate having high mechanical strength and excellent punching workability and electrical properties.
Claims (1)
アリルエステル樹脂及び金属箔からなる電気用積層板に
おいて、金属箔を除去した積層板に対しての含水率が0
.1〜5.0重量%の範囲内であることを特徴とする電
気用積層板。[Claim 1] A base material mainly composed of cellulose fibers,
In electrical laminates made of allyl ester resin and metal foil, the moisture content of the laminate from which the metal foil has been removed is 0.
.. An electrical laminate characterized in that the content is in the range of 1 to 5.0% by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10876691A JPH04314536A (en) | 1991-04-12 | 1991-04-12 | Electric laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10876691A JPH04314536A (en) | 1991-04-12 | 1991-04-12 | Electric laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04314536A true JPH04314536A (en) | 1992-11-05 |
Family
ID=14492950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10876691A Withdrawn JPH04314536A (en) | 1991-04-12 | 1991-04-12 | Electric laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04314536A (en) |
-
1991
- 1991-04-12 JP JP10876691A patent/JPH04314536A/en not_active Withdrawn
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