JPH04129739A - Preparation of electric laminated sheet - Google Patents
Preparation of electric laminated sheetInfo
- Publication number
- JPH04129739A JPH04129739A JP25289190A JP25289190A JPH04129739A JP H04129739 A JPH04129739 A JP H04129739A JP 25289190 A JP25289190 A JP 25289190A JP 25289190 A JP25289190 A JP 25289190A JP H04129739 A JPH04129739 A JP H04129739A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- melamine resin
- radical curable
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title description 2
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- -1 allyl ester Chemical class 0.000 claims abstract description 33
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000004640 Melamine resin Substances 0.000 claims abstract description 27
- 229920003043 Cellulose fiber Polymers 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract description 16
- 239000000123 paper Substances 0.000 abstract description 13
- 239000011342 resin composition Substances 0.000 abstract description 12
- 239000002904 solvent Substances 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 239000003054 catalyst Substances 0.000 abstract description 4
- 239000002655 kraft paper Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 229920000742 Cotton Polymers 0.000 abstract description 3
- 238000006116 polymerization reaction Methods 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract description 2
- 150000003254 radicals Chemical class 0.000 abstract 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 20
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- 229920006395 saturated elastomer Polymers 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 150000005846 sugar alcohols Polymers 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 150000007513 acids Chemical class 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- 150000007519 polyprotic acids Polymers 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229960004063 propylene glycol Drugs 0.000 description 3
- 230000004580 weight loss Effects 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical compound NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- SHZIWNPUGXLXDT-UHFFFAOYSA-N ethyl hexanoate Chemical compound CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005809 transesterification reaction Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- NIDNOXCRFUCAKQ-UMRXKNAASA-N (1s,2r,3s,4r)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1[C@H]2C=C[C@@H]1[C@H](C(=O)O)[C@@H]2C(O)=O NIDNOXCRFUCAKQ-UMRXKNAASA-N 0.000 description 1
- DJKGDNKYTKCJKD-BPOCMEKLSA-N (1s,4r,5s,6r)-1,2,3,4,7,7-hexachlorobicyclo[2.2.1]hept-2-ene-5,6-dicarboxylic acid Chemical compound ClC1=C(Cl)[C@]2(Cl)[C@H](C(=O)O)[C@H](C(O)=O)[C@@]1(Cl)C2(Cl)Cl DJKGDNKYTKCJKD-BPOCMEKLSA-N 0.000 description 1
- DSPZRAREZHBQMV-UHFFFAOYSA-N (4-butylcyclohexyl) (4-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(CCCC)CCC1OC(=O)OOC(=O)OC1CCC(CCCC)CC1 DSPZRAREZHBQMV-UHFFFAOYSA-N 0.000 description 1
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 1
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- PMUPSYZVABJEKC-UHFFFAOYSA-N 1-methylcyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)CCCCC1C(O)=O PMUPSYZVABJEKC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- CHUGKEQJSLOLHL-UHFFFAOYSA-N 2,2-Bis(bromomethyl)propane-1,3-diol Chemical compound OCC(CO)(CBr)CBr CHUGKEQJSLOLHL-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- ODGCZQFTJDEYNI-UHFFFAOYSA-N 2-methylcyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)C=CCCC1C(O)=O ODGCZQFTJDEYNI-UHFFFAOYSA-N 0.000 description 1
- GCYHRYNSUGLLMA-UHFFFAOYSA-N 2-prop-2-enoxyethanol Chemical compound OCCOCC=C GCYHRYNSUGLLMA-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- XIRDTMSOGDWMOX-UHFFFAOYSA-N 3,4,5,6-tetrabromophthalic acid Chemical compound OC(=O)C1=C(Br)C(Br)=C(Br)C(Br)=C1C(O)=O XIRDTMSOGDWMOX-UHFFFAOYSA-N 0.000 description 1
- WZHHYIOUKQNLQM-UHFFFAOYSA-N 3,4,5,6-tetrachlorophthalic acid Chemical compound OC(=O)C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1C(O)=O WZHHYIOUKQNLQM-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- HSRJKNPTNIJEKV-UHFFFAOYSA-N Guaifenesin Chemical compound COC1=CC=CC=C1OCC(O)CO HSRJKNPTNIJEKV-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Natural products CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 235000015278 beef Nutrition 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- IRVTWLLMYUSKJS-UHFFFAOYSA-N carboxyoxy propyl carbonate Chemical compound CCCOC(=O)OOC(O)=O IRVTWLLMYUSKJS-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- ZOGFXSINZRXABK-UHFFFAOYSA-N chloromethanediol Chemical compound OC(O)Cl ZOGFXSINZRXABK-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 238000009472 formulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- URLKBWYHVLBVBO-UHFFFAOYSA-N p-dimethylbenzene Natural products CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 150000003022 phthalic acids Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- KGKNBDYZZIBZQL-UHFFFAOYSA-N tert-butyl carboxyoxy carbonate Chemical compound CC(C)(C)OC(=O)OOC(O)=O KGKNBDYZZIBZQL-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/045—Reinforcing macromolecular compounds with loose or coherent fibrous material with vegetable or animal fibrous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08J2361/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C08J2361/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気機器、電子機器、通信器等に使用される
電気用積層板及びそれに使用される基材に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrical laminate used in electrical equipment, electronic equipment, communication equipment, etc., and a base material used therein.
従来、電気回路用積層板としては、種々のものが用いら
れているが、セルロース繊維を基材とするものでは、紙
・フェノール系積層板が主として民生用の片面銅張積層
板の分野において使用されている。他の電気回路用積層
板に比べ安価であり、民生用用途としては、市場の大半
を占めているのが現状である。Conventionally, various types of laminates have been used for electrical circuits, but among those based on cellulose fibers, paper/phenolic laminates are mainly used in the field of single-sided copper-clad laminates for consumer use. has been done. It is cheaper than other laminates for electrical circuits, and currently accounts for most of the market for consumer use.
更に近年においては、産業用のOA機器等においても紙
・フェノール系積層板の他、ガラス繊維・エポキシ系積
層板を使用する動きもみられ、より性能の秀れた電気回
路用積層板が、求められてきている。Furthermore, in recent years, there has been a movement to use glass fiber/epoxy laminates in addition to paper/phenol laminates in industrial OA equipment, etc., and there is a growing demand for laminates for electrical circuits with superior performance. It's been getting worse.
しかし、フェ/−ル系樹脂は硬化時の反応副生物の発生
や溶剤の除去の問題があり、一方エボキシ樹脂は上記同
様の溶剤除去の問題がある。However, fer/fer resins have problems with the generation of reaction by-products during curing and removal of solvents, while epoxy resins have the same problems with solvent removal as described above.
以上の樹脂系の他、最近紙・不飽和ポリエステル樹脂系
のものが開発されている。これはラジカル反応で使用し
やすい反面紙基材への親和性が低い、その結果として金
属箔張積層板の電気性能、耐熱性等を落としている。In addition to the above resin systems, paper and unsaturated polyester resin systems have recently been developed. Although it is easy to use in radical reactions, it has low affinity for paper substrates, and as a result, the electrical performance, heat resistance, etc. of the metal foil-clad laminate deteriorates.
上記親和性の問題については基材のメラミン樹脂による
予備処理により解決しようとしているが、特にはんだ耐
熱性の問題などの点で満足のゆくレベルには、達してい
ない。Attempts have been made to solve the above-mentioned affinity problem by pre-treating the base material with melamine resin, but this has not yet reached a satisfactory level, particularly in terms of soldering heat resistance.
本発明者等は、紙基材の予備処理条件を適切にコントロ
ールすることにより、電気的特性にすくれ、且つそのは
んだ耐熱性の格段に改良された電気用積層板を製造する
ことを目的とし検討した。The present inventors have aimed to produce an electrical laminate with excellent electrical properties and significantly improved solder heat resistance by appropriately controlling the pretreatment conditions of the paper base material. investigated.
本発明者等は上記目的を解決するため鋭意研究をした結
果、紙基材のメラミン樹脂処理を特殊な処理条件で行う
ことにより、また、含浸用樹脂としてラジカル硬化性の
樹脂を配合した含浸用樹脂組成物を用いることにより解
決することを見出し本発明を完成した。As a result of intensive research in order to solve the above object, the inventors of the present invention have developed a method for impregnating paper by treating paper base materials with melamine resin under special processing conditions. They discovered that the problem could be solved by using a resin composition and completed the present invention.
即ち、本発明の要旨は、ラジカル硬化性樹脂を用いて電
気用積層板を製造するに際し、120℃での加熱減量が
3%以下であり且つ120℃から190℃の間の加熱減
量が1%〜8%である、メラミン系樹脂か含浸後乾燥さ
れたセルロース繊維を主成分とする基材を用いて行うこ
とを特徴とする製造方法にある。That is, the gist of the present invention is that when producing an electrical laminate using a radical curable resin, the heating loss at 120°C is 3% or less, and the heating loss between 120°C and 190°C is 1%. The manufacturing method is characterized in that it is carried out using a base material whose main component is cellulose fibers impregnated with a melamine resin or dried at a concentration of 8%.
従来、例えば150’Cといった温度での揮発分を規定
した公知例がみられるが、メラミン系樹脂の反応、紙基
材の吸水性という性質を考慮した場合、それだけでは一
義的に決められず不十分である。そこで本発明者らは種
々検討を重ねた結果、120’Cでの加熱による減量値
は、大部分が紙及びメラミン系樹脂中に含まれる水及び
溶剤によるものであり、190℃加熱時の減量値は、メ
ラミン系樹脂の縮合反応によるものであることが判明し
た。Conventionally, there are known examples that specify the volatile content at a temperature of 150'C, for example, but when considering the reaction of melamine resin and the water absorption properties of the paper base material, it cannot be determined unambiguously and is unreasonable. It is enough. As a result of various studies, the inventors of the present invention found that the weight loss value due to heating at 120'C is mostly due to water and solvent contained in the paper and melamine resin, and the weight loss value when heated at 190°C. It was found that the value was due to a condensation reaction of melamine resin.
本発明は、ラジカル硬化性樹脂を用いる電気用積層板の
製造に際して、該メラミン系樹脂で処理された紙基材の
120℃,190’Cの加熱減量を別々の意味を持つ加
熱減量として制御することにより、はんた耐熱性の格段
の向上がはかられたものである。The present invention controls the heating loss at 120° C. and 190'C of the paper base material treated with the melamine resin as heating loss having different meanings when manufacturing an electrical laminate using a radical curable resin. As a result, the solder heat resistance has been significantly improved.
以下、本発明の内容を詳細に説明する。Hereinafter, the content of the present invention will be explained in detail.
(A)主成分がセルロース繊維である基材。(A) A base material whose main component is cellulose fiber.
本発明において用いられる基材の代表例としては、クラ
フト紙、コツトン・リンター紙、綿布等が挙げられる。Typical examples of the base material used in the present invention include kraft paper, cotton linter paper, cotton cloth, and the like.
最も一般的には晒クラフト紙が用いられるが、これに限
定されるものではない。Bleached kraft paper is most commonly used, but is not limited to this.
(B)メラミン系樹脂
メラミン系樹脂は、初期縮合物をメタノール、水等の溶
媒に溶かしセルロース繊維基材に対し、浸漬処理し付着
させる方法が一般的であるが、予めセルロース繊維をメ
ラミン系樹脂で処理したものを基材として加工してもよ
い。(B) Melamine resin Melamine resin is generally produced by dissolving an initial condensate in a solvent such as methanol or water and applying it to a cellulose fiber base material by dipping it. The treated material may be used as a base material.
本発明において、メラミン系樹脂が含浸、乾燥されたセ
ルロース繊維を主成分とする基材の加熱減量は、120
℃においては3%以下であり好ましくは、2%以下であ
る。且つ120℃から190′Cにおいては1%〜8%
、好ましくは2%〜6%である。120℃における加熱
減量が3%を越えると十分なはんだ耐熱性が得られず、
120℃から190℃の間における加熱減量が8%を越
えた場合も同様である。また120℃から190 ’C
の間における加熱減量が1%に達しない場合は積層板の
製造の際にふくれや層剥離が発生する。メラミン樹脂の
乾燥の際の縮合反応の進みすぎにより含浸樹脂組成物と
の親和性が低下しているためと想われる。In the present invention, the heating loss of the base material mainly composed of cellulose fibers impregnated with melamine resin and dried is 120
℃, it is 3% or less, preferably 2% or less. and 1% to 8% from 120°C to 190'C
, preferably 2% to 6%. If the heating loss at 120°C exceeds 3%, sufficient soldering heat resistance cannot be obtained.
The same applies when the loss on heating between 120°C and 190°C exceeds 8%. Also from 120℃ to 190'C
If the heat loss during heating does not reach 1%, blistering or delamination will occur during the production of the laminate. This is thought to be because the condensation reaction progresses too much during drying of the melamine resin, resulting in a decrease in affinity with the impregnated resin composition.
本発明でいう加熱減量は以下の算式により求められる。The heating loss referred to in the present invention is determined by the following formula.
また、それぞれの加熱条件は、120’Cにおいては1
0分間、更に190℃においては20分間であり、秤量
はそれぞれ加熱直後に行う。In addition, each heating condition is 1 at 120'C.
0 minutes, and further 20 minutes at 190° C., and weighing is performed immediately after heating.
またここで加熱前における該メラミン系樹脂処理基材は
ラジカル硬化性樹脂組成物の含浸直前のものを採取する
こととする。Moreover, the melamine resin-treated base material before heating is taken from the base material just before impregnation with the radical curable resin composition.
以下、一般式にて表わすと以下の通りである。The general formula below is as follows.
−bb−c
X= X100 Y=
xlOOa
bX:120℃での加熱減量(重量%)
Y:120℃から190℃の間の加熱減量(重量%)
a:加熱前の該処理基材の重!(g)
b:]20’C加熱後の該処理基材の重量(g)c:1
90’c加熱後の該処理基材の重jl (g)このよう
に加熱減量のフントロールされた該メラミン系樹脂処理
基材を用いて行うことにより電気特性が良好で且つ格段
にはんだ耐熱性の良好な電気用積層板が得られる。-bb-c X= X100 Y=
xlOOa
bX: Loss on heating at 120°C (wt%) Y: Loss on heating between 120°C and 190°C (wt%) a: Weight of the treated substrate before heating! (g) b: ] Weight of the treated substrate after heating at 20'C (g) c: 1
Weight of the treated base material after heating at 90'c (g) By using the melamine resin treated base material that has undergone heat loss control in this way, it has good electrical properties and significantly improved soldering heat resistance. An electrical laminate with good quality can be obtained.
本発明に用いられるメラミン系樹脂とは、メラミンとホ
ルムアルデヒドの縮合物、その縮合物をメタ/−ル等の
低級アルコールでアルコ牛ン化したもの、更にはそれら
の持つメチロール基と縮合可能な基を持つ脂肪族誘導体
を反応もしくは混合させたものをいう。例えばN−メチ
ロールメラミン、メトキシ化N−メチロールメラミンに
対し、2−ヒドロ+7エチル(メタ)アクリレート、グ
リ/ジル(メタ)アクリレート、エチレングリコールモ
ノアリルエーテル、ポリエチレングリコールモノ (メ
タ)アクリレート、ポリプロピレングリフールモノ (
メタ)アクリレート、グリセリンシアrノルエーテル、
メタクリル酸、N−メチロールアクリルアミド等を反応
もしくは混合させたものが挙げられるが、使用可能なも
のは、これに限定されない。これらメラミン系樹脂の付
着量は、セルロース繊維を主成分とする基材ioo’を
置部に対し、5〜30重量部である。5重量部未満では
、作成される積層板の吸水率が高く、30M重部を越え
ると、積層板の衝撃強度が低下する。The melamine resin used in the present invention refers to a condensate of melamine and formaldehyde, a condensate obtained by converting the condensate with a lower alcohol such as methanol, and a group capable of condensing with a methylol group that they have. Refers to a reaction or mixture of aliphatic derivatives with For example, for N-methylolmelamine, methoxylated N-methylolmelamine, 2-hydro+7 ethyl (meth)acrylate, glyc/zyl (meth)acrylate, ethylene glycol monoallyl ether, polyethylene glycol mono (meth)acrylate, polypropylene glycol. Things (
meth)acrylate, glycerin shear norether,
Examples include those obtained by reacting or mixing methacrylic acid, N-methylolacrylamide, etc., but usable substances are not limited thereto. The amount of these melamine-based resins attached is 5 to 30 parts by weight based on the base material ioo' whose main component is cellulose fiber. If it is less than 5 parts by weight, the water absorption rate of the produced laminate will be high, and if it exceeds 30 M parts by weight, the impact strength of the laminate will decrease.
(C)ラジカル硬化性樹脂
本発明にいうラジカル硬化性樹脂とは、不飽和結合を有
する化合物が、熱、光または、触媒などによって生ずる
フリーラジカルによって連鎖的に重合することにより硬
化する樹脂をさし、例えば、不飽和ポリエステル樹脂、
ビニルエステル樹脂、ジアリルフタレート樹脂、アリル
エステル樹脂等をいう。(C) Radical curable resin The radical curable resin referred to in the present invention refers to a resin that is cured by chain polymerization of a compound having an unsaturated bond by free radicals generated by heat, light, or a catalyst. For example, unsaturated polyester resin,
Refers to vinyl ester resin, diallyl phthalate resin, allyl ester resin, etc.
上記アリルエステル樹脂とは飽和多塩基酸と飽和多価ア
ルコールより構成されてなる飽和ポリエステルの末端に
アリルエステル基を有する樹脂をいう。The above-mentioned allyl ester resin refers to a resin having an allyl ester group at the end of a saturated polyester composed of a saturated polybasic acid and a saturated polyhydric alcohol.
飽和多塩基酸としては、例えば二塩基酸としてオルソフ
タル酸、オルソフタル酸無水物、インフタル酸、テレフ
タル酸等のフタル酸類、テトラヒドロフタル酸、メチル
テトラヒドロフタル酸、エンドメチレンテトラヒドロフ
タル酸、メチルエンドメチレンテトラヒドロフタル酸、
ヘキサヒドロフタル酸、メチルへキサヒドロフタル酸、
及びそれらの酸無水物等のヒドロフタル酸類、マロン酸
、コハク酸、グルタル酸、アジピン酸等の脂肪族二塩基
酸、テトラブロムフタル酸、テトラクロルフタル酸、ク
ロレンド酸、及びこれらの酸無水物等のハロゲン化二塩
基酸があげられる。酸官能以上の多塩基酸としてはトリ
メリット酸、ピロメリ。Examples of saturated polybasic acids include dibasic acids such as orthophthalic acid, orthophthalic anhydride, inphthalic acid, phthalic acids such as terephthalic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, endomethylenetetrahydrophthalic acid, and methylendomethylenetetrahydrophthalic acid. acid,
Hexahydrophthalic acid, methyl hexahydrophthalic acid,
and hydrophthalic acids such as their acid anhydrides, aliphatic dibasic acids such as malonic acid, succinic acid, glutaric acid, adipic acid, tetrabromophthalic acid, tetrachlorophthalic acid, chlorendic acid, and acid anhydrides thereof, etc. Examples include halogenated dibasic acids. Trimellitic acid and pyromelli are polybasic acids with higher acid functionality.
ト酸及びそれらの酸無水物があげられる。これらは、単
独でもまたは混合しても用いることができる。Examples include toric acids and their acid anhydrides. These can be used alone or in combination.
飽和多価アルコールとしては、エチレングリコール、1
,2−プロピレングリコール、1,4−ブタンジオール
、】+ 6−ヘキサンジオール、ネオペンチルグリコー
ル、1,4−7クロヘ牛サンジメタツール、パラキシレ
ングリコール等の脂肪族、脂環族または芳香族を含んだ
二価のアルフールの他、一般式HO(CHRCH、○)
。H(RはHまたはCsHtm*+、mは1〜5の整数
、nは2〜10の整数)であられされるエチレンオキサ
イド、プロピレンオキサイド等のフルキレンオキサイド
の付加反応によって得られる二価のアルコールがあげら
れる。三価以上の多価アルコールとしては、例えばグリ
セリン、トリメチロールプロパン等の脂肪族の三価のア
ルコールやペンタエリスリトール、ソルビトール等の四
価以上のアルコールがあげられる。また、ジグ0モネオ
ベンチルグリコール、テトラブロモビスフェノールAエ
チレンオキサイド付加物のようなハロゲン原子を含む脂
肪族、脂環族または芳香族のハロゲン化多価アルコール
があげられる。これらは、単独でもまたは混合しても用
いることができる。Saturated polyhydric alcohols include ethylene glycol, 1
, 2-propylene glycol, 1,4-butanediol, ] + 6-hexanediol, neopentyl glycol, 1,4-7 chloromethane diol, paraxylene glycol, etc., aliphatic, alicyclic or aromatic In addition to the divalent alfur containing, the general formula HO (CHRCH, ○)
. A dihydric alcohol obtained by the addition reaction of fullylene oxide such as ethylene oxide or propylene oxide, which is prepared by H (R is H or CsHtm**, m is an integer of 1 to 5, and n is an integer of 2 to 10). can be given. Examples of trihydric or higher polyhydric alcohols include aliphatic trihydric alcohols such as glycerin and trimethylolpropane, and tetrahydric or higher alcohols such as pentaerythritol and sorbitol. Further examples include aliphatic, alicyclic or aromatic halogenated polyhydric alcohols containing a halogen atom, such as Zig0 moneobentyl glycol and tetrabromobisphenol A ethylene oxide adduct. These can be used alone or in combination.
アリルエステル樹脂の製造法は既に公知であり、例えば
特願昭63−262217号に述べられている。例えば
、アリルエステル樹脂はジアリルテレフタレートのよう
な飽和二塩基酸のジアリルエステルと飽和多価アルコー
ルとをエステル交換触媒と共に反応器に仕込みアリルア
ルコールを留出させながら反応させ製造される。工業的
に更に有効な方法としては、ジアリルテレフタレートの
代わりにジメチルテレフタレートのような飽和二塩基酸
のジアルキルエステルをアリルアルコール、多価アルコ
ール及びエステル交換触媒と共に反応器に仕込み、メタ
ノール等の副生ずるアルコールを留出させながら反応さ
せて得ることができる。The method for producing allyl ester resins is already known and is described, for example, in Japanese Patent Application No. 63-262217. For example, an allyl ester resin is produced by charging a diallyl ester of a saturated dibasic acid such as diallyl terephthalate and a saturated polyhydric alcohol together with a transesterification catalyst into a reactor and reacting the allyl alcohol while distilling off the allyl alcohol. A more industrially effective method is to charge a dialkyl ester of a saturated dibasic acid, such as dimethyl terephthalate, in place of diallyl terephthalate, together with allyl alcohol, polyhydric alcohol, and a transesterification catalyst, to remove by-produced alcohols such as methanol. It can be obtained by reacting while distilling off.
また、反応温度によってはハイドロ牛/ンのような重合
禁止剤を反応液中に共存させてもよい。このようにして
飽和ポリエステルの末端にアリルエステル基を有するア
リルエステル樹脂を製造することができる。Further, depending on the reaction temperature, a polymerization inhibitor such as hydrochloride may be allowed to coexist in the reaction solution. In this way, an allyl ester resin having an allyl ester group at the end of a saturated polyester can be produced.
本発明に使用できるアリルエステル樹脂の種類は、一種
類でも二種類以上混合してもよい。飽和多塩基酸と飽和
多価アルコールの種類を種々選択することによって、耐
熱性、電気特性等のバランスの良い積層板を得ることが
できる。The types of allyl ester resins that can be used in the present invention may be one type or a mixture of two or more types. By selecting various types of saturated polybasic acid and saturated polyhydric alcohol, a laminate with a good balance of heat resistance, electrical properties, etc. can be obtained.
本発明において積層板を製造するにあたり、上記ラジカ
ル硬化性樹脂と共にラジカル重合可能な架橋性モノマー
を使用することかでき、公知のものはいずれも使用可能
であるが、例えば、ジアリルオルソフタレート、ジアリ
ルイソフタレート、ジアリルテレフタレートのようなジ
アリルフタレート類、スチレン、α−メチルスチレン、
p−メチルスチレン、p−クロルスチレン、ブロムスチ
レン、ジビニルベンゼン、のような置換スチレン類、(
メタ)アクリル酸メチル、(メタ)アクリル酸エチル、
(メタ)アクリル酸ブチル、(メタンアクリル酸2−エ
チルヘキシル、(メタ)アクリル酸ラウリル、(メタ)
アクリル酸ベンジル、フロム化フェニル(メタ)アクリ
ル酸エステルのようなアクリル酸またはメタアクリル酸
エステル類、エチレングリフールジ(メタ)アクリレー
ト、1゜4−ブタンジオールジ(メタ)アクリレート、
トリメチロールプロパントリ (メタ)アクリレート、
ノアクリル化イソシアヌレート、ペンタエリスリトール
トリ (メタ)アクリレート、ペンタエリスリトールテ
トラ (メタ)アクリレート、グリセリンジ(メタ)ア
クリレート、ネオペンチルグリコールジ(メタ)アクリ
レート、ビスフェノールAジ(メタ)アクリレート等の
ビニル多官能アクリル酸またはメタクリル酸エステル類
、ポリウレタン(メタ)アクリレート、ポリエーテル(
メタ)アクリレート、エピクロルヒドリン変性ビスフェ
ノールAジ(メタ)アクリレート、ポリエチレングリコ
ールジ(メタ)アクリレート、ボリブロビレングリコー
ルジ(メタ)アクリレート等のビニル多官能オリゴエス
テル類が含まれる。In producing the laminate in the present invention, a radically polymerizable crosslinking monomer can be used together with the above-mentioned radical curable resin, and any known ones can be used, but for example, diallyl orthophthalate, diallyl iso phthalate, diallyl phthalates such as diallyl terephthalate, styrene, α-methylstyrene,
Substituted styrenes such as p-methylstyrene, p-chlorostyrene, bromstyrene, divinylbenzene, (
Methyl acrylate, ethyl (meth)acrylate,
Butyl (meth)acrylate, (2-ethylhexyl methaneacrylate, lauryl (meth)acrylate, (meth)
Acrylic acid or methacrylic acid esters such as benzyl acrylate, fromated phenyl (meth)acrylic ester, ethylene glyfur di(meth)acrylate, 1゜4-butanediol di(meth)acrylate,
trimethylolpropane tri(meth)acrylate,
Vinyl polyfunctionals such as noacrylated isocyanurate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, glycerin di(meth)acrylate, neopentyl glycol di(meth)acrylate, bisphenol A di(meth)acrylate, etc. Acrylic acid or methacrylic esters, polyurethane (meth)acrylate, polyether (
Vinyl polyfunctional oligoesters such as meth)acrylate, epichlorohydrin-modified bisphenol A di(meth)acrylate, polyethylene glycol di(meth)acrylate, and polybrobylene glycol di(meth)acrylate are included.
架橋性モノマーは目的に応じて二種類またはそれ以上を
組み合わせて用いても何ら差しつかえ無い。本発明にお
いて架橋性モノマーを配合すると、本来固形もしくは粘
稠な液体であるラジカル硬化性樹脂の粘度を下げること
ができ、かつ溶剤等を使用したプリプレグ状態を経るこ
となく、積層板の製造工程を簡略化することができる。There is no problem in using two or more types of crosslinking monomers in combination depending on the purpose. In the present invention, by blending a crosslinking monomer, the viscosity of the radical curable resin, which is originally a solid or viscous liquid, can be lowered, and the manufacturing process of the laminate can be improved without going through the prepreg state using a solvent or the like. It can be simplified.
本発明におけるラジカル硬化性樹脂組成物は汎用の有機
過酸化物を用いて硬化させることができ、有機過酸化物
と共にまたは単独で、光に感応する重合開始剤や放射線
、電子線に感応する重合開始剤等の、公知の重合開始剤
も利用できる。The radical curable resin composition of the present invention can be cured using a general-purpose organic peroxide, and can be used together with an organic peroxide or alone for polymerization initiators sensitive to light, radiation, and electron beams. Known polymerization initiators such as initiators can also be used.
有機過酸化物としては、例えば、メチルエチルケトンパ
ーオキサイド、アセチルアセトンバーオキサイド等のケ
トンパーオキサイド類、1,1ビス(t−ブチルパーオ
キシ)3,3.5−1リメチルシクロへ牛サン、n−ブ
チル−4,4−ビス(t−7’チルパーオキシ)バレレ
ート等のパーオキシケタール類、t−ブチルハイドロパ
ーオキサイド、クメンハイドロパーオキサイド、p−メ
ンタンハイドロパーオキサイド等のハイドロパーオキサ
イド類、ジ−t−ブチルパーオキサイド、ジクミルパー
オキサイド、2,5−ジメチル−25−ジ(t−ブチル
パーオキシ)へ牛サン等のジアルキルパーオキサイド類
、ラウロイルパーオキサイド、ベンゾイルパーオキサイ
ド等のジアシルバーオキサイド類、ジー1so−プロピ
ルパーオキシジカーボネート、ジミリスチルバーオキン
ジカーボネート、ビス(4−1−ブチルシクロヘキシル
)パーオキシジカーボネート等のパーオキ/ジカーボネ
ート類、t−プチルバーオキシジビパレート、t−ブチ
ルパーオキ/−2−エチルヘキサノエート、t−ブチル
パーオキ/ベンゾエート等のバーオキンエステル類かあ
げられる。これらは一種類または二種類以上混合して、
樹脂の種類、硬化条件に応じて用いることができる。Examples of organic peroxides include ketone peroxides such as methyl ethyl ketone peroxide and acetylacetone peroxide, 1,1 bis(t-butylperoxy) 3,3,5-1-limethylcyclohexane, and n-butyl- Peroxy ketals such as 4,4-bis(t-7' tylperoxy)valerate, hydroperoxides such as t-butyl hydroperoxide, cumene hydroperoxide, p-menthane hydroperoxide, di-t-butyl Peroxide, dicumyl peroxide, 2,5-dimethyl-25-di(t-butylperoxy), dialkyl peroxides such as beef san, diasilver oxides such as lauroyl peroxide and benzoyl peroxide, di-1so - Peroxy/dicarbonates such as propylperoxydicarbonate, dimyristylbaroxydicarbonate, bis(4-1-butylcyclohexyl)peroxydicarbonate, t-butylperoxydiviparate, t-butylperoxydicarbonate/-2- Veroxine esters such as ethylhexanoate and t-butyl peroxy/benzoate can be mentioned. These can be one type or a mixture of two or more types,
It can be used depending on the type of resin and curing conditions.
本発明において樹脂組成物には必要に応じて充填材、補
強材、離型剤、着色剤、硬化促進剤、安定剤等を併用し
て積層板の性能を一層高めることも可能である。In the present invention, fillers, reinforcing materials, mold release agents, colorants, curing accelerators, stabilizers, etc. may be used in combination with the resin composition as necessary to further enhance the performance of the laminate.
本発明の樹脂組成物は公知方法によって積層板の製造に
使用することができる。The resin composition of the present invention can be used to produce laminates by known methods.
(D)積層板の作成
セルロース系基材はまずメラミン樹脂溶液により含浸処
理される。(D) Preparation of Laminate A cellulose base material is first impregnated with a melamine resin solution.
メラミン樹脂含有量の調節はメラミン樹脂の溶剤希釈の
度合によりあるいは溶剤の種類を適宜選択することによ
り行う。また浸漬後スペーサーを通し、液の絞りの度合
により調節する方法もとりうる。メラミン樹脂加熱減量
の調節は、メラミン樹脂浸漬後の乾燥条件により自由に
なしうるが、通常は熱風乾燥炉中を所定の時間通すこと
により完了する。The melamine resin content is adjusted by adjusting the degree of dilution of the melamine resin with a solvent or by appropriately selecting the type of solvent. It is also possible to adjust the degree of squeezing of the liquid by passing it through a spacer after immersion. The weight loss on heating of the melamine resin can be adjusted freely by changing the drying conditions after immersion in the melamine resin, but it is usually completed by passing the melamine resin through a hot air drying oven for a predetermined period of time.
ここで該処理基材を乾燥工程後、すくにラジカル硬化性
樹脂組成物の含浸を行なわず室内に保存した場合、急速
に大気中の水分を吸収し、120℃の乾燥減量が増加し
、当発明の目的を逸脱することになる。本発明において
は具体的には、該処理基材を乾燥後、水分を吸収しない
うちに、含浸を行なうことあるいは、吸水させてしまっ
た場合は、再乾燥により吸水分をとばした後、含浸を行
なうことが重要である。If the treated substrate is stored indoors without being impregnated with the radical curable resin composition immediately after the drying process, it will rapidly absorb moisture from the atmosphere and its loss on drying at 120°C will increase. This would deviate from the purpose of the invention. Specifically, in the present invention, after drying the treated substrate, impregnation is performed before moisture is absorbed, or if water has been absorbed, impregnation is carried out after drying the treated substrate to remove the moisture absorption. It is important to do so.
メラミン系樹脂を含浸した基材に、含浸用樹脂組成物を
含浸させる方法は、特に限定されず、樹脂組成物が基材
に均一に含浸されればよい。次に樹脂組成物が含浸され
た基材を必要枚数、所望厚みに応じ積層し、加熱しなが
ら圧着することにより、積層板が得られる。この方法に
ついても特に限定はされず、通常用いられるバッチプレ
ス法、連続的に加熱炉を通し、硬化させる方法等が利用
できる。The method of impregnating the base material impregnated with the melamine resin with the resin composition for impregnation is not particularly limited, and it is sufficient that the base material is uniformly impregnated with the resin composition. Next, the required number of base materials impregnated with the resin composition are laminated according to the desired thickness, and the laminated plates are obtained by pressing the base materials while heating. This method is not particularly limited either, and a commonly used batch press method, a method of continuously passing through a heating furnace and curing, etc. can be used.
加熱条件は通常8O−IBO’Cで約10分〜60分で
あるが、硬化剤の選択により、更に、低温、短時間でも
成型可能であり、製造条件にあわせ考慮すればよい。ま
た、必要に応じ、後硬化も可能である。The heating conditions are usually 8O-IBO'C for about 10 to 60 minutes, but depending on the selection of the curing agent, it is also possible to mold at lower temperatures and for shorter times, which may be considered in accordance with the manufacturing conditions. Further, post-curing is also possible if necessary.
また、通常の紙糸積層板は、銅張が主である。Further, ordinary paper yarn laminates are mainly copper-clad.
従って、上記の加熱、圧着の際に、同時に銅箔を貼りあ
わせるか、あるいは、予め硬化済みの積層板に銅箔を貼
りあわせることにより、銅張積層板が得られる。Therefore, a copper-clad laminate can be obtained by simultaneously bonding a copper foil during the above-mentioned heating and pressure bonding, or by bonding a copper foil to a pre-cured laminate.
近年においては、アディティヴ回路用として銅箔を貼り
あわせていない積層板の需要も増加しているが、本発明
は、何ら制限を加えるものではなく、応用できる。In recent years, there has been an increase in demand for laminates for additive circuits that are not bonded with copper foil, but the present invention is applicable without any limitations.
以下、実施例によって本発明を更に詳しく説明するが、
本発明の要旨を逸脱しない限り、これらの実施例のみに
限定されるものではない。Hereinafter, the present invention will be explained in more detail with reference to Examples.
The invention is not limited to these examples unless it departs from the gist of the invention.
製造例1 アリルエステル樹脂(1)の製造蒸留装置を
具備した11の反応器に、ジアリルテレフタレート60
0g (2,44mob) 、プロピレングリコール9
5.9g (1,26■0I2)、ジブチル錫オキサイ
ド0.1gを仕込んで窒素気流下で180℃に加熱し、
生成してくるアリルアルコールを留去した。アリルアル
コールが140g (2,41mof2)留出したとこ
ろで、反応器内を50 mmHgまで減圧にし留去速度
を求めた。プロピレングリコールと当量のアリルアルコ
ールが留出した後、反応液を薄膜蒸留器を用いて200
℃に維持しながら1 @shにおいて未反応のジアリル
テレフタレートを留出した。反応液をバットにあ・け、
冷却、粉砕して粉状のアリルエステル樹脂(1゛)を得
た。Production Example 1 Production of allyl ester resin (1) Diallyl terephthalate 60 was added to 11 reactors equipped with a distillation apparatus.
0g (2,44mob), propylene glycol 9
5.9g (1,26■0I2) and 0.1g of dibutyltin oxide were charged and heated to 180°C under a nitrogen stream.
Allyl alcohol produced was distilled off. When 140 g (2,41 mof2) of allyl alcohol had been distilled off, the pressure inside the reactor was reduced to 50 mmHg and the distillation rate was determined. After allyl alcohol in an amount equivalent to propylene glycol was distilled off, the reaction solution was distilled to 200 ml using a thin film distiller.
Unreacted diallyl terephthalate was distilled off at 1 @sh while maintaining the temperature at °C. Pour the reaction solution into a vat,
The mixture was cooled and pulverized to obtain a powdery allyl ester resin (1゛).
製造例2 臭素を含有するアリルエステル樹脂(2)の
製造
第1表に示した条件を除いてはアリルエステル樹脂(1
)と同様に操作し、臭素を含有するアリルエステル樹脂
(2)を得た。Production Example 2 Production of allyl ester resin (2) containing bromine Except for the conditions shown in Table 1, allyl ester resin (1
) to obtain a bromine-containing allyl ester resin (2).
実施 1〜5 び比較 1〜3
秤量155 gem”、厚さ300μ■のクラフト紙を
メラミン樹脂(日本カーバイド社製S−305)の水−
メタノール溶液に浸して風乾後、熱風乾燥機により乾燥
させ、第2表に示すように種々の加熱減量値を持つメラ
ミン処理基材を得た。なおりラフト紙100重量部に対
するメラミン樹脂の付着量は20重量部であった。これ
らの基材を乾燥直後、水分を吸収しない内に第2表に示
したアリルエステル樹脂組成物の配合液中に浸漬した。Implementation 1 to 5 and Comparison 1 to 3 Kraft paper with a weight of 155 gem" and a thickness of 300 μ" was mixed with melamine resin (S-305 manufactured by Nippon Carbide Co., Ltd.) in water.
After soaking in a methanol solution and air drying, it was dried in a hot air dryer to obtain melamine-treated substrates having various heat loss values as shown in Table 2. The amount of melamine resin adhered to 100 parts by weight of Naori raft paper was 20 parts by weight. Immediately after drying, these substrates were immersed in the formulation of the allyl ester resin composition shown in Table 2 before absorbing moisture.
但し比較例2及び3は、乾燥後5時間室内に放置後浸漬
した。樹脂液を含浸させ、7枚を重ねあわせ片面に接着
剤付銅箔(三井金属鉱業製MK−61)を重ね、更に両
面に50μmのポリエステルフィルムを重ね合わせた後
、プレス機で加熱、加圧成型した。その条件は160℃
−5分−30kg/cm”であった。プレス後、熱風乾
燥炉中で170℃−15分加熱を行い、厚さ1.611
I11+の銅張積層板を得た。該銅張積層板の物性測定
結果を第3表に示す。However, in Comparative Examples 2 and 3, the samples were left indoors for 5 hours after drying and then immersed. After impregnating with resin liquid and stacking 7 sheets, adhesive-coated copper foil (MK-61 manufactured by Mitsui Mining and Mining Co., Ltd.) is layered on one side, and 50 μm polyester film is layered on both sides, heat and pressure are applied using a press machine. Molded. The conditions are 160℃
-5 minutes - 30 kg/cm''. After pressing, it was heated at 170°C for 15 minutes in a hot air drying oven, and the thickness was 1.611 mm.
A copper-clad laminate of I11+ was obtained. Table 3 shows the results of measuring the physical properties of the copper-clad laminate.
第1表
アリルエステル樹脂製造の仕込み原料
DATP ニ
ジアリルテレフタレート
DBNPG : ’;フ゛ロムネオペンチルグリコール
* 1
製品樹脂中のハロゲン含有量
第3表の結果から明らかなように、本発明で得られた電
気用積層板は、はんだ耐熱性が非常に優秀であり、しか
も電気的特性も良好であることがわかる。Table 1 Raw material for allyl ester resin production DATP Nidialyl terephthalate DBNPG: ';Flamneopentyl glycol*1 Halogen content in product resin As is clear from the results in Table 3, the electrical grade obtained by the present invention It can be seen that the laminate has excellent solder heat resistance and also has good electrical properties.
以上説明したように、本発明によれば電気的特性が良好
で、はんだ耐熱性が格段に改良された電気用積層板を製
造することができる。As explained above, according to the present invention, it is possible to manufacture an electrical laminate having good electrical characteristics and significantly improved soldering heat resistance.
Claims (2)
するに際し、120℃での加熱減量が3%以下であり且
つ120℃から190℃の間の加熱減量が1%〜8%で
ある、メラミン系樹脂が含浸後乾燥されたセルロース繊
維を主成分とする基材を用いて行うことを特徴とする電
気用積層板の製造方法。(1) When manufacturing an electrical laminate using a radical curable resin, the loss on heating at 120°C is 3% or less, and the loss on heating between 120°C and 190°C is 1% to 8%. A method for producing an electrical laminate, characterized in that the method is carried out using a base material whose main component is cellulose fiber impregnated with a melamine resin and then dried.
る請求項第一項記載の電気用積層板の製造方法。(2) The method for manufacturing an electrical laminate according to claim 1, wherein the radical curable resin is an allyl ester resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25289190A JPH04129739A (en) | 1990-09-21 | 1990-09-21 | Preparation of electric laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25289190A JPH04129739A (en) | 1990-09-21 | 1990-09-21 | Preparation of electric laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04129739A true JPH04129739A (en) | 1992-04-30 |
Family
ID=17243605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25289190A Pending JPH04129739A (en) | 1990-09-21 | 1990-09-21 | Preparation of electric laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04129739A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007110660A1 (en) * | 2006-03-25 | 2007-10-04 | Building Research Establishment Ltd | Process for making composite products |
-
1990
- 1990-09-21 JP JP25289190A patent/JPH04129739A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007110660A1 (en) * | 2006-03-25 | 2007-10-04 | Building Research Establishment Ltd | Process for making composite products |
GB2449833A (en) * | 2006-03-25 | 2008-12-03 | Building Res Establishment Ltd | Process for making composite products |
GB2449833B (en) * | 2006-03-25 | 2010-11-24 | Building Res Establishment Ltd | Process for making composite products |
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